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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11DHB013

Name: S29GL512S11DHB013
Brand: Infineon Technologies
SKU: S29GL512S11DHB013
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S11DHB013

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512S11DHB013.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL512S11DHB013 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 3.0 V core supply, ×16 data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 100 ns random access time, 15 ns page access time, and supports 128-kbyte uniform sector erase, internal hardware ECC for single-bit correction, and 100,000 program/erase cycles - deployed in automotive infotainment boot code storage.

For engineers reviewing the S29GL512S11DHB013 datasheet, S29GL512S11DHB013 pinout, S29GL512S11DHB013 application, or S29GL512S11DHB013 equivalent, key selection criteria include Versatile I/O voltage range (1.65 V to VCC), OTP array support, CFI compliance, and AEC-Q100 Grade 2 qualification (–40°C to +105°C).

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and automatic ECC generation/correction during read.

The architecture includes a 512-byte write buffer enabling burst programming up to 256 words per command, plus advanced sector protection (ASP) with volatile/non-volatile lock options and a dedicated 1024-byte OTP array split into two lockable regions for secure configuration storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	512 Mb (64 MB); supports full firmware image storage for mid-tier automotive ECUs.
Interface	Parallel ×16 asynchronous; enables direct XIP execution without external buffering.
Access Time	100 ns random / 15 ns page; meets real-time boot latency requirements under industrial temperature.
Erase Unit	Uniform 128-kbyte sectors; simplifies firmware update partitioning and wear leveling design.
ECC	Internal hardware single-bit error correction; eliminates need for external ECC logic in safety-critical paths.
Endurance	100,000 program/erase cycles; ensures >10-year field reliability for OTA update-capable systems.
Data Retention	20 years at +85°C; validated for automotive under-hood deployment without refresh.
Supply Range	VCC = 2.7 V to 3.6 V; compatible with modern low-voltage power rails while maintaining noise margin.

Pinout & Package

Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.55 mm pitch). Pinout conforms to JEDEC MO-142AC standard for parallel NOR flash.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	Word-aligned addressing; A24 is MSB for 512 Mb density (2²⁵ × 16-bit words).
DQ0–DQ15	Data I/O bus	Bi-directional ×16 data path; supports byte/word writes and 32-byte page reads.
CE#	Chip enable	Active-low device select; controls power state entry and timing reference for tCE.
OE#	Output enable	Active-low read strobe; gates output drivers during asynchronous read cycles.
WE#	Write enable	Active-low control for write/program commands; latches address/data on rising edge.
RY/BY#	Ready/Busy indicator	Open-drain status flag; low during embedded program/erase, high when idle or ready.
RESET#	Hardware reset	Active-low asynchronous abort of ongoing operations and return to read mode.
WP#	Write protect	Hardware sector lock override; disables program/erase when asserted low.

Key Features

Feature	Design Value
Versatile I/O (VIO)	Independent VIO supply (1.65 V to VCC) allows interfacing with 1.8 V or 3.3 V controllers without level shifters.
512-byte write buffer	Enables single-command programming of up to 256 words, reducing host CPU overhead by >60% vs. byte-by-byte writes.
OTP array	1024-byte one-time-programmable region with dual lock bits, used for secure MAC addresses or calibration constants.
CFI compliance	Standardized parameter table enables auto-detection and driver compatibility across bootloader and OS flash abstractions.
Suspend/resume	Allows interrupting erase or program to service high-priority reads, critical for real-time HMI responsiveness.

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, CAN message lookup tables, and boot firmware in AEC-Q100 Grade 2 qualified ECU.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 100 ns read latency and 20-year data retention.

Use Value: Eliminates external SRAM copy step during boot; reduces BOM count and PCB area versus serial flash + cache solutions.

Use Scenario: Holding ladder logic firmware, I/O mapping tables, and safety-critical configuration data in factory-floor controllers.

IC Role / Device Role / Timing Role: High-reliability parallel flash with sector-level protection and hardware write lock for unattended operation.

Use Value: Enables field updates without risk of partial corruption via ASP and suspend/resume during runtime diagnostics.

Medical Imaging Boot Loader

Avionics Display System

Use Scenario: Secure boot code and FPGA configuration bitstreams in FDA-cleared diagnostic equipment requiring traceable firmware integrity.

IC Role / Device Role / Timing Role: OTP-backed secure storage with internal ECC and CFI-defined identity for audit-compliant versioning.

Use Value: Meets IEC 62304 software lifecycle requirements via hardware-enforced write protection and error detection.

Use Scenario: Storing display firmware, font assets, and ARINC 661 widget definitions in DO-178C Level C certified cockpit displays.

IC Role / Device Role / Timing Role: Radiation-tolerant (tested) parallel flash with 105°C operation and 100k-cycle endurance for extended mission life.

Use Value: Avoids requalification delays by using pre-qualified AEC-Q100 Grade 2 component in harsh thermal environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S11TFI010	Same die, 64-ball LAE FBGA (9 mm × 9 mm); no TSOP package; 110 ns random access.	Used where board space is constrained and BGA assembly is available.	Select for compact designs with automated BGA placement capability.
MX29GL512FHI-90G	Macronix part; 90 ns random access, 3.0 V only (no Versatile I/O), no OTP array.	Lacks VIO flexibility and secure OTP; requires external level shifting for 1.8 V hosts.	Choose only if cost sensitivity outweighs I/O voltage flexibility and security features.

Compared with S29GL512S11DHB013, the TSOP variant offers mechanical robustness and socket compatibility for prototyping, while the LAE FBGA alternative trades package size for slightly relaxed timing; the Macronix part omits VIO and OTP, limiting use in mixed-voltage or secure boot contexts.

Availability

S29GL512S11DHB013 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and medical imaging boot loaders requiring stable component supply across extended product lifecycles.

Supply support for S29GL512S11DHB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive microcontrollers, and non-volatile memory solutions for safety-critical systems.

The GL-S family targets high-reliability embedded applications demanding XIP capability, long-term data retention, and AEC-Q100 qualification - especially automotive, industrial, and medical firmware storage.

FAQ

Is S29GL512S11DHB013 pin-compatible with earlier S29GL512P or S29GL512N variants?

No. S29GL512S uses updated command sets, enhanced ECC handling, and revised sector protection logic. Pinout is identical in TSOP-56, but firmware must be updated to support new status register bits and CFI revision. Migration requires validation of all erase, program, and read sequences.

Does this device support Quad SPI or other serial interfaces?

No. S29GL512S11DHB013 is strictly a parallel ×16 interface device with CE#/OE#/WE# control lines. It does not implement SPI, QSPI, or any serial protocol. Interface conversion requires external bridge ICs, which add latency and complexity.

What is the function of the STB pin listed in the block diagram?

The STB (Strobe) pins (STB and STB#) are internal test signals not connected to package pins. They are used exclusively during wafer-level testing and do not appear in the 56-pin TSOP pinout or functional specification - they have no user-accessible role in system design.

Can the OTP array be reprogrammed after initial programming?

No. The 1024-byte OTP array is permanently programmable once. Each region has independent lock bits; after locking, no further writes are possible. Unlocking is not supported - this is a hardware-enforced security feature, not a software-configurable setting.

S29GL512S11DHB013 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL512S11DHB013 FAQ

1.How can I place an order for S29GL512S11DHB013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11DHB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11DHB013 reliable?

The price and inventory of S29GL512S11DHB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11DHB013 is usually 5 days.

3.What payment methods are accepted for S29GL512S11DHB013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11DHB013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11DHB013?

S29GL512S11DHB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11DHB013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11DHB013?

For technical support, including S29GL512S11DHB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11DHB013 requirements.

6.How does Aetrix verify that S29GL512S11DHB013 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11DHB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11DHB013 meets industry standards.

7.What is the process for return or replacement of S29GL512S11DHB013?

All S29GL512S11DHB013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11DHB013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11DHB013 part is unused and in its original packaging.

Return procedure for S29GL512S11DHB013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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