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Infineon Technologies S29GL512S11DHA023
- Part No.:
- S29GL512S11DHA023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512S11DHA023.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,102
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Product details
Overview
S29GL512S11DHA023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports asynchronous page-mode reads in embedded boot code storage applications.
For engineers reviewing the S29GL512S11DHA023 datasheet, S29GL512S11DHA023 pinout, S29GL512S11DHA023 application, or S29GL512S11DHA023 equivalent, key selection criteria include 512-byte programming buffer throughput (1.5 MBps), uniform 128-kbyte sector erase, Versatile I/O support (1.65–3.6 V), CFI compliance, and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
This device implements an asynchronous parallel interface with dedicated CE#, OE#, and WE# control lines, supporting word-aligned 16-bit transfers and 32-byte page-aligned read bursts. Its embedded algorithm controller (EAC) manages all program/erase operations-including suspend/resume-and enforces command-set locking via status register and data polling.
The MIRRORBIT™ Eclipse architecture on 65 nm process enables dual-bit-per-cell storage without sacrificing reliability: 100,000 program/erase cycles and 20-year data retention are guaranteed. Internal hardware ECC operates transparently during read, correcting single-bit errors without software intervention or latency penalty.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB), organized as 4,194,304 × 16-bit words - sufficient for full firmware images in industrial PLCs and automotive ECUs. |
| Random access time (tACC) | 100 ns at full VCC = VIO - enables deterministic boot timing in XIP-capable microcontrollers. |
| Page access time (tPACC) | 15 ns - allows rapid sequential instruction fetch within 32-byte aligned pages during execution-in-place. |
| Programming buffer size | 512 bytes (256 words) - reduces effective programming time by >3× vs. single-word writes in firmware update routines. |
| ECC capability | Single-bit error correction per 512-byte sector - eliminates need for external error-handling logic in safety-critical systems. |
| Operating temperature | –40°C to +85°C (Industrial grade) - validated for deployment in motor control drives and railway signaling units. |
| Endurance & retention | 100,000 program/erase cycles; 20 years data retention - meets long-lifecycle requirements of medical diagnostic equipment. |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint with gull-wing leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | 25-bit address bus supporting full 512 Mb addressing (A24 = MSB); word-aligned only - no byte enable required. |
| DQ0–DQ15 | Data I/O bus | 16-bit bidirectional data path; supports Versatile I/O (VIO = 1.65–3.6 V) independent of VCC (2.7–3.6 V). |
| CE# | Chip enable | Active-low chip select; controls device power state - deassertion places device in low-power standby (100 µA). |
| OE# | Output enable | Active-low read strobe; gates output drivers - used with CE# to implement asynchronous read timing (tOE = 25 ns max). |
| WE# | Write enable | Active-low write strobe; initiates internal program/erase algorithms when combined with valid command sequences. |
| RY/BY# | Ready/Busy indicator | Open-drain output; low during active program/erase - enables hardware polling without CPU overhead. |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known state and aborts ongoing operations. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned burst reads with 15 ns cycle time - accelerates instruction fetch in XIP boot loaders. |
| 512-byte programming buffer | Enables single-command multi-word programming - cuts firmware update time by up to 75% vs. legacy flash. |
| Hardware ECC engine | On-the-fly single-bit correction per 512-byte sector - removes software ECC overhead and improves system MTBF. |
| Advanced sector protection (ASP) | Volatile and non-volatile lock bits per 128-kbyte sector - prevents accidental overwrite of bootloader or calibration data. |
| Secure OTP array | 1024-byte one-time-programmable region with two lockable segments - stores cryptographic keys or device-specific identifiers. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Storing calibrated fuel injection maps and real-time diagnostics firmware in AEC-Q100 grade 3 ECU. IC Role / Device Role / Timing Role: Boot ROM and runtime firmware store; provides XIP execution with <100 ns access for deterministic interrupt response. Use Value: Hardware ECC ensures data integrity over 15+ year vehicle lifespan; ASP prevents field corruption of calibration sectors. |
Use Scenario: Holding ladder logic programs and I/O configuration tables in DIN-rail mounted PLCs operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile program memory with sector-level write protection; supports hot firmware updates via buffered programming. Use Value: 512-byte buffer enables <1.5 MBps update rate; 20-year retention eliminates scheduled memory replacement. |
| Railway Signaling System | Medical Imaging Device Boot Memory |
Use Scenario: Storing fail-safe control logic and communication protocol stacks in EN 5012x-certified trackside signaling controllers. IC Role / Device Role / Timing Role: Critical boot image storage with hardware reset recovery and RY/BY# hardware polling for operation monitoring. Use Value: –40°C to +85°C operation ensures reliability in unheated track cabinets; 100,000-cycle endurance supports decades of firmware patches. |
Use Scenario: Hosting boot firmware and FPGA configuration bitstreams in MRI and CT scanner mainboards requiring zero-data-loss assurance. IC Role / Device Role / Timing Role: Secure, high-reliability firmware repository with OTP region for device serial number and regulatory certification hash. Use Value: Integrated ECC eliminates need for redundant storage; CFI table enables automatic driver detection across OEM platforms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFI020 | 64-ball LAE Fortified BGA (9 mm × 9 mm); same electrical specs but different package and thermal profile. | Preferred for space-constrained PCBs with automated BGA reflow; lacks TSOP mechanical robustness for high-vibration environments. | Select when board area is critical and thermal management uses thermal pads; verify RY/BY# routing for BGA signal integrity. |
| MX29GL512FHI-90G | Macronix part: 90 ns tACC, no integrated ECC, requires external error handling; identical 512 Mb density and TSOP-56 package. | Suitable for cost-sensitive consumer electronics where ECC is managed in software or not required. | Choose only if ECC is unnecessary and firmware update frequency is low; avoid in safety-critical or long-life deployments. |
Compared with S29GL512S11DHA023, the Infineon TSOP variant offers superior reliability through built-in ECC and ASP, while the Macronix alternative trades error resilience for lower unit cost - making the Infineon part optimal for automotive and industrial systems demanding zero-field failures.
Availability
S29GL512S11DHA023 is available at Aetrix Electronics and suitable for automotive engine control units, industrial programmable logic controllers, and railway signaling systems requiring stable component supply across extended product lifecycles.
Supply support for S29GL512S11DHA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The GL-S family targets high-reliability embedded systems needing fast, secure, and long-life non-volatile storage - designed specifically for XIP boot code, firmware updates, and mission-critical parameter storage.
FAQ
Does S29GL512S11DHA023 support Execute-in-Place (XIP) operation?
Yes. The device supports true XIP operation with 100 ns random access and 15 ns page-mode timing, enabling microcontrollers to execute code directly from flash without copying to RAM. Its asynchronous interface and deterministic timing meet strict real-time interrupt latency requirements in automotive and industrial control applications.
What is the function of the Versatile I/O (VIO) feature?
Versatile I/O allows independent voltage scaling of the I/O pins (1.65–3.6 V) separate from the 2.7–3.6 V core supply. This enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic families without level shifters, reducing BOM count and PCB complexity in mixed-voltage embedded systems.
How does the 512-byte programming buffer improve firmware update performance?
The buffer accepts up to 512 bytes in a single command sequence and programs them internally in one operation, achieving 1.5 MBps effective throughput. This reduces host CPU intervention and total update time by up to 75% compared to single-word programming - critical for minimizing downtime during field firmware upgrades.
Is the OTP array truly one-time programmable, and how is it secured?
Yes. The 1024-byte OTP array contains two independently lockable regions. Once locked via dedicated command sequences, those regions become permanently read-only. This ensures cryptographic keys, calibration constants, or device IDs cannot be altered after manufacturing - meeting ISO 26262 ASIL-B functional safety requirements.
S29GL512S11DHA023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512S11DHA023 FAQ
1.How can I place an order for S29GL512S11DHA023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S11DHA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S11DHA023 reliable?
The price and inventory of S29GL512S11DHA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11DHA023 is usually 5 days.
3.What payment methods are accepted for S29GL512S11DHA023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11DHA023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S11DHA023?
S29GL512S11DHA023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S11DHA023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S11DHA023?
For technical support, including S29GL512S11DHA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11DHA023 requirements.
6.How does Aetrix verify that S29GL512S11DHA023 is sourced from the original manufacturer or authorized distributors?
All S29GL512S11DHA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11DHA023 meets industry standards.
7.What is the process for return or replacement of S29GL512S11DHA023?
All S29GL512S11DHA023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11DHA023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S11DHA023 part is unused and in its original packaging.
Return procedure for S29GL512S11DHA023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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