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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11FHIV10

Name: S29GL512S11FHIV10
Brand: Infineon Technologies
SKU: S29GL512S11FHIV10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S11FHIV10

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512S11FHIV10.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL512S11FHIV10 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial control systems.

For engineers reviewing the S29GL512S11FHIV10 datasheet, S29GL512S11FHIV10 pinout, S29GL512S11FHIV10 application, or S29GL512S11FHIV10 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant interface for host BIOS/UEFI compatibility.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability for real-time interrupt handling during flash updates.

The internal architecture includes separate secure silicon region (1024-byte OTP array with dual lockable sectors), advanced sector protection (volatile/non-volatile), and automatic ECC generation/correction on every read-ensuring data integrity without host-side intervention in mission-critical firmware storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	512 Mb (64 MB); supports full firmware image storage for mid-tier microcontrollers and SoCs
Random Access Time	100 ns at VCC = VIO; enables fast XIP execution in real-time embedded applications
Page Access Time	15 ns; allows rapid sequential reads within 32-byte aligned pages for cache-like performance
Write Buffer Size	512 bytes; reduces effective programming time by batching up to 256 words per command
ECC Support	Hardware single-bit correction; eliminates need for external error-handling logic in safety-critical designs
Endurance & Retention	100,000 program/erase cycles / 20 years data retention; suitable for field-upgradable systems with infrequent writes
Operating Temp	–40°C to +105°C (AEC-Q100 Grade 2); qualified for under-hood automotive ECUs and industrial HMIs

Pinout & Package

Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.2.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address Inputs	25-bit word address bus; A24 is MSB for 512 Mb density (2²⁵ × 16 bits)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes and reads per JEDEC standard
CE#	Chip Enable	Active-low chip select; controls device power state and enables address/data latching
OE#	Output Enable	Active-low read strobe; gates output drivers without affecting internal timing or state machine
WE#	Write Enable	Active-low write strobe; initiates command sequences and data latching for program/erase
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during embedded operations, high when ready for next command
VCC	Core Supply	2.7–3.6 V single supply for read/program/erase; eliminates need for separate VPP
VIO	I/O Supply	1.65–3.6 V independent I/O voltage; enables interfacing with 1.8 V, 2.5 V, or 3.3 V controllers

Key Features

Feature	Design Value
65 nm MIRRORBIT™ Eclipse Technology	Enables higher density and lower power vs. older floating-gate NOR, with improved endurance and retention
Asynchronous Page Read (32-byte)	Reduces average read latency in burst-access scenarios such as instruction fetch or configuration table lookup
512-byte Programming Buffer	Accelerates firmware update time by >3× vs. single-word programming, critical for OTA-capable devices
Hardware ECC (Single-Bit Correction)	Guarantees data integrity without software overhead-required for ASIL-B automotive compliance
Advanced Sector Protection (ASP)	Allows independent locking/unlocking of any 128 kB sector via volatile (power-on reset) or non-volatile (permanent) methods

Applications

Automotive Engine Control Unit (ECU)

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated engine maps, diagnostic routines, and bootloader code in AEC-Q100 Grade 2 ECU modules.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency and guaranteed 20-year data retention.

Use Value: Enables safe over-the-air (OTA) firmware updates with sector-level erase isolation and hardware ECC protection against bit flips.

Use Scenario: Holding firmware images and configuration databases for programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: High-reliability parallel NOR flash used for cold-boot initialization and runtime parameter storage with deterministic timing.

Use Value: Supports 100,000+ program/erase cycles and –40°C to +105°C operation, ensuring long-term field reliability without refresh.

Medical Imaging System Boot ROM

Avionics Data Recorder Memory

Use Scenario: Hosting certified boot firmware and safety-critical startup sequences in FDA-regulated imaging equipment.

IC Role / Device Role / Timing Role: Secure, CFI-compliant flash with OTP region for immutable calibration keys and locked boot sector.

Use Value: Dual-lock OTP array prevents unauthorized modification of cryptographic keys or regulatory compliance signatures.

Use Scenario: Capturing and retaining flight-critical telemetry logs in DO-160 qualified avionics recorders.

IC Role / Device Role / Timing Role: Radiation-tolerant, high-endurance flash with suspend/resume capability to preserve log integrity during power transients.

Use Value: Allows interruption and resumption of sector erase during emergency data capture without data loss or corruption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512P11TFIV10	Same density and core specs, but uses 56-pin TSOP package instead of LAE BGA; no Versatile I/O (VIO fixed to VCC)	Limited to PCBs with legacy TSOP footprints; lacks flexible I/O voltage for mixed-voltage host interfaces	Select only when board layout prohibits BGA or when VIO flexibility is unnecessary
MX29GL512FHI-90G	Macronix 512 Mb parallel NOR; 90 ns random access, no integrated ECC, requires external error management	Suitable for cost-sensitive consumer applications where ECC is handled in software or not required	Choose only if system-level ECC is already implemented and footprint compatibility with LAE BGA is verified

Compared with S29GL512P11TFIV10, this part offers superior I/O flexibility and BGA space savings; versus MX29GL512FHI-90G, it provides built-in ECC and AEC-Q100 qualification-critical for functional safety and automotive deployment.

Availability

S29GL512S11FHIV10 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging system boot ROM replacement requiring stable component supply and long-lifecycle support.

Supply support for S29GL512S11FHIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and transportation markets.

The GL-S family targets high-integrity embedded systems needing fast XIP execution, robust firmware storage, and automotive-grade qualification-designed specifically for boot code, secure firmware, and safety-critical configuration data.

FAQ

What is the purpose of the Versatile I/O (VIO) feature?

VIO allows independent setting of the I/O voltage (1.65–3.6 V) separate from core VCC, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters. This simplifies design, reduces BOM count, and improves signal integrity in mixed-voltage systems.

Does S29GL512S11FHIV10 support execute-in-place (XIP) operation?

Yes-it supports true XIP with ≤100 ns random access time and 15 ns page-mode reads, allowing microcontrollers to execute code directly from flash without copying to RAM. The architecture includes dedicated address/data paths and no internal wait states during instruction fetch.

How does the 512-byte write buffer improve firmware update performance?

The buffer enables programming up to 512 bytes in a single embedded operation, achieving 1.5 MBps effective throughput-over 3× faster than single-word programming. This significantly reduces OTA update windows and minimizes system downtime during field upgrades.

Is the OTP region truly one-time programmable and lockable?

Yes-the 1024-byte OTP array is physically one-time programmable with two independently lockable regions. Once locked (via dedicated commands), bits cannot be altered-even with full VPP or high-voltage stress-ensuring permanent storage of cryptographic keys or calibration data.

S29GL512S11FHIV10 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (11x13)

S29GL512S11FHIV10 FAQ

1.How can I place an order for S29GL512S11FHIV10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11FHIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11FHIV10 reliable?

The price and inventory of S29GL512S11FHIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11FHIV10 is usually 5 days.

3.What payment methods are accepted for S29GL512S11FHIV10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11FHIV10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11FHIV10?

S29GL512S11FHIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11FHIV10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11FHIV10?

For technical support, including S29GL512S11FHIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11FHIV10 requirements.

6.How does Aetrix verify that S29GL512S11FHIV10 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11FHIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11FHIV10 meets industry standards.

7.What is the process for return or replacement of S29GL512S11FHIV10?

All S29GL512S11FHIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11FHIV10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11FHIV10 part is unused and in its original packaging.

Return procedure for S29GL512S11FHIV10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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