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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11FAIV23

Name: S29GL512S11FAIV23
Brand: Infineon Technologies
SKU: S29GL512S11FAIV23
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S11FAIV23

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512S11FAIV23.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL512S11FAIV23 from Spansion is a 512-Mbit (64 MB) 3.0 V-only page-mode NOR Flash memory IC fabricated on 65 nm MirrorBit Eclipse process technology, featuring 110 ns random access time, industrial temperature range (–40°C to +85°C), and Fortified BGA package (LAA064, 11 mm × 13 mm). It supports sector protection with lowest-address sector protected configuration and V_IO = 1.65 V to V_CC, used in boot code storage for industrial PLCs and firmware retention in network edge routers.

For engineers reviewing the S29GL512S11FAIV23 datasheet, S29GL512S11FAIV23 pinout, S29GL512S11FAIV23 application, or S29GL512S11FAIV23 equivalent, key selection criteria include verified 110 ns read timing, V_IO/V_CC voltage decoupling capability, industrial-grade thermal stability, sector-lock configuration (V2), and LAA064 BGA mechanical compatibility.

Technical Context

This device implements a parallel asynchronous interface with address/data multiplexing support via A0–A25 and DQ0–DQ15 pins, enabling direct microprocessor bus connection without glue logic. It uses a command register-based architecture with CFI-compliant identification and supports both standard and password-protected sector erase/write operations.

The embedded algorithm includes chip erase, sector erase, and byte/word program functions compliant with JEDEC JESD21-C standards. Sector protection is implemented via hardware lock bits and software-controlled PPB/DYB registers, with power-up state defined as unprotected for Read Password Mode (V2 suffix).

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	512 Mbit (64 MB) organized as 4,194,304 × 16-bit words
Access Time	110 ns max - defines minimum CPU wait-state requirement for zero-wait-state operation at ≤9 MHz bus frequency
Supply Voltage	V_CC = 2.7–3.6 V; V_IO = 1.65 V to V_CC - enables I/O voltage scaling independent of core voltage
Operating Temperature	–40°C to +85°C - qualified for industrial control and outdoor telecom equipment
Package	LAA064 Fortified BGA, 11 mm × 13 mm, 64-ball array - supports high-density PCB layout with thermal pad for enhanced heat dissipation
Sector Protection	Lowest-address sector protected (V2 model) - prevents accidental overwrite of boot loader region during field firmware updates
Process Technology	65 nm MirrorBit Eclipse - provides improved data retention (>20 years) and write/erase endurance (100K cycles)

Pinout & Package

Package: LAA064 Fortified Ball-Grid Array (64-ball, 0.8 mm pitch, 11 mm × 13 mm footprint, exposed thermal pad).

Pin/Terminal	Circuit Role	Design Meaning
A0–A25	Address Inputs	26-bit address bus supporting full 64 MB addressing space; multiplexed with DQ pins in some configurations
DQ0–DQ15	Data Input/Output	16-bit bidirectional data bus; supports byte/word writes and reads per JEDEC standard
CE#	Chip Enable	Active-low enable controlling device selection; must be asserted before valid address setup
OE#	Output Enable	Active-low control for data bus drivers; determines read data validity timing relative to address
WE#	Write Enable	Active-low signal initiating internal write/erase algorithms; latches command sequences on rising edge
RY/BY#	Ready/Busy Output	Open-drain status indicator - low during embedded operations (erase/program), high when ready
V_CC, V_SS, V_IO	Power Supplies	Separate core (V_CC) and I/O (V_IO) rails allow mixed-voltage system interfacing
WP#/ACC	Write Protect / Acceleration	Hardware sector lock override (WP#) and program acceleration (ACC) for high-speed programming mode

Key Features

Feature	Design Value
65 nm MirrorBit Eclipse Process	Enables 512 Mbit density in compact LAA064 BGA while maintaining >100K erase/write cycles and >20-year data retention
V_IO/V_CC Decoupling	Allows direct interface to 1.8 V or 3.3 V logic without level shifters, reducing BOM count and signal integrity risk
PPB/DYB Password Protection	Supports two-tier security: permanent PPB lock for critical sectors and dynamic DYB lock for field-updatable regions
CFI Compliance	Provides standardized query mode for automatic detection of geometry, timings, and protection features by bootloader firmware
Industrial Temperature Range	Validated operation from –40°C to +85°C ensures reliability in uncontrolled environments like factory automation cabinets

Applications

Industrial PLC Firmware Storage

Telecom Edge Router Boot Memory

Use Scenario: Stores boot loader and real-time OS kernel in programmable logic controllers deployed in manufacturing lines with ambient temperatures up to 70°C.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory mapped directly to ARM Cortex-M7 processor's external memory interface with 110 ns access guarantee.

Use Value: Sector protection (V2) prevents corruption of startup code during remote firmware updates over Modbus TCP.

Use Scenario: Holds FPGA configuration bitstream and Linux kernel image in carrier-grade Ethernet aggregation routers operating in temperature-variable central offices.

IC Role / Device Role / Timing Role: Asynchronous parallel NOR Flash providing deterministic read latency for secure boot verification prior to main CPU initialization.

Use Value: V_IO/V_CC separation allows seamless integration with 1.8 V FPGA I/O banks while maintaining 3.3 V core stability.

Medical Diagnostic Imaging Control

Automotive ADAS Camera Module

Use Scenario: Retains calibration tables and safety-critical boot firmware in ultrasound imaging systems requiring traceable firmware revision history.

IC Role / Device Role / Timing Role: Nonvolatile storage for ISO 13485-compliant firmware with hardware-enabled sector locking to meet IEC 62304 software lifecycle requirements.

Use Value: PPB password mode (V2 variant) enforces dual-authorization for field updates, satisfying regulatory audit trails.

Use Scenario: Stores camera sensor initialization parameters and driver firmware in rear-view ADAS modules mounted near vehicle exteriors.

IC Role / Device Role / Timing Role: High-reliability boot memory operating across –40°C to +85°C with guaranteed 100K write cycles for over-the-air update logging.

Use Value: 65 nm MirrorBit Eclipse process ensures <10 ppm annual data loss rate under automotive thermal cycling stress.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10FAIV23	100 ns access time vs. 110 ns; otherwise identical electrical and mechanical specs	Requires tighter CPU timing budget but enables marginally higher bus clock rates	Select when system timing analysis confirms sub-100 ns read window availability
S29GL512S11FAIS23	Same speed and package, but S23 suffix indicates extended commercial temp (0°C to +85°C) and highest-address sector protection	Not rated for –40°C start-up; unsuitable for outdoor or cold-storage deployments	Choose only for cost-sensitive indoor applications where industrial temp range is unnecessary

Compared with S29GL512S10FAIV23, this part trades 10 ns access speed for relaxed timing margin and lower EMI susceptibility; versus S29GL512S11FAIS23, it adds –40°C capability and reverse-sector protection-critical for field-deployed industrial firmware.

Availability

S29GL512S11FAIV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom edge router boot memory, and medical diagnostic imaging control requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL512S11FAIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Spansion Inc. was a fabless semiconductor company specializing in flash memory solutions, later acquired by Cypress Semiconductor in 2015 and integrated into Infineon Technologies' memory portfolio.

The S29GL-S family delivers high-reliability parallel NOR Flash targeting boot code and firmware storage in mission-critical industrial and networking systems where predictability, data retention, and sector-level security are mandatory.

FAQ

What does the 'V2' suffix indicate in S29GL512S11FAIV23?

The 'V2' suffix specifies two key configuration attributes: (1) V_IO range of 1.65 V to V_CC, enabling flexible I/O voltage scaling, and (2) lowest-address sector protection mode, where the first physical sector (typically containing boot code) is hardware-locked against accidental erasure or programming.

Is S29GL512S11FAIV23 compatible with legacy S29GL-S designs using TSOP packages?

No-S29GL512S11FAIV23 uses the LAA064 Fortified BGA package (11 mm × 13 mm), which is mechanically and thermally incompatible with TSOP-56 or TSOP-48 footprints. PCB redesign and signal integrity revalidation are required due to different ball mapping, impedance profiles, and thermal pad requirements.

Does this device support JEDEC-standard Common Flash Interface (CFI)?

Yes-S29GL512S11FAIV23 implements full CFI compliance per JEDEC JESD68-A, allowing host firmware to auto-detect device geometry, sector architecture, timing parameters, and protection features through standardized query commands issued to address 0x55 at reset.

What is the maximum number of program/erase cycles guaranteed for this part?

Spansion guarantees a minimum of 100,000 program/erase cycles per sector across the full industrial temperature range (–40°C to +85°C), as validated per JEDEC JESD22-A117 reliability testing standards and documented in the S29GL-S datasheet revision 00.

S29GL512S11FAIV23 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (11x13)

S29GL512S11FAIV23 FAQ

1.How can I place an order for S29GL512S11FAIV23 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11FAIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11FAIV23 reliable?

The price and inventory of S29GL512S11FAIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11FAIV23 is usually 5 days.

3.What payment methods are accepted for S29GL512S11FAIV23?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11FAIV23 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11FAIV23?

S29GL512S11FAIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11FAIV23 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11FAIV23?

For technical support, including S29GL512S11FAIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11FAIV23 requirements.

6.How does Aetrix verify that S29GL512S11FAIV23 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11FAIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11FAIV23 meets industry standards.

7.What is the process for return or replacement of S29GL512S11FAIV23?

All S29GL512S11FAIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11FAIV23, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11FAIV23 part is unused and in its original packaging.

Return procedure for S29GL512S11FAIV23:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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