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Infineon Technologies S29GL512S11DHAV23
- Part No.:
- S29GL512S11DHAV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512S11DHAV23.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,145
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Product details
Overview
S29GL512S11DHAV23 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware update storage in industrial control systems.
For engineers reviewing the S29GL512S11DHAV23 datasheet, S29GL512S11DHAV23 pinout, S29GL512S11DHAV23 application, or S29GL512S11DHAV23 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte programming buffer throughput (1.5 MBps), Versatile I/O support (1.65 V to VCC), and AEC-Q100 Grade 2 qualification (–40°C to +105°C).
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
The flash array is organized into uniform 128 kB sectors, each individually erasable, and includes a dedicated 1024-byte OTP array with two lockable regions. Internal hardware ECC performs real-time single-bit correction during read operations without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB); supports full firmware image storage for mid-complexity microcontrollers |
| Random Access Time | 100 ns at VIO = VCC; enables fast XIP execution in real-time control loops |
| Page Access Time | 15 ns; allows rapid sequential reads within 32-byte aligned pages |
| Programming Buffer | 512 bytes; reduces effective programming time by batching writes without host CPU overhead |
| ECC Support | Hardware single-bit correction; eliminates need for external error-handling logic in safety-critical boot paths |
| Endurance | 100,000 program/erase cycles; suitable for field-updatable firmware with moderate revision frequency |
| Data Retention | 20 years at 85°C; ensures long-term reliability in unattended industrial deployments |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address Inputs | Word-aligned address bus; A24 is MSB for 512 Mb density (2²⁵ × 16 bits) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports Versatile I/O (1.65 V to VCC) |
| CE# | Chip Enable | Active-low chip select; controls device power state and command latching |
| OE# | Output Enable | Active-low read strobe; gates output drivers during asynchronous read cycles |
| WE# | Write Enable | Active-low write strobe; initiates command sequences and data latching |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded program/erase operations |
| RESET# | Hardware Reset | Active-low asynchronous reset; forces device into reading state and clears internal state |
Key Features
| Feature | Design Value |
|---|---|
| Uniform 128 kB Sector Erase | Enables granular firmware partitioning-e.g., separate bootloader, app, and config sectors-with deterministic erase timing |
| Automatic ECC Correction | Single-bit errors corrected transparently during read; no software overhead or latency penalty |
| Suspend/Resume for Program/Erase | Allows interrupting long-duration operations (e.g., sector erase) to service high-priority reads |
| Common Flash Interface (CFI) | Standardized parameter table enables automatic driver detection and configuration in U-Boot/Linux MTD stacks |
| Advanced Sector Protection (ASP) | Volatile and non-volatile locking per sector prevents accidental overwrite of critical firmware regions |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency and 20-year data retention. Use Value: Eliminates external ECC logic and supports over-the-air updates via 512-byte buffered programming, reducing field maintenance cycles. | Use Scenario: Holding safety-critical boot code and sensor calibration data in automotive camera ECU modules certified to AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: AEC-Q100 qualified parallel NOR flash serving as primary boot source with hardware ECC and sector-level write protection. Use Value: Meets ISO 26262 ASIL-B requirements through deterministic erase, single-bit correction, and lockable OTP region for calibration constants. |
| Medical Imaging System Configuration | Telecom Base Station FPGA Bitstream |
Use Scenario: Storing device-specific calibration tables and user interface assets in portable ultrasound machines requiring long shelf life and field reconfiguration. IC Role / Device Role / Timing Role: High-reliability configuration store with 128 kB sector granularity enabling independent update of calibration vs. UI assets. Use Value: 100,000 erase cycles and 20-year retention ensure compliance with IEC 62304 Class C software lifecycle requirements. | Use Scenario: Hosting FPGA configuration bitstreams in 5G remote radio units where fast, deterministic loading is required after power-on or reset. IC Role / Device Role / Timing Role: Parallel boot memory delivering 15 ns page-access reads to minimize FPGA configuration time. Use Value: Page-mode read performance accelerates bitstream load time versus serial flash, improving system recovery responsiveness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFIV20 | Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP package | Used where board space is constrained and BGA assembly is available | Select when footprint reduction and thermal performance outweigh TSOP's reworkability advantage |
| MX29GL512FHI-11G | Macronix 512 Mb parallel NOR; 110 ns random access; no integrated ECC; CFI-compatible but software ECC required | Lower-cost alternative where ECC handled in host processor or not required | Choose only if host firmware can implement robust ECC and endurance management |
Compared with S29GL512S11DHAV23, the Infineon BGA variant offers identical functionality in smaller footprint but requires BGA rework capability, while the Macronix part lacks hardware ECC-increasing host software complexity and reducing fault tolerance in safety-critical boot paths.
Availability
S29GL512S11DHAV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL512S11DHAV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems needing deterministic boot performance, field-upgradable firmware, and AEC-Q100 or industrial temperature operation-designed specifically for NOR flash replacement in legacy parallel interfaces.
FAQ
What voltage ranges does the S29GL512S11DHAV23 support for core and I/O operation?
The device uses a single 2.7–3.6 V supply (VCC) for core read/program/erase functions. Its Versatile I/O feature supports independent VIO from 1.65 V to VCC, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic without level shifters.
Does the S29GL512S11DHAV23 require external ECC circuitry?
No. It includes on-die hardware ECC that automatically detects and corrects single-bit errors during every read operation. No external components or host software intervention are needed for basic error correction, simplifying system design and improving boot reliability.
Can the S29GL512S11DHAV23 be used in automotive applications?
Yes-this specific part number is qualified to AEC-Q100 Grade 2 (–40°C to +105°C) and includes features like advanced sector protection, 100,000-cycle endurance, and hardware reset, making it suitable for ADAS ECUs, body control modules, and infotainment boot memory.
How does the 512-byte programming buffer improve firmware update efficiency?
The buffer allows up to 512 bytes to be loaded before initiating programming, achieving 1.5 MBps effective write speed. This reduces the number of command sequences required per firmware block, cutting host CPU overhead and total update time compared to single-word programming.
S29GL512S11DHAV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512S11DHAV23 FAQ
1.How can I place an order for S29GL512S11DHAV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S11DHAV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S11DHAV23 reliable?
The price and inventory of S29GL512S11DHAV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11DHAV23 is usually 5 days.
3.What payment methods are accepted for S29GL512S11DHAV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11DHAV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S11DHAV23?
S29GL512S11DHAV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S11DHAV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S11DHAV23?
For technical support, including S29GL512S11DHAV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11DHAV23 requirements.
6.How does Aetrix verify that S29GL512S11DHAV23 is sourced from the original manufacturer or authorized distributors?
All S29GL512S11DHAV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11DHAV23 meets industry standards.
7.What is the process for return or replacement of S29GL512S11DHAV23?
All S29GL512S11DHAV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11DHAV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S11DHAV23 part is unused and in its original packaging.
Return procedure for S29GL512S11DHAV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512S11DHAV23 Tags
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