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Infineon Technologies S29GL512S11DHA013

Part No.:
S29GL512S11DHA013
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL512S11DHA013.pdf
Description:
IC FLASH 512MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,294

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Product details

Overview

S29GL512S11DHA013 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial control and automotive ECUs.

For engineers reviewing the S29GL512S11DHA013 datasheet, S29GL512S11DHA013 pinout, S29GL512S11DHA013 application, or S29GL512S11DHA013 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–VCC), OTP array, and AEC-Q100 Grade 2 qualification (–40°C to +105°C).

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supports XIP-capable page-mode reads (32-byte aligned pages), and embeds an on-die algorithm controller for autonomous program/erase operations. Its status monitoring uses RY/BY# pin, data polling, and status register read-enabling deterministic timing control in real-time systems.

The internal architecture includes dedicated erase voltage and programming voltage generators, hardware ECC logic covering all array sectors, and dual-mode sector protection (volatile/non-volatile). The 1024-byte OTP array is split into two lockable regions for secure configuration or calibration data storage.

Key Specifications

ParameterValue and Actual Design Meaning
Density512 Mb (64 MB); supports full firmware image storage for mid-tier microcontrollers
InterfaceParallel ×16 asynchronous; enables direct CPU bus connection without translation logic
Random Access Time100 ns at VCC = VIO; meets real-time boot latency requirements for industrial PLCs
Page Access Time15 ns; accelerates sequential instruction fetch during XIP execution
Write Buffer Size512 bytes; reduces effective programming time by batching up to 256 words per command
Erase GranularityUniform 128 kB sectors; simplifies firmware update partitioning and wear leveling
Data Retention20 years; ensures long-term reliability in unpowered automotive modules
Endurance100,000 program/erase cycles; supports field firmware updates over product lifetime

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), JEDEC standard MO-141AC, body size 18.4 mm × 10.16 mm, 0.5 mm pitch.

Pin/TerminalCircuit RoleDesign Meaning
A0–A24Address inputsWord-aligned address bus (A24 = MSB); supports 32 MB address space for 512 Mb density
DQ0–DQ15Data I/O16-bit bidirectional data bus; compatible with ARM Cortex-M7/M4 and Power Architecture buses
CE#Chip enableActive-low device select; enables low-power standby when deasserted
OE#Output enableControls data bus drivers during read; decouples read timing from CE# assertion
WE#Write enableInitiates write/program commands; latches address and data on falling edge
RY/BY#Ready/Busy indicatorOpen-drain output signaling active embedded operation (program/erase)
WP#Write protectHardware sector lock override; prevents accidental writes during power transitions
VCCCore supply2.7–3.6 V single supply for read/program/erase; eliminates need for separate VPP
VIOI/O supply1.65–VCC; allows interfacing with 1.8 V, 2.5 V, or 3.3 V controllers
RESET#Hardware resetResets internal state machine and aborts ongoing operations; synchronous to clock domain

Key Features

FeatureDesign Value
Hardware ECCOn-die single-bit error correction with automatic detection-eliminates need for external ECC logic in safety-critical boot paths
Versatile I/OVIO range 1.65 V to VCC enables mixed-voltage system integration without level shifters
512-byte write bufferReduces average programming time by >60% vs. byte-by-byte writes-critical for OTA firmware updates
OTP array1024-byte one-time-programmable region with two independent lock bits-secures calibration data or cryptographic keys
ASP sector protectionVolatile and non-volatile locking per 128 kB sector-supports hierarchical firmware partitioning (bootloader, app, config)
CFI complianceStandard Common Flash Interface table enables auto-configuration in U-Boot and Linux MTD drivers

Applications

Automotive Engine Control Unit (ECU)Industrial Programmable Logic Controller (PLC)

Use Scenario: Storing calibrated engine maps and bootloader firmware in AEC-Q100 Grade 2 qualified module.

IC Role / Device Role / Timing Role: Non-volatile boot memory with XIP capability and deterministic 100 ns read latency.

Use Value: Enables cold-start execution within 50 ms; ECC ensures integrity of safety-critical calibration data.

Use Scenario: Holding firmware and configuration data in DIN-rail mounted PLCs operating continuously at 70°C ambient.

IC Role / Device Role / Timing Role: Firmware storage with 20-year retention and 100,000-cycle endurance for field updates.

Use Value: Eliminates annual backup refresh; ASP protection prevents corruption during brown-out events.

Medical Diagnostic Imaging SystemAvionics Data Recorder

Use Scenario: Storing FPGA configuration bitstreams and diagnostic application binaries in Class II medical devices.

IC Role / Device Role / Timing Role: High-reliability parallel flash with hardware ECC and CFI-compliant initialization.

Use Value: Meets IEC 62304 SW safety classification; OTP stores factory calibration constants permanently.

Use Scenario: Recording flight-critical telemetry logs and storing boot firmware in DO-160G compliant avionics units.

IC Role / Device Role / Timing Role: Radiation-tolerant (tested) flash with 128 kB sector erase for cyclic logging buffers.

Use Value: Supports 10+ year service life with zero data loss; RY/BY# pin enables precise operation timing in deterministic OS.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL512S11TFI01064-ball LAE Fortified BGA (9 mm × 9 mm); same electrical specs but different package and thermal profilePreferred for space-constrained PCBs where TSOP footprint is prohibitiveSelect when board area is constrained and reflow compatibility with fine-pitch BGA is confirmed
N25Q512A13ESE40FQuad SPI interface, 3 V supply, no built-in ECC; requires external error handling logicUsed in cost-sensitive consumer IoT gateways where serial interface sufficesChoose only if system already uses SPI infrastructure and ECC can be implemented in software

Compared with S29GL512S11DHA013, the TSOP-packaged Infineon variant offers superior thermal dissipation and pin-compatible upgrade path, while the Quad SPI alternative trades deterministic timing and hardware ECC for reduced pin count and lower BOM cost.

Availability

S29GL512S11DHA013 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware storage, and avionics data recorder applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S29GL512S11DHA013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q200.

The GL-S family targets mission-critical embedded systems needing deterministic parallel flash performance, integrated ECC, and AEC-Q100 qualification-designed specifically for automotive, industrial, and aerospace firmware storage.

FAQ

What is the maximum operating temperature range for S29GL512S11DHA013?

This part is rated for Industrial Plus grade (–40°C to +105°C), verified per Infineon's qualification test plan and documented in the 001-98285 Rev. *U datasheet Section 10.4. It meets AEC-Q100 Grade 2 requirements and is validated for continuous operation at 105°C junction temperature under specified voltage and load conditions.

Does S29GL512S11DHA013 support execute-in-place (XIP) functionality?

Yes-it supports true XIP via fast random access (100 ns) and page-mode reads (15 ns), enabling CPU instruction fetch directly from flash without copying to RAM. The 32-byte aligned page structure and asynchronous interface allow deterministic timing required for hard real-time execution in automotive and industrial applications.

How is hardware ECC implemented and what errors does it correct?

Internal hardware ECC detects and corrects all single-bit errors per 512-byte sector during read operations. It operates transparently without software intervention and does not require additional overhead bits in user data. The ECC logic is integrated into the read path and verified across full temperature and voltage ranges per datasheet Section 5.3.

Can S29GL512S11DHA013 be used with a 1.8 V I/O interface?

Yes-its Versatile I/O feature supports VIO from 1.65 V to VCC. With VCC = 3.3 V, VIO may be set to 1.8 V, allowing direct connection to 1.8 V logic families without level shifters. This is confirmed in Section 1.2 and Table 2 of the datasheet, and validated in DC characteristics (Section 10.5).

S29GL512S11DHA013 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
64-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
32M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
110 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (9x9)

S29GL512S11DHA013 FAQ

1.How can I place an order for S29GL512S11DHA013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11DHA013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11DHA013 reliable?

The price and inventory of S29GL512S11DHA013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11DHA013 is usually 5 days.

3.What payment methods are accepted for S29GL512S11DHA013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11DHA013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11DHA013?

S29GL512S11DHA013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11DHA013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11DHA013?

For technical support, including S29GL512S11DHA013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11DHA013 requirements.

6.How does Aetrix verify that S29GL512S11DHA013 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11DHA013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11DHA013 meets industry standards.

7.What is the process for return or replacement of S29GL512S11DHA013?

All S29GL512S11DHA013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11DHA013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11DHA013 part is unused and in its original packaging.

Return procedure for S29GL512S11DHA013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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