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Infineon Technologies S29GL512S11DHIV13
- Part No.:
- S29GL512S11DHIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512S11DHIV13.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,307
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Product details
Overview
S29GL512S11DHIV13 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial control and automotive ECUs.
For engineers reviewing the S29GL512S11DHIV13 datasheet, S29GL512S11DHIV13 pinout, S29GL512S11DHIV13 application, or S29GL512S11DHIV13 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and TSOP-56 or Fortified BGA packaging options.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supporting XIP-capable read operations via fast page mode (32-byte aligned pages) and standard random reads. Its embedded algorithm controller handles all program/erase sequences-including suspend/resume-and manages status via RY/BY#, data polling, and status register.
The internal architecture includes dedicated erase voltage and programming voltage generators, sector protection logic with volatile/non-volatile lock bits, and a 1024-byte OTP array split into two lockable regions. ECC is implemented in hardware with automatic single-bit correction and detection of multi-bit errors during read cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB), organized as 4,194,304 × 16-bit words |
| Access time (random) | 100 ns at VCC = VIO, enabling fast boot code fetch in real-time systems |
| Page access time | 15 ns for subsequent reads within same 32-byte page, reducing latency in burst instruction fetch |
| Write buffer size | 512 bytes (256 words), allowing efficient firmware update with reduced host overhead |
| Erase block size | Uniform 128 kB sectors (512 sectors total), simplifying partitioning for bootloader + application + config |
| Data retention | 20 years at 85°C, ensuring long-term reliability in unattended industrial deployments |
| Endurance | 100,000 program/erase cycles per sector, supporting field firmware upgrades over product lifetime |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm body, 0.5 mm pitch, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | Word-aligned address bus; A24 is MSB for 512 Mb (225 = 33,554,432 bytes) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports high-speed read/write with Versatile I/O voltage range |
| CE# | Chip enable | Active-low chip select; controls device power state and enables command decoding |
| OE# | Output enable | Active-low gate for data output drivers; used during read operations only |
| WE# | Write enable | Active-low strobe for write cycles; latches address/data during program/erase commands |
| RY/BY# | Ready/Busy output | Open-drain status indicator: low = operation in progress, high = ready/completed |
| RESET# | Hardware reset | Active-low asynchronous reset that aborts ongoing operations and returns to read mode |
| VCC | Core supply | 2.7–3.6 V single supply for core logic, programming, and erase functions |
| VIO | I/O supply | 1.65–VCC versatile I/O voltage, enabling interfacing with mixed-voltage microcontrollers |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | Single-bit error correction and multi-bit error detection on every read, eliminating need for external error handling logic |
| 512-byte write buffer | Reduces effective programming time by up to 4× vs. single-word writes, critical for OTA firmware updates |
| Suspend/resume capability | Allows interrupting erase or program operations to service higher-priority reads, essential in real-time OS environments |
| Advanced sector protection (ASP) | Independent volatile (lock-down) and non-volatile (permanent) protection per 128 kB sector, securing bootloader partitions |
| Common Flash Interface (CFI) | Standardized parameter table enabling automatic driver configuration across toolchains and OS flash loaders |
Applications
| Automotive ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and safety-critical firmware in engine control units requiring AEC-Q100 Grade 2 compliance. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP support and deterministic 100 ns read latency. Use Value: Enables immediate CPU execution after reset; hardware ECC ensures integrity of safety-critical startup routines. | Use Scenario: Holding firmware and configuration data in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: High-reliability firmware storage with 20-year data retention and 100K-cycle endurance for field updates. Use Value: Eliminates need for external error correction circuitry; uniform 128 kB sectors simplify firmware partitioning and OTA rollback. |
| Medical Imaging System BIOS | Avionics Data Logger |
Use Scenario: Hosting BIOS and calibration tables in FDA-regulated medical imaging equipment operating at extended temperature. IC Role / Device Role / Timing Role: Secure, certified non-volatile memory with OTP region for immutable calibration parameters. Use Value: Separate 1024-byte OTP array with dual lockable regions preserves traceable calibration data across device lifecycle. | Use Scenario: Recording flight-critical event logs in airborne data acquisition units requiring DO-254 compliance. IC Role / Device Role / Timing Role: Radiation-tolerant (industrial-grade) parallel flash with suspend/resume for deterministic logging under interrupt load. Use Value: Ability to pause erase operations during high-priority sensor sampling ensures no log entries are lost or corrupted. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFIV10 | Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP package | Targeted for space-constrained PCBs where fine-pitch BGA is acceptable | Select when board layout requires smaller footprint and BGA assembly capability exists |
| MX29GL512FHT2I-90G | Macronix part; 90 ns random access, no integrated hardware ECC, CFI-compliant but different command set | Requires software ECC implementation and custom driver adaptation | Select only if cost sensitivity outweighs ECC requirement and driver development resources are available |
Compared with S29GL512S11DHIV13, the TSOP-packaged Infineon variant offers plug-compatible pinout and full hardware ECC out-of-box, while the LAE-BGA alternative trades package form factor for identical functionality, and the Macronix part shifts ECC responsibility to firmware-increasing validation burden in safety-critical designs.
Availability
S29GL512S11DHIV13 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware storage, and medical device BIOS applications requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 2 qualification.
Supply support for S29GL512S11DHIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global manufacturing and R&D infrastructure.
The GL-S family was designed specifically for high-reliability embedded systems requiring XIP-capable parallel NOR flash with integrated ECC, sector-level protection, and AEC-Q100 qualification-targeting automotive, industrial, and medical applications.
FAQ
What is the maximum operating temperature range for S29GL512S11DHIV13?
This part is qualified to AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C. It meets industrial plus temperature requirements and is validated for use in under-hood automotive applications and high-ambient industrial environments without derating.
Does S29GL512S11DHIV13 require external voltage regulators for VCC and VIO?
No. The device accepts a single 2.7–3.6 V supply on VCC for core logic and programming/erase functions, and a separate 1.65–VCC supply on VIO for I/O buffers-enabling direct connection to common MCU I/O rails without regulation if within spec.
How does the 512-byte write buffer improve firmware update performance?
It allows up to 512 bytes to be loaded into an internal latch before initiating programming, reducing host bus transactions by ~256× versus single-word writes. Measured buffer programming rate is 1.5 MBps, cutting typical 64 kB firmware update time from >400 ms to <45 ms.
Can S29GL512S11DHIV13 be used in place of older S29GL512P devices?
No. While density matches, the GL-S generation uses different command sets, timing parameters, and lacks legacy features like CFI Query Mode compatibility. Migration requires full firmware requalification and driver rewrite due to architectural changes in the embedded algorithm controller.
S29GL512S11DHIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512S11DHIV13 FAQ
1.How can I place an order for S29GL512S11DHIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S11DHIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S11DHIV13 reliable?
The price and inventory of S29GL512S11DHIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11DHIV13 is usually 5 days.
3.What payment methods are accepted for S29GL512S11DHIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11DHIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S11DHIV13?
S29GL512S11DHIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S11DHIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S11DHIV13?
For technical support, including S29GL512S11DHIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11DHIV13 requirements.
6.How does Aetrix verify that S29GL512S11DHIV13 is sourced from the original manufacturer or authorized distributors?
All S29GL512S11DHIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11DHIV13 meets industry standards.
7.What is the process for return or replacement of S29GL512S11DHIV13?
All S29GL512S11DHIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11DHIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S11DHIV13 part is unused and in its original packaging.
Return procedure for S29GL512S11DHIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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