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Infineon Technologies S29GL512S11DHA020
- Part No.:
- S29GL512S11DHA020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512S11DHA020.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,952
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Product details
Overview
S29GL512S11DHA020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial control and automotive ECUs.
For engineers reviewing the S29GL512S11DHA020 datasheet, S29GL512S11DHA020 pinout, S29GL512S11DHA020 application, or S29GL512S11DHA020 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), OTP array, and AEC-Q100 Grade 2 qualification (–40°C to +105°C).
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supports XIP-capable fast page reads (32-byte aligned), and embeds an on-die algorithm controller for autonomous program/erase operations. Its status monitoring uses RY/BY# pin, data polling, and status register read-enabling deterministic timing in real-time firmware update sequences.
The integrated hardware ECC corrects single-bit errors during read and detects multi-bit errors, while Advanced Sector Protection (ASP) provides both volatile and non-volatile lock bits per 128 kB sector. The 1024-byte OTP array includes two independently lockable regions for secure configuration or calibration data storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB), enabling full firmware image storage for mid-tier microcontrollers |
| Random access time | 100 ns at VCC = VIO, meeting real-time boot latency requirements in safety-critical systems |
| Page access time | 15 ns, allowing rapid sequential instruction fetch within 32-byte pages |
| Write buffer size | 512 bytes, reducing effective programming time by up to 4× vs. single-word writes |
| Erase endurance | 100,000 cycles per sector, supporting field firmware updates over 10+ year product life |
| Data retention | 20 years at 85°C, ensuring long-term reliability in unattended industrial deployments |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2), qualified for under-hood automotive applications |
| I/O voltage range | VIO = 1.65 V to VCC, enabling direct interfacing with 1.8 V or 3.3 V logic without level shifters |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | Word-aligned address bus (25 pins); A24 = MSB for 512 Mb addressing (225 × 16-bit) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65–3.6 V I/O voltage via VIO pin |
| CE# | Chip enable | Active-low chip select; tCE = 100 ns max (Versatile I/O mode), critical for multi-device bus arbitration |
| OE# | Output enable | Active-low read strobe; tOE = 35 ns max, defines minimum read cycle timing margin |
| WE# | Write enable | Active-low write strobe; controls program/erase command latching and data loading |
| RY/BY# | Ready/Busy output | Open-drain status indicator; low during embedded operations, enables interrupt-driven polling |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into reading state and clears internal state machines |
| VCC | Core power | 2.7–3.6 V supply for core logic and flash array; decoupling required per datasheet layout guidelines |
| VIO | I/O power | 1.65–3.6 V supply for interface buffers; independent of VCC, enabling mixed-voltage system integration |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | Single-bit error correction + multi-bit error detection on every read, eliminating need for external error-handling logic |
| 512-byte write buffer | Enables burst programming of up to 256 words in one command, cutting typical firmware update time by >60% vs. legacy NOR |
| Uniform 128 kB sectors | Eliminates complexity of variable-sector architectures; simplifies partitioning for bootloader, app, and config storage |
| Advanced Sector Protection (ASP) | Volatile and non-volatile lock bits per sector allow runtime reconfiguration or permanent factory lockdown of critical firmware regions |
| 1024-byte OTP array | Two lockable regions store immutable calibration data or security keys, resistant to accidental overwrite or erase |
| Common Flash Interface (CFI) | Standardized parameter table enables automatic driver detection and configuration in U-Boot, Linux MTD, and RTOS BSPs |
Applications
| Automotive ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader and safety-critical application firmware in engine control units requiring AEC-Q100 compliance. IC Role / Device Role / Timing Role: Primary XIP-capable boot memory with deterministic 100 ns random access for immediate CPU instruction fetch after reset. Use Value: AEC-Q100 Grade 2 rating and 20-year data retention ensure functional safety compliance (ISO 26262 ASIL-B) over vehicle lifetime. |
Use Scenario: Holds firmware and configuration data in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile firmware repository with sector-level protection to prevent unauthorized modification during field updates. Use Value: 128 kB uniform sectors and ASP enable granular, lockable partitions for bootloader, application, and user-config regions. |
| Medical Imaging System BIOS | Telecom Base Station Control Code |
Use Scenario: Stores BIOS and diagnostic firmware in FDA-regulated imaging equipment where data integrity is auditable and traceable. IC Role / Device Role / Timing Role: Secure, ECC-protected firmware storage with OTP region for calibration constants and regulatory metadata. Use Value: Integrated hardware ECC and 1024-byte OTP eliminate external error-correction logic and provide immutable audit trail storage. |
Use Scenario: Hosts control plane firmware in 4G/5G base station radios operating in extended temperature cabinets. IC Role / Device Role / Timing Role: High-reliability parallel NOR flash supporting hot-swap firmware updates without system downtime. Use Value: 100,000 erase cycles and suspend/resume capability allow background firmware patching during active radio operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI020 | Same density and architecture, but in 56-pin TSOP package (not BGA); no VIO pin-fixed 3.0 V I/O | Limited to PCBs with through-hole or standard surface-mount routing; unsuitable for high-density BGA layouts | Select when board space allows TSOP and I/O voltage is fixed at 3.0 V |
| MX29GL512FHI-90G | Micron 512 Mb parallel NOR; 90 ns random access (faster), but no integrated ECC and only 10K erase cycles | Requires external ECC logic and limits field update frequency; not AEC-Q100 qualified | Select only for cost-sensitive, non-automotive designs with short lifecycle and external error handling |
Compared with S29GL512S11DHA020, the TSOP variant trades BGA miniaturization and Versatile I/O flexibility for simpler assembly, while the Micron alternative sacrifices ECC, endurance, and automotive qualification for marginal speed gain-making the Infineon part optimal for safety- and longevity-critical embedded systems.
Availability
S29GL512S11DHA020 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware storage, and medical imaging BIOS applications requiring stable component supply across extended product lifecycles.
Supply support for S29GL512S11DHA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including IATF 16949.
The GL-S family targets automotive and industrial embedded systems needing robust, XIP-capable NOR flash with integrated ECC, sector protection, and extended temperature operation-designed to replace legacy parallel flash in safety-critical boot applications.
FAQ
Does S29GL512S11DHA020 support execute-in-place (XIP) operation?
Yes. The device supports true XIP operation with 100 ns random access and 15 ns page-mode reads, enabling CPUs to fetch instructions directly from flash without copying to RAM. Its architecture includes dedicated address decoding and fast internal state machines optimized for zero-wait-state execution in boot ROM contexts.
What is the function of the VIO pin, and how does it differ from VCC?
VIO supplies power exclusively to the input/output buffers, allowing independent voltage setting from 1.65 V to VCC. This enables direct interfacing with 1.8 V or 2.5 V logic families without external level shifters, while VCC powers the core flash array and logic at 2.7–3.6 V-decoupling I/O signaling from memory array operation.
How is the 1024-byte OTP array structured and secured?
The OTP array consists of two independently lockable 512-byte regions. Once locked via dedicated CFI commands, each region becomes permanently read-only and immune to erase or program operations. Locking is irreversible and verified by status register bits, making it suitable for storing cryptographic keys or factory calibration data.
Can sector erase be suspended and resumed during operation?
Yes. The device supports suspend/resume commands for both program and erase operations. When suspended, the internal state is preserved, and the RY/BY# pin returns to ready state-allowing high-priority read accesses. Resume restores the exact point of suspension, maintaining timing predictability in real-time systems.
S29GL512S11DHA020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512S11DHA020 FAQ
1.How can I place an order for S29GL512S11DHA020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S11DHA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S11DHA020 reliable?
The price and inventory of S29GL512S11DHA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11DHA020 is usually 5 days.
3.What payment methods are accepted for S29GL512S11DHA020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11DHA020 transactions.
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4.How is shipping managed for S29GL512S11DHA020?
S29GL512S11DHA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S11DHA020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S11DHA020?
For technical support, including S29GL512S11DHA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11DHA020 requirements.
6.How does Aetrix verify that S29GL512S11DHA020 is sourced from the original manufacturer or authorized distributors?
All S29GL512S11DHA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11DHA020 meets industry standards.
7.What is the process for return or replacement of S29GL512S11DHA020?
All S29GL512S11DHA020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11DHA020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S11DHA020 part is unused and in its original packaging.
Return procedure for S29GL512S11DHA020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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