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Infineon Technologies S29GL512S11DHV023
- Part No.:
- S29GL512S11DHV023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512S11DHV023.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,439
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Product details
Overview
S29GL512S11DHV023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 3.0 V core supply, ×16 data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 100 ns random access time, 15 ns page access time, and supports 512-byte buffer programming for embedded boot code storage in industrial controllers and automotive ECUs.
For engineers reviewing the S29GL512S11DHV023 datasheet, S29GL512S11DHV023 pinout, S29GL512S11DHV023 application, or S29GL512S11DHV023 equivalent, key selection criteria include its 128-kbyte uniform sector erase architecture, internal hardware ECC for single-bit correction, and Versatile I/O support (1.65 V to VCC).
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
The flash integrates a 1024-byte one-time-programmable (OTP) array with two lockable regions, advanced sector protection (ASP) with volatile/non-volatile options, and Common Flash Interface (CFI) compliance for host software compatibility. It operates across –40°C to +105°C (Industrial Plus grade) with 100,000 program/erase cycles and 20-year data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB), enabling full firmware image storage for mid-tier microcontrollers |
| Random access time | 100 ns at full VCC = VIO, meeting real-time boot latency requirements |
| Page access time | 15 ns, accelerating sequential instruction fetch within 32-byte aligned pages |
| Programming buffer | 512 bytes, reducing effective programming time by up to 4× vs. single-word writes |
| ECC capability | Internal hardware single-bit error correction, eliminating need for external ECC logic |
| Operating temperature | –40°C to +105°C (Industrial Plus), qualified for under-hood automotive use |
| Endurance | 100,000 program/erase cycles per sector, supporting field firmware updates |
| Data retention | 20 years at +85°C, ensuring long-term reliability in unpowered storage |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, lead-free, suitable for high-density PCB layouts with thermal and mechanical robustness.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | Word-aligned address bus (25-bit); A24 is MSB for 512 Mb addressing |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports Versatile I/O (1.65 V to VCC) |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low control for data bus output drivers during read operations |
| WE# | Write enable | Active-low strobe for latching address/data during program/erase commands |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low = busy) |
| RESET# | Hardware reset | Active-low asynchronous reset that halts ongoing operations and clears status |
| VCC | Core supply | 3.0 V ±0.3 V core voltage for read/program/erase; no separate VPP required |
| VIO | I/O supply | 1.65 V to VCC, enabling direct interfacing with 1.8 V or 3.3 V host logic |
| WP# | Write protect | Hardware sector protection enable; low = protection active on selected sectors |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse technology | Enables higher density and lower power vs. prior-generation NOR flash, reducing die size and standby current |
| Asynchronous 32-byte page read | Reduces average instruction fetch latency in XIP applications by minimizing address setup overhead |
| Automatic ECC with single-bit correction | Eliminates requirement for external error-handling logic and improves system-level data integrity assurance |
| Uniform 128-kbyte sector erase | Supports deterministic firmware update timing and simplifies flash management layer design |
| Separate 1024-byte OTP array | Provides secure storage for calibration data, keys, or unique identifiers with dual lockable regions |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and calibrated engine maps in Tier-1 ECU modules requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory with deterministic 100 ns read access and 15 ns page-mode latency. Use Value: Enables fast cold-start execution and supports over-the-air (OTA) firmware updates via 128-kbyte sector erase granularity. | Use Scenario: Holding firmware images and configuration data in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: High-reliability parallel NOR flash with 20-year data retention and –40°C to +105°C operation. Use Value: Guarantees long-term firmware integrity without refresh cycles and withstands thermal cycling in enclosed control cabinets. |
| Medical Diagnostic Imaging Boot Memory | Avionics Display System Code Storage |
Use Scenario: Hosting boot loader and safety-critical initialization routines in FDA-regulated imaging equipment with strict data retention mandates. IC Role / Device Role / Timing Role: CFI-compliant NOR flash with internal ECC and 100,000-cycle endurance for periodic calibration updates. Use Value: Meets IEC 62304 software lifecycle requirements through hardware-assisted error correction and verifiable erase cycles. | Use Scenario: Storing display firmware and graphics assets in DO-178C-certified cockpit display units operating in extended temperature ranges. IC Role / Device Role / Timing Role: Industrial Plus grade (–40°C to +105°C) parallel flash with hardware reset and RY/BY# status signaling. Use Value: Ensures deterministic boot behavior after power interruption and supports DO-254 hardware verification via CFI parameter table. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFV023 | Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm) package; identical electrical specs | Requires different PCB footprint and reflow profile due to ball count and layout | Select when board space allows larger BGA and thermal dissipation benefits are needed |
| N25Q512A13ESE40F | Quad SPI interface, 3 V supply, no parallel bus; lacks RY/BY#, WP#, or Versatile I/O | Not pin- or protocol-compatible; requires host driver rewrite and layout redesign | Consider only for new designs prioritizing reduced pin count over XIP performance |
Compared with S29GL512S11TFV023, this TSOP-less VBU BGA variant offers smaller footprint and improved thermal resistance; versus N25Q512A, it retains full parallel XIP capability but demands more host interface resources.
Availability
S29GL512S11DHV023 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware storage, and medical diagnostic imaging systems requiring stable component supply and long-term lifecycle support.
Supply support for S29GL512S11DHV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in flash memory for mission-critical applications.
The GL-S family targets high-reliability embedded systems needing XIP-capable, high-endurance NOR flash with integrated ECC and wide temperature operation - specifically designed for automotive, industrial, and medical firmware storage.
FAQ
Does S29GL512S11DHV023 support execute-in-place (XIP) operation?
Yes. The device supports true XIP operation with 100 ns random access and 15 ns page-mode reads, enabling CPU instruction fetch directly from flash without copying to RAM. Its asynchronous interface and word-aligned addressing ensure deterministic timing for real-time boot sequences.
What is the function of the Versatile I/O (VIO) feature?
VIO allows independent I/O voltage operation from 1.65 V to VCC, enabling direct connection to 1.8 V or 3.3 V host processors without level shifters. This reduces BOM cost and signal integrity risk while maintaining full timing compliance across voltage combinations.
How does the internal ECC work during read operations?
Hardware ECC automatically checks each 512-byte read block and corrects single-bit errors transparently. No software intervention is required, and corrected data is delivered to the host. Uncorrectable multi-bit errors trigger status register flags and RY/BY# assertion for host exception handling.
Can S29GL512S11DHV023 be used in AEC-Q100 Grade 2 automotive applications?
Yes. This specific part number is qualified for AEC-Q100 Grade 2 (–40°C to +105°C), with full characterization of parametric limits, endurance, and data retention across temperature. It includes automotive-specific test coverage and traceable lot documentation per Infineon's automotive quality system.
S29GL512S11DHV023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512S11DHV023 FAQ
1.How can I place an order for S29GL512S11DHV023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S11DHV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S11DHV023 reliable?
The price and inventory of S29GL512S11DHV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11DHV023 is usually 5 days.
3.What payment methods are accepted for S29GL512S11DHV023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11DHV023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S11DHV023?
S29GL512S11DHV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S11DHV023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S11DHV023?
For technical support, including S29GL512S11DHV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11DHV023 requirements.
6.How does Aetrix verify that S29GL512S11DHV023 is sourced from the original manufacturer or authorized distributors?
All S29GL512S11DHV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11DHV023 meets industry standards.
7.What is the process for return or replacement of S29GL512S11DHV023?
All S29GL512S11DHV023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11DHV023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S11DHV023 part is unused and in its original packaging.
Return procedure for S29GL512S11DHV023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512S11DHV023 Tags
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M24C02-WMN6TP
STMicroelectronics
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Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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