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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11FAIV10

Name: S29GL512S11FAIV10
Brand: Infineon Technologies
SKU: S29GL512S11FAIV10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S11FAIV10

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512S11FAIV10.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL512S11FAIV10 from Spansion is a 512-Mbit (64 MByte) 3.0 V-only parallel NOR Flash memory with 110 ns random access time, 65 nm MirrorBit Eclipse process technology, and industrial temperature range (–40°C to +85°C), used for firmware storage and code execution in embedded controllers and network boot loaders.

For engineers reviewing the S29GL512S11FAIV10 datasheet, S29GL512S11FAIV10 pinout, S29GL512S11FAIV10 application, or S29GL512S11FAIV10 equivalent, key selection criteria include sector protection configuration (lowest-address sector protected), V_IO/V_CC voltage flexibility (1.65 V to V_CC, V_CC = 2.7–3.6 V), and Fortified BGA package (LAA064, 11 mm × 13 mm) compatibility with high-reliability industrial PCB layouts.

Technical Context

This device implements a synchronous/asynchronous page-mode interface with dual-plane architecture, supporting byte/word-wide data access and CFI-compliant command sets. It integrates hardware-based sector protection (V1/V2 model codes), DYB (Deep-Protect™) with power-up unprotected state, and Read Password Mode for secure firmware readout control.

Electrical operation conforms to JEDEC-standard 3.0 V core supply with independent V_IO support, enabling interoperability with mixed-voltage SoC buses. Timing adheres to standard parallel NOR timing models including t_ACC = 110 ns, t_CE = 110 ns, and t_OE = 100 ns, verified across full industrial temperature range.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	512 Mbit (64 MByte), organized as 4,194,304 × 16-bit words for direct XIP code execution
Access Time	110 ns max random access time - ensures deterministic boot latency in real-time systems
Supply Voltage	V_CC = 2.7–3.6 V; V_IO = 1.65 V to V_CC - enables interface to 1.8 V or 3.3 V host logic without level shifters
Temperature Range	Industrial: –40°C to +85°C - qualified for deployment in base station control modules and factory automation PLCs
Package	Fortified BGA (LAA064), 11 mm × 13 mm, 64-ball grid - provides mechanical robustness and thermal reliability under vibration stress
Sector Protection	Lowest-address sector protected (V1 model code) - prevents accidental overwrite of bootloader region during field firmware updates
Security Mode	Read Password Mode enabled with DYB power-up unprotected - allows authenticated read access while blocking unauthorized firmware extraction

Pinout & Package

Package: Fortified Ball-Grid Array (LAA064), 11 mm × 13 mm, 64-ball layout, Pb-free, RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address Inputs	23-bit address bus supporting full 512 Mbit addressing space (byte/word mode selectable)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus compatible with Intel and AMD-style NOR interfaces
CE#	Chip Enable	Active-low chip select enabling device participation in memory-mapped bus cycles
OE#	Output Enable	Controls output buffer tri-state; critical for bus sharing with other peripherals
WE#	Write Enable	Controls write latch enable and command register loading during programming/erase sequences
RY/BY#	Ready/Busy Output	Open-drain status signal indicating internal operation completion (e.g., erase, program)
V_CC	Core Power	3.0 V core supply; decoupling required within 10 mm of ball for stable high-speed operation
V_IO	I/O Power	Independent 1.65–3.6 V supply enabling mixed-voltage system integration

Key Features

Feature	Design Value
MirrorBit Eclipse Technology	65 nm process enabling 512 Mbit density in compact BGA package with reduced power consumption vs. prior generation
Dual-Plane Architecture	Enables concurrent read/write operations across planes - improves effective throughput in multitasked boot environments
Hardware Sector Protection	V1-coded lowest-sector lock prevents corruption of primary bootloader without software intervention
Deep-Protect™ (DYB)	Nonvolatile protection bit with configurable power-up state - supports secure field update workflows
CFI Compliance	JEDEC JESD68-compliant Common Flash Interface - enables OS-agnostic flash management in Linux/uClinux and RTOS

Applications

Industrial PLC Firmware Storage

Telecom Base Station Boot Loader

Use Scenario: Persistent storage of ladder logic firmware and configuration parameters in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Nonvolatile code storage with XIP-capable parallel interface; executes directly from memory during cold start.

Use Value: 110 ns access time ensures sub-50 ms boot sequence; industrial temp rating guarantees uptime in unconditioned control cabinets.

Use Scenario: Storing boot firmware and FPGA configuration bitstreams in LTE macrocell baseband units requiring field-upgradable images.

IC Role / Device Role / Timing Role: Primary boot memory mapped at reset vector; supports secure read via password mode for carrier-specific image validation.

Use Value: DYB + Read Password Mode prevents unauthorized firmware extraction while allowing authenticated field updates.

Medical Imaging System BIOS

Railway Signaling Controller Code

Use Scenario: Holding diagnostic BIOS and calibration tables in portable ultrasound and MRI subsystems subject to strict EMC and thermal cycling requirements.

IC Role / Device Role / Timing Role: High-reliability firmware store with hardware sector lock protecting safety-critical initialization routines.

Use Value: Fortified BGA package resists mechanical shock during transport; V1 sector protection blocks accidental reflash of safety-critical startup code.

Use Scenario: Executing SIL-2 compliant train control logic in wayside signaling units deployed along rail corridors with wide ambient temperature swings.

IC Role / Device Role / Timing Role: Deterministic NOR Flash executing real-time control code with guaranteed worst-case 110 ns access latency.

Use Value: –40°C to +85°C operation validated per EN 50121-3-2; sector protection prevents corruption during power-fail recovery sequences.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR Flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10FAIV10	100 ns access time (vs. 110 ns); identical package, voltage, and protection scheme	Better suited for systems requiring tighter boot timing margins	Select when design requires ≤100 ns t_ACC and full backward compatibility is needed
S29GL512S11FAIS10	Same speed and package, but S1 model: highest-address sector protected, DYB power-up unprotected, Read Password Mode	Used where top-sector (e.g., application code) must be locked instead of bottom-sector (bootloader)	Choose when bootloader resides in upper memory map and security policy mandates top-sector protection

Compared with S29GL512S11FAIV10, the S29GL512S10FAIV10 offers faster access for timing-critical boot paths, while S29GL512S11FAIS10 shifts sector lock location and retains password security - both require no PCB redesign but differ in protection scope and timing behavior.

Availability

S29GL512S11FAIV10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom base station boot loader, and medical imaging system BIOS requiring stable component supply across extended lifecycle programs.

Supply support for S29GL512S11FAIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Spansion Inc. was a leading provider of flash memory and microcontrollers, formed from the merger of AMD's and Fujitsu's flash businesses, later acquired by Cypress Semiconductor in 2015.

The S29GL-S family delivers high-density, low-power parallel NOR Flash optimized for code storage and execution in industrial, networking, and automotive control systems with stringent reliability and long-term availability requirements.

FAQ

What does the 'V1' in S29GL512S11FAIV10 signify?

The 'V1' denotes the device configuration: V_IO = 1.65 V to V_CC, V_CC = 2.7–3.6 V, with lowest-address sector protected. This ensures the first sector (typically containing bootloader code) is hardware-locked against accidental erase or program operations, enhancing system-level firmware integrity.

Is S29GL512S11FAIV10 pin-compatible with earlier S29GL-S devices?

Yes - it uses the same LAA064 Fortified BGA package with identical 64-ball layout and pin functions. All address, data, control, and power pins match the S29GL-S family footprint, enabling drop-in replacement where timing and voltage requirements align.

Does this device support both word and byte access modes?

Yes - it supports x16 (word) and x8 (byte) operation via the BYTE# input. When BYTE# = V_IL, the device operates in 16-bit mode; when BYTE# = V_IH, it operates in 8-bit mode with DQ0–DQ7 active, enabling flexible integration with 8-bit microcontrollers or legacy bus architectures.

How is Deep-Protect™ (DYB) configured and controlled?

DYB is a nonvolatile protection bit programmed via standard CFI commands. In the V1 model, DYB powers up in the unprotected state. Once set, it locks all sectors until explicitly cleared using the correct unlock sequence and password - providing persistent, hardware-enforced protection against unauthorized writes.

S29GL512S11FAIV10 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (11x13)

S29GL512S11FAIV10 FAQ

1.How can I place an order for S29GL512S11FAIV10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11FAIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11FAIV10 reliable?

The price and inventory of S29GL512S11FAIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11FAIV10 is usually 5 days.

3.What payment methods are accepted for S29GL512S11FAIV10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11FAIV10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11FAIV10?

S29GL512S11FAIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11FAIV10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11FAIV10?

For technical support, including S29GL512S11FAIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11FAIV10 requirements.

6.How does Aetrix verify that S29GL512S11FAIV10 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11FAIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11FAIV10 meets industry standards.

7.What is the process for return or replacement of S29GL512S11FAIV10?

All S29GL512S11FAIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11FAIV10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11FAIV10 part is unused and in its original packaging.

Return procedure for S29GL512S11FAIV10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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