My Inquiry
My Account
Infineon Technologies S29GL512S11FHB023
- Part No.:
- S29GL512S11FHB023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512S11FHB023.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,441
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL512S11FHB023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial control and automotive ECUs.
For engineers reviewing the S29GL512S11FHB023 datasheet, S29GL512S11FHB023 pinout, S29GL512S11FHB023 application, or S29GL512S11FHB023 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and TSOP-56 or FBGA packaging options.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages all program/erase operations-including suspend/resume-and enforces command-based protection via status register and CFI-compliant identification.
The internal architecture includes dedicated voltage generators for programming (VPP) and erase (VEH), hardware ECC logic covering all array sectors, and dual-mode sector protection (volatile/non-volatile ASP). The 1024-byte OTP array supports secure silicon region locking with two independent lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB), enabling full firmware image storage for mid-tier microcontrollers |
| Random access time | 100 ns at full VIO = VCC, meeting real-time boot latency requirements |
| Page access time | 15 ns, allowing rapid sequential instruction fetch within 32-byte aligned pages |
| Write buffer size | 512 bytes (256 words), reducing effective programming time by >3× vs. single-word writes |
| ECC capability | On-the-fly single-bit error correction, eliminating need for external ECC logic |
| Sector size | Uniform 128 kB sectors, simplifying firmware partitioning and OTA update management |
| Endurance | 100,000 program/erase cycles per sector, supporting field firmware updates over product lifetime |
| Data retention | 20 years at +85°C, ensuring long-term reliability in unpowered storage |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), JEDEC MO-141AC compliant, 14 mm × 20 mm footprint, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | Word-aligned address bus; A24 = MSB for 512 Mb (225 × 16-bit words) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports high-speed page reads and buffer writes |
| CE# | Chip enable | Active-low device select; controls power state entry/exit and read/write initiation |
| OE# | Output enable | Active-low control for data bus output drivers during read operations |
| WE# | Write enable | Active-low strobe for latching address/data during program/erase command sequences |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; low = operation in progress, high = ready for next command |
| RESET# | Hardware reset | Active-low asynchronous reset that halts ongoing operations and returns device to read mode |
| VCC | Core supply | 2.7–3.6 V single supply powering core logic, memory array, and internal voltage generators |
| VIO | I/O supply | 1.65–VCC versatile I/O voltage, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers |
| WP# | Write protect | Hardware sector protection enable; active-low input to lock/unlock protected sectors |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | Enables 15 ns access to subsequent 32-byte page words after initial 100 ns setup, accelerating XIP execution |
| 512-byte write buffer | Allows burst programming of up to 512 bytes without host intervention, improving firmware update throughput |
| Hardware ECC engine | Corrects single-bit errors on-the-fly during read, removing software overhead and enhancing system robustness |
| Advanced sector protection (ASP) | Supports independent volatile/non-volatile locking per 128 kB sector, preventing accidental firmware corruption |
| Secure OTP array | 1024-byte one-time-programmable region with two lockable zones for keys, calibration data, or serial numbers |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps and diagnostic firmware in AEC-Q100 Grade 2 qualified ECU modules operating at +105°C ambient. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency and 20-year data retention. Use Value: Eliminates external ECC logic and enables safe in-field firmware updates via 128 kB sector erase granularity. | Use Scenario: Holding ladder logic runtime images and configuration parameters in DIN-rail mounted PLCs requiring industrial temperature range (–40°C to +85°C). IC Role / Device Role / Timing Role: Parallel NOR flash serving as primary firmware repository with deterministic read timing and hardware write protection. Use Value: Supports secure field updates using ASP and OTP lock bits, while 512-byte buffer reduces update time by >60% vs. legacy flash. |
| Medical Imaging Boot Loader | Avionics Data Recorder |
Use Scenario: Hosting certified boot loader and safety-critical initialization code in FDA-regulated imaging systems with strict data integrity requirements. IC Role / Device Role / Timing Role: High-reliability flash memory delivering ECC-protected reads and 100,000-cycle endurance for periodic calibration updates. Use Value: Hardware ECC ensures bit-level data integrity without software checksum overhead, meeting IEC 62304 Class C requirements. | Use Scenario: Capturing flight parameter logs and storing avionics configuration in DO-160G-compliant airborne recorders with extended thermal cycling. IC Role / Device Role / Timing Role: Radiation-tolerant (tested) parallel flash used for non-volatile event logging with guaranteed 20-year retention at +85°C. Use Value: Uniform 128 kB sectors simplify cyclic overwrite management; RY/BY# pin enables precise timing control during high-integrity write operations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFB020 | Same density and architecture, but TSOP-56 package with 100 ns tACC at VIO = VCC and –40°C to +85°C grade | Lacks AEC-Q100 qualification and +105°C support; suitable for commercial/industrial only | Select when automotive temperature range is not required and cost optimization is prioritized |
| MX29GL512FHTI-90G | 512 Mb parallel NOR flash from Macronix; 90 ns tACC, no integrated ECC, requires external error handling | No hardware ECC or OTP array; lower immunity to bit flips in harsh environments | Choose only if legacy design compatibility mandates identical pinout and no ECC dependency exists |
Compared with S29GL512S11FHB023, the Infineon S29GL512S10TFB020 trades automotive qualification for lower cost, while the Macronix MX29GL512FHTI-90G omits ECC and OTP-requiring additional system-level error mitigation and security logic.
Availability
S29GL512S11FHB023 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging boot loader deployment requiring stable component supply across extended temperature and lifecycle conditions.
Supply support for S29GL512S11FHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including IATF 16949.
The GL-S family targets mission-critical embedded systems requiring deterministic timing, long-term data integrity, and AEC-Q100 compliance-designed specifically for automotive, industrial, and medical applications demanding verified flash endurance and ECC protection.
FAQ
What is the maximum operating temperature range for S29GL512S11FHB023?
S29GL512S11FHB023 is qualified to AEC-Q100 Grade 2 specifications, supporting continuous operation from –40°C to +105°C. This rating is validated per JEDEC JESD22-A108 and includes thermal cycling, high-temperature operating life, and storage tests confirming performance stability across the full range.
Does this device require separate VPP or high-voltage programming supplies?
No. S29GL512S11FHB023 uses a single 2.7–3.6 V VCC supply for all operations-read, program, and erase. Internal charge pumps generate required high voltages (VPP, VEH) automatically; no external high-voltage source or sequencing is needed.
How does the 512-byte write buffer improve firmware update efficiency?
The 512-byte buffer allows the host to issue one program command followed by up to 256 consecutive 16-bit writes before polling status. This reduces command overhead and bus arbitration delays, achieving up to 1.5 MBps effective programming rate-more than 3× faster than single-word programming.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP (One-Time Programmable) array is permanently programmed using high-voltage pulses; once a bit is set to '0', it cannot be changed back to '1'. Each of the two lockable regions can be independently secured via fuse blow, preventing further writes to that region.
S29GL512S11FHB023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (11x13)
S29GL512S11FHB023 FAQ
1.How can I place an order for S29GL512S11FHB023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S11FHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S11FHB023 reliable?
The price and inventory of S29GL512S11FHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11FHB023 is usually 5 days.
3.What payment methods are accepted for S29GL512S11FHB023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11FHB023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S11FHB023?
S29GL512S11FHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S11FHB023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S11FHB023?
For technical support, including S29GL512S11FHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11FHB023 requirements.
6.How does Aetrix verify that S29GL512S11FHB023 is sourced from the original manufacturer or authorized distributors?
All S29GL512S11FHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11FHB023 meets industry standards.
7.What is the process for return or replacement of S29GL512S11FHB023?
All S29GL512S11FHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11FHB023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S11FHB023 part is unused and in its original packaging.
Return procedure for S29GL512S11FHB023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512S11FHB023 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
