Infineon Technologies S29GL512S11FAIV20
- Part No.:
- S29GL512S11FAIV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512S11FAIV20.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,311
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL512S11FAIV20 from Spansion is a 512-Mbit (64 MB) 3.0 V-only page-mode NOR Flash memory IC fabricated on 65 nm MirrorBit Eclipse process technology, featuring 110 ns random access time, industrial temperature range (–40°C to +85°C), and Fortified BGA package (LAA064, 11 mm × 13 mm). It supports sector protection with lowest-address sector protected configuration and DYB power-up in unprotected state under PPB Password Mode, used in firmware storage for industrial control systems.
For engineers reviewing the S29GL512S11FAIV20 datasheet, S29GL512S11FAIV20 pinout, S29GL512S11FAIV20 application, or S29GL512S11FAIV20 equivalent, key selection criteria include 110 ns read access timing, VIO = VCC = 2.7–3.6 V operation, PPB-based hardware write protection, industrial-grade thermal reliability, and BGA-64 footprint compatibility with legacy S29GL-S designs.
Technical Context
This device implements a parallel asynchronous interface with address/data multiplexing support, enabling direct CPU bus connection without external glue logic. It uses MirrorBit Eclipse charge-trapping technology to deliver single-bit-per-cell density with enhanced data retention (>20 years) and program/erase endurance (>100K cycles).
The embedded command set includes CFI-compliant identification, sector erase, chip erase, and buffered programming. Protection architecture integrates persistent PPB (Permanent Protection Bit) and volatile DYB (Dynamic Protection Bit), allowing secure firmware update workflows with hardware-enforced write lock at boot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mbit (64 MB) organized as 4,194,304 × 16-bit words |
| Access Time | 110 ns max - determines minimum CPU wait-state insertion for 25 MHz bus operation |
| Supply Voltage | VCC = VIO = 2.7–3.6 V - single-rail simplifies power design vs. dual-voltage NOR |
| Operating Temp | –40°C to +85°C - qualified for industrial ambient environments without derating |
| Package | LAA064 Fortified BGA, 11 mm × 13 mm, 0.8 mm pitch - RoHS-compliant, board-level reliability enhanced |
| Protection Mode | PPB + DYB with lowest-sector protected default and PPB Password Mode - enables secure field firmware updates |
| Data Retention | 20 years at 85°C - validated for long-life embedded deployments without refresh |
Pinout & Package
Package: LAA064 Fortified Ball-Grid Array (64-ball, 11 mm × 13 mm, 0.8 mm pitch), lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 64 MB addressing with A0 LSB |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; multiplexed with address during read/write cycles |
| CE# | Chip Enable | Active-low chip select; controls device power-down and output high-Z state |
| OE# | Output Enable | Active-low read strobe; gates data output drivers independently of CE# |
| WE# | Write Enable | Active-low signal initiating internal program/erase operations and data latching |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low = operation in progress, high = ready |
| VCC | Power Supply | 3.0 V core and I/O supply; decoupling required per JEDEC JESD22-B109 |
| VSS | GND | Digital ground reference for all signals and power domains |
Key Features
| Feature | Design Value |
|---|---|
| MirrorBit Eclipse Technology | 65 nm charge-trapping cell enabling 512 Mbit density with >100K P/E cycles and 20-year data retention |
| PPB + DYB Protection | Hardware-enforced write lock: PPB sets permanent protection state; DYB allows dynamic sector locking during runtime |
| CFI Compliance | Standard Common Flash Interface v1.3 support enables OS-agnostic firmware update tools and auto-detection |
| Page Mode Operation | Reduces sequential access latency to ≤25 ns per word after initial address setup, accelerating code execution |
| Industrial Temperature Range | Full functionality maintained from –40°C to +85°C without performance degradation or timing margin loss |
Applications
| Industrial PLC Firmware Storage | Medical Diagnostic Device Boot Code |
|---|---|
Use Scenario: Storing firmware images and configuration parameters in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Nonvolatile code storage with hardware write protection to prevent unauthorized modification during operation. Use Value: PPB/DYB protection ensures firmware integrity across power cycles; 110 ns access enables deterministic boot timing within 50 ms startup window. | Use Scenario: Holding boot loader and safety-critical diagnostic algorithms in portable ultrasound and MRI control units. IC Role / Device Role / Timing Role: Secure, long-retention storage for certified medical software requiring regulatory traceability and tamper resistance. Use Value: 20-year data retention at 85°C meets IEC 62304 Class C longevity requirements; PPB Password Mode enforces audit-ready write-lock policies. |
| Telecom Base Station Control Plane | Railway Signaling System Configuration |
Use Scenario: Hosting control plane firmware and protocol stacks in LTE/5G remote radio units exposed to wide thermal swings. IC Role / Device Role / Timing Role: High-reliability flash memory interfaced directly to ARM Cortex-A9 application processors via parallel bus. Use Value: Industrial temp rating eliminates need for thermal derating; page mode accelerates firmware decompression during cold start. | Use Scenario: Storing fail-safe interlocking logic and route tables in European Train Control System (ETCS) Level 2 balise readers. IC Role / Device Role / Timing Role: SIL-4 compliant nonvolatile memory with hardware-enforced write protection for safety-critical configuration data. Use Value: Lowest-sector protected configuration prevents corruption of primary boot vector; CFI compliance enables automated field verification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10FAIV20 | 100 ns access time vs. 110 ns; otherwise identical electrical and functional specs | Preferred where tighter read timing margins are required for higher-frequency CPU interfaces | Select when system clock exceeds 25 MHz and zero-wait-state operation is mandatory |
| S29GL512S11FAIV10 | Same speed and package, but highest-address sector protected and DYB power-up in unprotected state | Used where boot vector resides in top sector and legacy compatibility with older firmware layouts is required | Choose for drop-in replacement in existing S29GL-S designs using top-sector protection scheme |
Compared with S29GL512S11FAIV20, the 100 ns variant offers faster read throughput at marginal cost increase, while the V10 version maintains legacy sector protection mapping-both retain identical package, temperature grade, and PPB/DYB security architecture.
Availability
S29GL512S11FAIV20 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical diagnostic device boot code, telecom base station control plane, and railway signaling system configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL512S11FAIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Spansion Inc. was a fabless semiconductor company specializing in flash memory solutions, later acquired by Cypress Semiconductor in 2015 and integrated into Infineon Technologies' memory portfolio.
The S29GL-S family was designed for high-reliability embedded systems requiring deterministic boot, long-term data retention, and hardware-enforced firmware protection-targeting industrial, medical, and transportation applications.
FAQ
What is the VIO voltage requirement for S29GL512S11FAIV20?
S29GL512S11FAIV20 operates with VIO = VCC = 2.7 V to 3.6 V. It does not support split-rail operation; both core and I/O domains share the same supply rail, simplifying power design and eliminating level-shifting components in 3.3 V systems.
Does this device support CFI (Common Flash Interface)?
Yes, S29GL512S11FAIV20 fully complies with CFI specification v1.3. It provides standardized JEDEC ID, vendor-specific parameter tables, and command-set descriptors accessible via standard read commands, enabling automatic detection and configuration by bootloader and flash programming utilities.
How is sector protection configured in the V20 variant?
The V20 suffix indicates lowest-address sector protection with DYB power-up in unprotected state and PPB Password Mode enabled. This configuration locks the first physical sector (typically containing boot vector) at power-on unless explicitly unlocked via password sequence, preventing accidental overwrite during firmware updates.
Is the LAA064 package compatible with standard BGA reflow profiles?
Yes, the LAA064 Fortified BGA package adheres to IPC/JEDEC J-STD-020D moisture sensitivity level 3 and qualifies for standard Pb-free reflow profiles (peak 260°C, 60-second duration above 217°C). Board layout must follow Spansion's recommended pad geometry and stencil aperture design for reliable solder joint formation.
S29GL512S11FAIV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (11x13)
S29GL512S11FAIV20 FAQ
1.How can I place an order for S29GL512S11FAIV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S11FAIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S11FAIV20 reliable?
The price and inventory of S29GL512S11FAIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11FAIV20 is usually 5 days.
3.What payment methods are accepted for S29GL512S11FAIV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11FAIV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S11FAIV20?
S29GL512S11FAIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S11FAIV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S11FAIV20?
For technical support, including S29GL512S11FAIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11FAIV20 requirements.
6.How does Aetrix verify that S29GL512S11FAIV20 is sourced from the original manufacturer or authorized distributors?
All S29GL512S11FAIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11FAIV20 meets industry standards.
7.What is the process for return or replacement of S29GL512S11FAIV20?
All S29GL512S11FAIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11FAIV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S11FAIV20 part is unused and in its original packaging.
Return procedure for S29GL512S11FAIV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512S11FAIV20 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

