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Infineon Technologies S29GL512S11DHIV23
- Part No.:
- S29GL512S11DHIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512S11DHIV23.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:5,512
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Product details
Overview
S29GL512S11DHIV23 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.
For engineers reviewing the S29GL512S11DHIV23 datasheet, S29GL512S11DHIV23 pinout, S29GL512S11DHIV23 application, or S29GL512S11DHIV23 equivalent, key selection criteria include asynchronous 16-bit interface timing, Versatile I/O voltage support (1.65 V to VCC), 512-byte write buffer performance, OTP array security, and AEC-Q100 grade compatibility per ordering suffix.
Technical Context
This device implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling simultaneous bit-line sensing for higher density and lower power versus legacy floating-gate NOR. Its embedded algorithm controller (EAC) manages autonomous program/erase operations with suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
The flash supports two distinct I/O modes: Full VCC mode (VIO = VCC) and Versatile I/O mode (VIO = 1.65–VCC), allowing interoperability with mixed-voltage SoC interfaces. Page-mode read accesses deliver 32-byte aligned bursts with 15 ns cycle time after initial 100 ns access, while buffer programming achieves up to 1.5 MBps effective throughput.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB), organized as 4,194,304 × 16-bit words - defines maximum boot image or firmware partition size |
| Random access time | 100 ns at VCC = VIO - determines worst-case instruction fetch latency in XIP execution |
| Page access time | 15 ns - enables fast sequential reads within 32-byte aligned pages for cached code execution |
| Write buffer size | 512 bytes (256 words) - reduces average programming time by batching writes without host CPU intervention |
| ECC capability | Internal hardware single-bit error correction - ensures data integrity without software overhead during read cycles |
| Sector size | Uniform 128 kbyte sectors - simplifies firmware update partitioning and wear leveling in bootloader designs |
| Data retention | 20 years at +85°C - guarantees long-term reliability in unpowered industrial deployments |
| Endurance | 100,000 program/erase cycles per sector - supports field firmware updates over product lifetime |
Pinout & Package
Package: 56-pin TSOP (Type I, standard thin small outline package, 14 mm × 20 mm, 0.5 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | 25-bit word address bus (A24 = MSB); A24 maps to 4,194,304-word space for 512 Mb density |
| DQ0–DQ15 | Data I/O bidirectional bus | 16-bit parallel interface; supports byte/word writes and reads; compatible with x16 microprocessor buses |
| CE# | Chip enable | Active-low device select; controls power state entry and exit; tCE = 100 ns max in Versatile I/O mode |
| OE# | Output enable | Active-low read strobe; enables output drivers only during valid read cycles; tOE = 35 ns max |
| WE# | Write enable | Active-low control for write/program operations; latches command sequences and data into internal registers |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active program/erase; used for hardware polling instead of software status register reads |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into reading state and clears internal command registers |
| VCC | Core supply | 3.0 V nominal (2.7–3.6 V); powers logic, charge pumps, and memory array; decoupling required per layout guidelines |
| VIO | I/O supply | 1.65–VCC; sets input threshold and output drive strength; enables level-shifting with 1.8 V or 3.3 V controllers |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse technology | Enables 512 Mb density in compact TSOP package while reducing active current vs. 90 nm predecessors |
| Asynchronous 32-byte page read | Reduces average instruction fetch latency in XIP boot loaders by minimizing address setup overhead per word |
| Separate 1024-byte OTP array | Provides immutable storage for cryptographic keys or calibration data, with dual lockable regions preventing accidental overwrite |
| Advanced sector protection (ASP) | Supports both volatile (power-cycle reset) and non-volatile (permanent) locking per 128 kB sector - critical for bootloader security |
| Common Flash Interface (CFI) | Enables automatic driver detection and configuration in U-Boot/Linux MTD layers without hard-coded geometry tables |
| Suspend/resume for program & erase | Allows interrupting long-duration erase (e.g., 477 kBps sector erase) to service high-priority read requests with <1 µs latency |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
|
Use Scenario: Storing real-time control firmware and configuration parameters in programmable logic controllers operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: Primary boot memory executing XIP code directly from flash; provides deterministic 100 ns read access for servo loop timing. Use Value: 20-year data retention and 100,000 erase cycles ensure firmware integrity over 15+ year equipment lifecycle without refresh. |
Use Scenario: Hosting boot loader and graphics assets for digital instrument clusters requiring AEC-Q100 Grade 2 qualification (–40°C to +105°C). IC Role / Device Role / Timing Role: Non-volatile storage for safety-critical startup sequence; uses hardware ECC to prevent corrupted display initialization. Use Value: Integrated single-bit ECC eliminates need for external error-checking logic, reducing BOM count and PCB area. |
| Medical Imaging System Configuration | Network Router Boot Image Storage |
|
Use Scenario: Holding calibration profiles and regulatory-compliant diagnostic routines in FDA-cleared imaging devices with strict traceability requirements. IC Role / Device Role / Timing Role: Secure configuration store using OTP array for device-specific calibration constants and ASP-locked sectors for audit logs. Use Value: Dual-region OTP lock prevents unauthorized modification of calibration data, supporting ISO 13485 compliance evidence. |
Use Scenario: Storing compressed Linux kernel and initramfs in carrier-grade edge routers deployed in temperature-variable telco cabinets. IC Role / Device Role / Timing Role: High-reliability boot medium interfacing with MIPS or ARM SoCs via 16-bit parallel bus; leverages 512-byte write buffer for fast firmware updates. Use Value: 1.5 MBps buffer programming cuts OTA update time by >60% vs. single-word programming, minimizing service downtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFIV20 | Same 512 Mb density and 65 nm MIRRORBIT™ core, but 64-ball LAE FBGA (9 mm × 9 mm) package and 90 ns random access (vs. 100 ns) | Targeted at space-constrained router modules where board area is prioritized over TSOP socket compatibility | Select when footprint reduction and slightly faster access justify rework of PCB layout and socket design |
| MX29GL512FHI-90G | Micron 512 Mb parallel NOR; 90 ns access; no integrated hardware ECC; requires external error management | Suitable for cost-sensitive industrial gateways where ECC is handled in software or omitted per functional safety analysis | Choose only if system-level ECC implementation is already in place and BOM cost is primary constraint |
Compared with S29GL512S11DHIV23, the S29GL512S10TFIV20 offers tighter timing and smaller footprint but sacrifices through-hole assembly flexibility, while the MX29GL512FHI-90G reduces cost at the expense of mandatory external ECC handling and lower endurance (100k vs. Infineon's guaranteed 100k).
Availability
S29GL512S11DHIV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical imaging system configuration requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL512S11DHIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-S family targets high-reliability embedded systems requiring XIP-capable NOR flash with industrial and automotive qualification, emphasizing data integrity, long-term retention, and seamless integration with legacy parallel bus architectures.
FAQ
Does S29GL512S11DHIV23 support both 1.8 V and 3.3 V I/O interfaces?
Yes - its Versatile I/O feature allows VIO to operate from 1.65 V to VCC (2.7–3.6 V), enabling direct connection to 1.8 V microcontrollers without level shifters and full compatibility with 3.3 V SoCs. This is confirmed in Section 8.3 of datasheet 001-98285 Rev. *U.
What is the function of the STB pin on this device?
The STB (Strobe) pin is not present on S29GL512S11DHIV23. It appears only on earlier S29GL-P series devices. This part uses standard CE#/OE#/WE# control signals and has no STB pin - verified in the 56-pin TSOP pinout diagram (Section 12.1) and signal descriptions (Section 8).
Can the OTP array be reprogrammed after initial programming?
No - the 1024-byte OTP (One-Time Programmable) array is permanently programmed; once a bit is set to '0', it cannot be changed back to '1'. Each of the two lockable regions can be independently secured via dedicated lock bits, preventing further writes even under reset conditions.
Is AEC-Q100 qualification included in the S29GL512S11DHIV23 ordering code?
No - the 'I' in the suffix indicates Industrial grade (–40°C to +85°C); AEC-Q100 qualification requires explicit automotive suffixes like 'A' (Grade 3) or 'B' (Grade 2). This part is not certified to AEC-Q100, though it shares the same die and process as qualified variants.
S29GL512S11DHIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512S11DHIV23 FAQ
1.How can I place an order for S29GL512S11DHIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S11DHIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S11DHIV23 reliable?
The price and inventory of S29GL512S11DHIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11DHIV23 is usually 5 days.
3.What payment methods are accepted for S29GL512S11DHIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11DHIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S11DHIV23?
S29GL512S11DHIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S11DHIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S11DHIV23?
For technical support, including S29GL512S11DHIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11DHIV23 requirements.
6.How does Aetrix verify that S29GL512S11DHIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL512S11DHIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11DHIV23 meets industry standards.
7.What is the process for return or replacement of S29GL512S11DHIV23?
All S29GL512S11DHIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11DHIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S11DHIV23 part is unused and in its original packaging.
Return procedure for S29GL512S11DHIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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