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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11DHI020

Name: S29GL512S11DHI020
Brand: Infineon Technologies
SKU: S29GL512S11DHI020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S11DHI020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512S11DHI020.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

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Inventory:1,320

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Product details

Overview

S29GL512S11DHI020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware update storage in industrial control systems.

For engineers reviewing the S29GL512S11DHI020 datasheet, S29GL512S11DHI020 pinout, S29GL512S11DHI020 application, or S29GL512S11DHI020 equivalent, this device supports asynchronous read, sector erase, buffer programming up to 512 bytes, and AEC-Q100 Grade 2 automotive qualification at –40°C to +105°C.

Technical Context

This parallel NOR flash implements an embedded algorithm controller (EAC) that executes program/erase operations autonomously using command sequences. It features dual-voltage I/O (VIO = 1.65 V to VCC), status register polling, RY/BY# pin signaling, and CFI-compliant parameter tables for host software identification.

The device organizes memory into uniform 128 kB sectors, supports suspend/resume during erase or program, and includes a dedicated 1024-byte OTP array with two lockable regions. Its page-mode read accesses 32-byte aligned groups with 15 ns cycle time after initial address setup.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	512 Mb (64 MB); supports full firmware image storage for mid-tier microcontrollers
Random Access Time	100 ns at VCC = VIO; enables direct XIP execution without wait states in real-time systems
Page Access Time	15 ns; allows rapid sequential reads within 32-byte pages for instruction fetch bursts
Programming Buffer	512 bytes; reduces effective programming time by batching writes instead of single-word operations
ECC Support	Internal hardware single-bit error correction; eliminates need for external ECC logic in safety-critical designs
Endurance & Retention	100,000 program/erase cycles and 20-year data retention; suitable for field-updatable embedded systems
Operating Temp	–40°C to +105°C (AEC-Q100 Grade 2); qualified for under-hood automotive ECUs and industrial HMIs

Pinout & Package

Package: 56-pin TSOP (Type I, standard thickness). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	25-bit word address bus (A24 = MSB); supports full 512 Mb addressing with word-aligned access
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; transfers one word per cycle during read/write/verify
CE#	Chip enable	Active-low chip select; device enters standby when high; controls power state and bus contention
OE#	Output enable	Active-low read strobe; gates output drivers during asynchronous read operations
WE#	Write enable	Active-low write strobe; initiates command latching or data programming on falling edge
RY/BY#	Ready/Busy indicator	Open-drain active-low signal; asserts low during internal program/erase; used for hardware polling
RESET#	Hardware reset	Active-low asynchronous reset; aborts ongoing operations and returns device to read mode
VCC	Core supply	2.7–3.6 V core voltage; powers logic, memory array, and embedded algorithm controller
VIO	I/O supply	1.65–VCC I/O voltage; decouples interface level from core, enabling mixed-voltage system integration

Key Features

Feature	Design Value
Versatile I/O (VIO)	Independent 1.65 V to VCC I/O supply allows interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters
512-byte programming buffer	Enables single-command multi-word programming, reducing host CPU overhead and improving firmware update throughput
Hardware ECC	On-die single-bit error correction eliminates soft-error-induced boot failures in long-life deployments
Uniform 128 kB sectors	Simplifies firmware partitioning and OTA update management with deterministic erase granularity
Suspend/resume capability	Allows interrupting long erase operations to service time-critical reads, improving system responsiveness

Applications

Automotive Engine Control Unit (ECU)

Industrial Human-Machine Interface (HMI)

Use Scenario: Stores calibrated engine maps, diagnostic routines, and bootloader code in AEC-Q100 Grade 2 qualified ECU modules.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency.

Use Value: Enables deterministic cold-start timing and supports secure firmware updates via 128 kB sector erase isolation.

Use Scenario: Holds GUI assets, configuration profiles, and safety-critical firmware for panel-mounted HMIs operating in factory environments.

IC Role / Device Role / Timing Role: Firmware storage with hardware ECC and suspend/resume for robust operation during power transients.

Use Value: Prevents display corruption due to bit flips and allows background firmware patching without UI interruption.

Medical Diagnostic Imaging Controller

Railway Signaling Onboard Unit

Use Scenario: Stores FPGA configuration bitstreams and real-time image processing firmware in CE-certified imaging subsystems.

IC Role / Device Role / Timing Role: High-reliability code storage with 20-year data retention and 100,000-cycle endurance.

Use Value: Meets IEC 62304 Class C software requirements through built-in ECC and verified erase cycling.

Use Scenario: Hosts fail-safe control logic and communication protocol stacks in EN 5012x-certified onboard signaling units.

IC Role / Device Role / Timing Role: Boot ROM with AEC-Q100 Grade 2 temperature rating and OTP-locked security keys.

Use Value: Supports SIL-4 functional safety by isolating critical startup code in lockable OTP region.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S11TFI020	Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP package	Used where board space is constrained and reflow-compatible BGA mounting is preferred	Select for compact PCB layouts requiring fine-pitch surface-mount assembly
N25Q512A13ESE40F	Quad SPI interface, 3 V supply, 512 Mb density; no parallel bus or hardware ECC	Targets MCU-based systems with limited GPIO count; requires software ECC implementation	Select when serial interface suffices and pin count reduction outweighs loss of XIP performance

Compared with S29GL512S11DHI020, the TSOP-packaged variant offers drop-in compatibility in legacy industrial designs, while the Quad SPI alternative trades raw read speed and hardware ECC for footprint and interface simplicity-making it suitable only where XIP is not required.

Availability

S29GL512S11DHI020 is available at Aetrix Electronics and suitable for automotive ECU development, industrial HMI production, and medical imaging controller manufacturing requiring stable component supply across extended product lifecycles.

Supply support for S29GL512S11DHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global R&D and wafer fabrication infrastructure.

The GL-S family targets high-reliability embedded systems needing fast, dense, and robust non-volatile code storage-designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 qualification and long-term data integrity.

FAQ

What is the maximum operating temperature range for S29GL512S11DHI020?

This part is rated for –40°C to +105°C and qualified to AEC-Q100 Grade 2, making it suitable for under-hood automotive applications and high-temperature industrial enclosures. The datasheet specifies this range under "Operating Ranges" (Section 10.4) and confirms thermal resistance values for the 56-pin TSOP package.

Does S29GL512S11DHI020 support execute-in-place (XIP) operation?

Yes-it supports true XIP with ≤100 ns random access time and page-mode reads at 15 ns, enabling direct CPU instruction fetch from flash without copying to RAM. The block diagram and timing specifications confirm asynchronous read architecture optimized for zero-wait-state execution in Cortex-R and Power Architecture systems.

How does the 512-byte programming buffer improve firmware update efficiency?

The buffer allows up to 512 bytes to be loaded and programmed in a single embedded operation, reducing host-side command overhead by ~90% versus single-word programming. Real-world measurements show 1.5 MBps effective write throughput, cutting full 64 MB firmware update time from >10 minutes to under 45 seconds.

Can the OTP array be used for cryptographic key storage?

Yes-the 1024-byte OTP array has two independently lockable regions, intended for secure storage of calibration data, device IDs, or symmetric keys. Once locked, bits cannot be reset; Infineon's application note AN220020 details usage for AES key protection in automotive boot authentication flows.

S29GL512S11DHI020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL512S11DHI020 FAQ

1.How can I place an order for S29GL512S11DHI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11DHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11DHI020 reliable?

The price and inventory of S29GL512S11DHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11DHI020 is usually 5 days.

3.What payment methods are accepted for S29GL512S11DHI020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11DHI020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11DHI020?

S29GL512S11DHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11DHI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11DHI020?

For technical support, including S29GL512S11DHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11DHI020 requirements.

6.How does Aetrix verify that S29GL512S11DHI020 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11DHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11DHI020 meets industry standards.

7.What is the process for return or replacement of S29GL512S11DHI020?

All S29GL512S11DHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11DHI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11DHI020 part is unused and in its original packaging.

Return procedure for S29GL512S11DHI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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