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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11DHB010

Name: S29GL512S11DHB010
Brand: Infineon Technologies
SKU: S29GL512S11DHB010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S11DHB010

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512S11DHB010.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL512S11DHB010 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports asynchronous read, buffer programming (up to 512 bytes), and uniform 128-kbyte sector erase - deployed in boot code storage for industrial HMIs and network edge controllers.

For engineers reviewing the S29GL512S11DHB010 datasheet, S29GL512S11DHB010 pinout, S29GL512S11DHB010 application, or S29GL512S11DHB010 equivalent, key selection criteria include verified 100,000 program/erase cycles, CFI-compliant interface, OTP array support, Versatile I/O (1.65–VCC VIO), and TSOP-56/LAA/LAE/VBU package compatibility for legacy board reuse and thermal-constrained designs.

Technical Context

This device implements an embedded algorithm controller (EAC) that executes autonomous program and erase operations without host CPU intervention, using command sequences compliant with Common Flash Interface (CFI) v1.4. Its MIRRORBIT™ Eclipse architecture on 65 nm process enables dual-bit-per-cell storage while maintaining NOR-like random access and XIP capability.

The flash integrates status register polling, RY/BY# pin signaling, and data polling for real-time operation monitoring; supports suspend/resume during both program and erase; and features Advanced Sector Protection (ASP) with volatile/non-volatile lock bits per 128-kbyte sector plus a dedicated 1024-byte OTP array split into two lockable regions.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	512 Mb (64 MB), organized as 4,194,304 × 16-bit words - sufficient for full firmware images including bootloader, OS kernel, and application binaries in space-constrained embedded systems.
Access Time	100 ns random access (VCC = VIO), 15 ns page access - enables deterministic boot timing and low-latency instruction fetch in XIP configurations.
Programming Buffer	512-byte write buffer - reduces effective programming time by up to 4× vs. single-word writes, critical for field firmware updates with minimal downtime.
Erase Unit	Uniform 128-kbyte sectors (512 sectors total) - simplifies wear leveling and partitioning for secure code/data separation.
ECC	On-die hardware single-bit error correction - eliminates need for external ECC logic or software overhead in safety-critical applications.
Endurance & Retention	100,000 program/erase cycles; 20-year data retention - validated for industrial control systems requiring long service life without refresh.
I/O Voltage Range	VIO = 1.65 V to VCC - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic without level shifters in mixed-voltage SoC designs.

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP-II, Type 1), 14 mm × 20 mm body, 0.5 mm pitch, JEDEC MO-141AC compliant. Pin-compatible with legacy S29GL series and widely supported in industrial PCB footprints.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	25-bit address bus supporting full 512 Mb addressing (A24 = MSB); word-aligned only - no byte-level access.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports high-speed page reads and buffer programming with automatic direction control.
CE#	Chip enable	Active-low chip select; controls device power state and enables simultaneous multi-chip addressing in banked memory systems.
OE#	Output enable	Active-low read strobe; gates output drivers independently of CE#, enabling shared-bus arbitration and low-power standby.
WE#	Write enable	Active-low write strobe; initiates command latching and internal program/erase execution when combined with valid address/data.
RY/BY#	Ready/Busy indicator	Open-drain active-low signal reflecting internal operation status - used for hardware handshaking without polling overhead.
WP#	Write protect	Hardware sector protection override; disables program/erase commands globally when asserted, independent of ASP settings.
VCC	Core supply	3.0 V ±0.3 V supply powering core logic, charge pumps, and EAC - single-supply operation simplifies power design.
VIO	I/O supply	Independent 1.65–3.6 V supply for interface buffers - enables voltage translation between host processor and flash without external components.

Key Features

Feature	Design Value
Asynchronous Page Read	32-byte aligned page access with 15 ns cycle time - delivers sustained read bandwidth >200 MB/s for sequential code execution.
Embedded Algorithm Controller (EAC)	Fully autonomous program/erase execution with suspend/resume - offloads timing-critical tasks from host MCU and improves system responsiveness.
Common Flash Interface (CFI)	Compliant with CFI v1.4 parameter table - enables plug-and-play driver compatibility across Linux, VxWorks, and bare-metal BSPs without vendor-specific code.
Advanced Sector Protection (ASP)	Volatile and non-volatile lock bits per 128-kbyte sector - supports secure boot partitioning and field-upgrade-safe firmware layout.
Secure Silicon Region (OTP)	1024-byte one-time-programmable array with two independent lockable regions - stores cryptographic keys, calibration data, or device serial numbers with irreversible write protection.

Applications

Industrial HMI Boot Storage

Telecom Edge Router Firmware

Use Scenario: Persistent storage of boot loader, RTOS image, and GUI assets in panel-mounted HMIs operating continuously in factory environments.

IC Role / Device Role / Timing Role: Primary XIP-capable boot memory providing deterministic <100 ns instruction fetch latency and 20-year data retention under thermal cycling.

Use Value: Eliminates need for external SRAM cache or NAND+controller complexity while meeting IEC 61000-4-2 ESD immunity requirements via robust TSOP packaging.

Use Scenario: Storing dual-image firmware and configuration tables in carrier-grade edge routers requiring zero-downtime failover and remote updates.

IC Role / Device Role / Timing Role: Dual-bank firmware repository supporting atomic swap via sector-level erase and CFI-based image validation before reset.

Use Value: Enables field-upgradable firmware with guaranteed rollback and 100,000-cycle endurance - critical for telco SLA compliance and unattended deployment.

Automotive ADAS Camera Module

Medical Imaging Control Board

Use Scenario: Storing calibrated sensor parameters, startup diagnostics, and firmware patches in AEC-Q100 Grade 3 camera modules for advanced driver assistance systems.

IC Role / Device Role / Timing Role: Secure, temperature-stable code storage with OTP region for camera calibration coefficients and ASP-locked boot sector.

Use Value: Meets automotive functional safety requirements (ISO 26262 ASIL-B readiness) through hardware ECC, sector locking, and –40°C to +85°C guaranteed operation.

Use Scenario: Holding FDA-certified boot firmware and diagnostic self-test routines in portable ultrasound and MRI control boards subject to strict regulatory audit trails.

IC Role / Device Role / Timing Role: Tamper-resistant firmware vault with locked OTP region for cryptographic keys and immutable boot signature verification.

Use Value: Supports 21 CFR Part 11 compliance via hardware-enforced write protection, traceable sector erase logs, and ECC-verified runtime integrity checks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFI010	Same density and core specs, but 64-ball LAA Fortified BGA (13 mm × 11 mm); lacks TSOP-56 footprint compatibility.	Targeted at new high-density PCB layouts where BGA routing and thermal performance outweigh legacy footprint needs.	Select when board redesign permits BGA and thermal dissipation >100 mW is required during sustained erase cycles.
MX29GL512FHI-90G	Micron part with identical 512 Mb density, 90 ns access, but no integrated ECC and only 10,000 erase cycles; CFI v1.3 compliant.	Suitable for cost-sensitive consumer applications where ECC is handled in software and lifetime is <5 years.	Choose only if firmware update frequency is low and external ECC implementation is acceptable for risk mitigation.

Compared with S29GL512S11DHB010, the LAA BGA variant offers superior thermal and signal integrity for new designs, while the Micron alternative trades reliability and hardware ECC for lower unit cost - making Infineon's TSOP version optimal for drop-in replacement in industrial and automotive legacy platforms.

Availability

S29GL512S11DHB010 is available at Aetrix Electronics and suitable for industrial HMI boot storage, telecom edge router firmware, automotive ADAS camera modules, and medical imaging control boards requiring stable component supply across extended product lifecycles.

Supply support for S29GL512S11DHB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.

The GL-S family was engineered specifically for mission-critical embedded boot and firmware storage, combining XIP performance, industrial-grade endurance, and automotive qualification - targeting applications where firmware integrity and long-term supply stability are non-negotiable.

FAQ

Does S29GL512S11DHB010 support byte-level writes?

No. This device is strictly word-wide (16-bit) and requires all operations to be aligned to 16-bit boundaries. Address lines A0–A24 define word addresses only; there is no A0 bit for byte selection, and the data bus DQ0–DQ15 transfers full words per cycle. Byte-level access is not electrically or logically supported.

What is the purpose of the Versatile I/O (VIO) supply pin?

VIO powers the input/output buffers independently from the core VCC supply, allowing the device to interface directly with host logic operating at 1.8 V, 2.5 V, or 3.3 V without external level shifters. This decoupling ensures signal integrity and reduces board complexity in mixed-voltage systems such as ARM-based SoC designs.

Can the OTP array be reprogrammed after initial write?

No. The 1024-byte Secure Silicon Region is one-time programmable: once a bit is set to '0', it cannot be changed back to '1'. Each of the two lockable regions can be permanently locked via dedicated command sequences, preventing further writes even under elevated voltage or debug access - ensuring cryptographic key immutability.

How does hardware ECC interact with the status register during read operations?

Hardware ECC operates transparently during every read: if a single-bit error is detected in a 16-bit word, it is automatically corrected before output, and the ECC status register (bit 2) is set. No host action is required for correction, but the status flag must be polled or cleared via command to avoid false alarms in subsequent error-checking routines.

S29GL512S11DHB010 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL512S11DHB010 FAQ

1.How can I place an order for S29GL512S11DHB010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11DHB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11DHB010 reliable?

The price and inventory of S29GL512S11DHB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11DHB010 is usually 5 days.

3.What payment methods are accepted for S29GL512S11DHB010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11DHB010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11DHB010?

S29GL512S11DHB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11DHB010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11DHB010?

For technical support, including S29GL512S11DHB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11DHB010 requirements.

6.How does Aetrix verify that S29GL512S11DHB010 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11DHB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11DHB010 meets industry standards.

7.What is the process for return or replacement of S29GL512S11DHB010?

All S29GL512S11DHB010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11DHB010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11DHB010 part is unused and in its original packaging.

Return procedure for S29GL512S11DHB010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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