Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11FHB020

Name: S29GL512S11FHB020
Brand: Infineon Technologies
SKU: S29GL512S11FHB020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL512S11FHB020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512S11FHB020.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:4,243

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL512S11FHB020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.

For engineers reviewing the S29GL512S11FHB020 datasheet, S29GL512S11FHB020 pinout, S29GL512S11FHB020 application, or S29GL512S11FHB020 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte programming buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant interface for firmware update compatibility.

Technical Context

This device implements an asynchronous parallel interface with CE#, OE#, and WE# control signals, supporting both standard word programming and multi-word buffered programming up to 512 bytes per operation. Its internal embedded algorithm controller (EAC) manages sector erase, buffer programming, suspend/resume, and automatic ECC generation during write/erase cycles.

The memory array is organized into uniform 128 kB sectors, each individually lockable via Advanced Sector Protection (ASP) using volatile or non-volatile methods. A dedicated 1024-byte OTP array with two lockable regions supports secure boot key storage and device configuration binding.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	512 Mb (64 MB), enabling full firmware image storage for mid-range MCUs without external memory expansion
Random access time	100 ns at VCC = VIO, meeting real-time boot latency requirements for industrial controllers
Page access time	15 ns, allowing rapid sequential reads within 32-byte aligned pages for XIP code execution
Programming buffer	512 bytes, reducing effective programming time by ~4× vs. single-word writes in firmware updates
ECC capability	Internal hardware single-bit error correction, eliminating need for external ECC logic in safety-critical systems
Endurance & retention	100,000 program/erase cycles and 20-year data retention, supporting long-life industrial deployments
Operating temperature	–40°C to +105°C (AEC-Q100 Grade 2), qualified for under-hood automotive and high-ambient industrial use

Pinout & Package

Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.2.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	25-bit address bus supporting full 512 Mb addressing (AMAX = A24); word-aligned only
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports Versatile I/O (VIO = 1.65–3.6 V)
CE#	Chip enable	Active-low chip select; controls device power state and command latching
OE#	Output enable	Active-low read strobe; gates output drivers during asynchronous reads
WE#	Write enable	Active-low write strobe; initiates programming/erase commands and data latching
RY/BY#	Ready/Busy indicator	Open-drain status signal; low during embedded operations (erase/program)
RESET#	Hardware reset	Active-low asynchronous reset; forces device into reading ID mode on release
VCC	Core supply	2.7–3.6 V single supply for core logic, programming, and erase functions
VIO	I/O supply	Independent 1.65–3.6 V supply for interface pins, decoupled from VCC
WP#	Write protect	Hardware sector protection enable; active-low, overrides software protection when asserted

Key Features

Feature	Design Value
65 nm MIRRORBIT™ Eclipse technology	Enables higher density and lower power than previous-generation NOR flash while maintaining reliability
Asynchronous 32-byte page read	Reduces instruction fetch latency in XIP applications by minimizing address setup overhead per word
Automatic hardware ECC	Corrects single-bit errors on-the-fly during read, removing software ECC overhead and improving system MTBF
Advanced Sector Protection (ASP)	Allows independent volatile/non-volatile locking of any 128 kB sector, securing bootloader and calibration data
Separate 1024-byte OTP array	Provides tamper-resistant storage for cryptographic keys and device-specific identifiers with dual lock regions

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot firmware and real-time control algorithms in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP execution with <100 ns random access for deterministic startup.

Use Value: 100,000 erase cycles and 20-year retention ensure firmware integrity over 15+ year equipment lifecycles without field updates.

Use Scenario: Hosting boot code and safety-critical sensor fusion firmware in radar ECU modules deployed under vehicle hood.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 (–40°C to +105°C) parallel NOR flash serving as primary boot source for ARM Cortex-R5 processors.

Use Value: Hardware ECC and ASP prevent corruption from thermal stress or EMI, satisfying ISO 26262 ASIL-B requirements.

Medical Imaging System BIOS

Telecom Base Station Configuration

Use Scenario: Storing diagnostic firmware and calibration tables in portable ultrasound devices requiring regulatory traceability and field-upgradability.

IC Role / Device Role / Timing Role: Secure, CFI-compliant flash with OTP region for storing FDA-mandated device serial and calibration signatures.

Use Value: Dual-lock OTP prevents unauthorized reprogramming of calibration data, supporting IEC 62304 Class C software lifecycle compliance.

Use Scenario: Holding FPGA configuration bitstreams and runtime parameter sets in 5G remote radio units exposed to wide ambient temperature swings.

IC Role / Device Role / Timing Role: High-reliability parallel flash interfaced to Xilinx Zynq SoC via EMIF, supporting hot-swap firmware recovery.

Use Value: 512-byte buffer programming enables sub-second field upgrades over backhaul links, minimizing service downtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFB020	Same die, TSOP-56 package (vs. LAE BGA); 90 ns random access (vs. 100 ns)	Limited board space and thermal dissipation capability; no BGA reflow requirement	Select for legacy PCB designs or cost-sensitive industrial controllers where BGA assembly is unavailable
MX29GL512FHT2I-90G	Macronix part; 90 ns access, 1.8/3.3 V dual I/O supply, no integrated ECC	Requires external ECC logic; lacks OTP array and ASP flexibility	Select when lower unit cost outweighs need for hardware ECC and secure OTP in non-safety-critical telecom infrastructure

Compared with S29GL512S11FHB020, the TSOP variant trades package compactness for marginally faster access, while the Macronix alternative reduces cost but shifts ECC and security implementation burden to system design.

Availability

S29GL512S11FHB020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.

Supply support for S29GL512S11FHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems needing fast, secure, and long-life parallel NOR flash for boot code and firmware storage - especially where XIP performance, AEC-Q100 qualification, and hardware ECC are mandatory.

FAQ

Is S29GL512S11FHB020 pin-compatible with earlier S29GL512P or S29GL512N variants?

No. S29GL512S11FHB020 uses a 64-ball LAE BGA package with different pin mapping and enhanced features including hardware ECC and Versatile I/O. The S29GL512P/N series use older TSOP or BGA packages without ECC and have incompatible command sets and timing parameters.

Does this device support synchronous burst reads or DDR interface modes?

No. S29GL512S11FHB020 is strictly asynchronous and does not support clocked or DDR interfaces. It relies on CE#, OE#, and WE# handshaking for all operations and offers only page-mode (32-byte) and random-access read modes.

Can the OTP array be reprogrammed after initial lock?

No. Once either of the two OTP lock bits is set, that 512-byte region becomes permanently read-only. The lock is irreversible and enforced by dedicated fuse circuitry; no command or voltage sequence can unlock or rewrite a locked OTP segment.

What happens during power loss while a sector erase is in progress?

The device's embedded algorithm controller detects VCC drop below reset threshold and aborts the erase, leaving the sector in a known erased or partially erased state. Subsequent power-on triggers automatic erase suspend recovery, and status register flags indicate incomplete operation for host firmware validation.

S29GL512S11FHB020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (11x13)

S29GL512S11FHB020 FAQ

1.How can I place an order for S29GL512S11FHB020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11FHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11FHB020 reliable?

The price and inventory of S29GL512S11FHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11FHB020 is usually 5 days.

3.What payment methods are accepted for S29GL512S11FHB020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11FHB020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11FHB020?

S29GL512S11FHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11FHB020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11FHB020?

For technical support, including S29GL512S11FHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11FHB020 requirements.

6.How does Aetrix verify that S29GL512S11FHB020 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11FHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11FHB020 meets industry standards.

7.What is the process for return or replacement of S29GL512S11FHB020?

All S29GL512S11FHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11FHB020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11FHB020 part is unused and in its original packaging.

Return procedure for S29GL512S11FHB020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…