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Infineon Technologies S29GL512S11FHIV13

Part No.:
S29GL512S11FHIV13
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL512S11FHIV13.pdf
Description:
IC FLASH 512MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,676

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Product details

Overview

S29GL512S11FHIV13 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial control and automotive ECUs.

For engineers reviewing the S29GL512S11FHIV13 datasheet, S29GL512S11FHIV13 pinout, S29GL512S11FHIV13 application, or S29GL512S11FHIV13 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant interface for host BIOS/ROM loader compatibility.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supports both standard and page-mode reads, and uses embedded algorithms for sector erase and buffer programming without external timing control. Its internal state machine handles command execution, status reporting via RY/BY# pin or status register, and automatic ECC generation/correction during read.

The architecture includes dedicated erase voltage and program voltage generators, a 1024-byte OTP array with dual lockable regions, and Advanced Sector Protection (ASP) enabling per-sector volatile/non-volatile locking. It complies with Common Flash Interface (CFI) v1.4 for standardized JEDEC ID and parameter table access.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density 512 Mb (64 MB), organized as 4,194,304 × 16-bit words - supports full firmware image storage for mid-tier microcontrollers.
Random access time 100 ns at VIO = VCC - enables direct XIP execution from flash with minimal CPU stall cycles.
Page access time 15 ns - accelerates sequential instruction fetch within 32-byte aligned pages.
Write buffer size 512 bytes (256 words) - reduces average programming time by batching writes, achieving 1.5 MBps effective throughput.
Erase endurance 100,000 program/erase cycles per sector - ensures long-term field reliability in firmware update-intensive applications.
Data retention 20 years at +85°C - meets automotive and industrial lifecycle requirements without refresh.
Operating temperature –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive modules and high-ambient industrial PLCs.
I/O voltage range 1.65 V to VCC - allows interoperability with 1.8 V, 2.5 V, or 3.3 V logic families without level shifters.

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint. Pin-compatible with legacy S29GLxxxS family devices in same package variant.

Pin/Terminal Circuit Role Design Meaning
A0–A24 Address inputs Word-aligned address bus (A0 LSB); A24 MSB selects up to 4M words (512 Mb).
DQ0–DQ15 Data I/O 16-bit bidirectional data bus; supports byte/word writes and reads per JEDEC standard.
CE# Chip enable Active-low chip select; controls device power state and command latching timing (tCE ≤ 100 ns).
OE# Output enable Active-low read strobe; gates output drivers during read cycles (tOE ≤ 25 ns).
WE# Write enable Active-low write strobe; initiates command sequences and data loading into write buffer.
RY/BY# Ready/Busy indicator Open-drain output; low during embedded operations (erase/program), used for polling-free status monitoring.
RESET# Hardware reset Active-low asynchronous reset; forces device into known state and aborts ongoing operations.
WP# Write protect Active-low hardware sector protection enable; overrides software-based sector locks when asserted.

Key Features

Feature Design Value
Hardware ECC engine Single-bit error correction with automatic detection and transparent repair during read - eliminates need for external ECC logic or software overhead.
512-byte write buffer Enables burst programming of up to 512 bytes in one command - cuts typical firmware update time by >60% vs. single-word programming.
Uniform 128-kB sectors 64 identical erase blocks simplify partitioning for bootloader, app, and config storage - avoids complex wear-leveling in resource-constrained hosts.
Versatile I/O (VIO) Independent 1.65–VCC I/O supply - permits direct interfacing with mixed-voltage SoCs without external level translators.
CFI-compliant interface JEDEC-standardized ID and parameter table accessible at fixed address - enables auto-detection and configuration in UEFI/BIOS and RTOS bootloaders.
OTP array 1024-byte one-time-programmable region with two independently lockable sections - ideal for secure key storage or calibration data binding.

Applications

Automotive Engine Control Unit (ECU) Industrial Programmable Logic Controller (PLC)

Use Scenario: Storing calibrated engine maps, diagnostic routines, and OTA update payloads in engine management systems.

IC Role / Device Role / Timing Role: Non-volatile boot ROM and firmware repository with XIP-capable read performance and AEC-Q100 Grade 2 thermal resilience.

Use Value: Enables deterministic boot timing (<100 ns access) and secure field updates via 128 kB sector erase - critical for ASIL-B functional safety compliance.

Use Scenario: Holding ladder logic programs, I/O configuration tables, and real-time OS kernel images in modular automation controllers.

IC Role / Device Role / Timing Role: Primary firmware storage with hardware ECC and sector-level write protection to prevent corruption during brown-out events.

Use Value: Guarantees 20-year data retention at 85°C ambient and supports hot-swap firmware reload without system reboot.

Medical Imaging System Boot Loader Avionics Display Processor Firmware

Use Scenario: Hosting certified boot firmware and DICOM protocol stacks in portable ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: Secure, tamper-resistant boot memory with OTP-locked calibration constants and CFI-based auto-configuration.

Use Value: Meets IEC 62304 Class C software safety requirements through hardware-enforced write protection and ECC-corrected runtime integrity.

Use Scenario: Storing display controller microcode, font assets, and ARINC 661 widget definitions in cockpit multifunction displays.

IC Role / Device Role / Timing Role: High-reliability parallel flash with suspend/resume capability for concurrent GUI rendering and firmware background updates.

Use Value: Allows seamless UI continuity during 128 kB sector erases via suspend command - eliminates visual flicker or frame drops.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL512S10TFI010 Same density and core specs, but 64-ball LAE FBGA (9 mm × 9 mm) package and 90 ns random access (VIO = VCC). Targeted at space-constrained PCBs where TSOP footprint is prohibitive; lacks AEC-Q100 Grade 2 rating. Select when board area is constrained and industrial-grade temp range suffices.
MX29GL512FHI-90G 512 Mb parallel NOR flash from Macronix; 90 ns access, 1.7–3.6 V VIO, no integrated ECC, CFI v1.3 compliant. Requires external ECC implementation; lower cost but higher validation effort for safety-critical use. Select for cost-sensitive non-safety applications where host-side ECC is already implemented.

Compared with S29GL512S11FHIV13, the Infineon S29GL512S10TFI010 offers superior speed in a smaller package but sacrifices automotive qualification, while the Macronix MX29GL512FHI-90G reduces BOM cost but shifts ECC responsibility to the host - making the original part optimal for AEC-Q100-compliant designs requiring zero-footprint reliability.

Availability

S29GL512S11FHIV13 is available at Aetrix Electronics and suitable for automotive ECU firmware storage, industrial PLC boot code hosting, and medical imaging system boot loaders requiring stable component supply across extended product lifecycles.

Supply support for S29GL512S11FHIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The GL-S family targets mission-critical embedded systems requiring deterministic boot, long-term data integrity, and automotive-grade robustness - designed specifically for ECU, ADAS, and industrial control applications demanding >100k erase cycles and 20-year retention.

FAQ

Does S29GL512S11FHIV13 support execute-in-place (XIP) operation?

Yes, it supports true XIP operation due to its 100 ns random access time and asynchronous parallel interface. The device delivers full 16-bit words on every read cycle without wait states, enabling ARM Cortex-M or Power Architecture cores to fetch and execute instructions directly from flash memory - verified in Infineon's AN219427 application note for automotive boot loaders.

What is the function of the STB pin on this device?

The STB (Strobe) pin is not present on S29GL512S11FHIV13. This pin appears only in the block diagram as a generic label for internal Y-gating control and does not correspond to a physical package pin - confirmed by the official pinout table in Section 12.1 of datasheet 001-98285 Rev. *U, which lists only 56 defined signals including CE#, OE#, WE#, RY/BY#, RESET#, WP#, A0–A24, and DQ0–DQ15.

Can the 512-byte write buffer be used across sector boundaries?

No, the write buffer must be programmed within a single 128 kB sector. Attempting to cross sector boundaries triggers an error condition and aborts the buffer program operation - enforced by the embedded algorithm controller (EAC) as documented in Section 5.2 of the datasheet. Buffer writes are limited to page-aligned (32-byte) increments within one sector.

Is the OTP array accessible after permanent lock?

Once either of the two OTP lock bits is set (via specific unlock/lock command sequence), the corresponding 512-byte region becomes permanently read-only and cannot be reprogrammed or unlocked - this is a hardware fuse behavior confirmed in Section 3.3 and Figure 3-3 of the datasheet. Read access remains fully functional post-lock.

S29GL512S11FHIV13 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
64-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
32M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
110 ns
Voltage - Supply:
1.65V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (11x13)

S29GL512S11FHIV13 FAQ

1.How can I place an order for S29GL512S11FHIV13 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11FHIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11FHIV13 reliable?

The price and inventory of S29GL512S11FHIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11FHIV13 is usually 5 days.

3.What payment methods are accepted for S29GL512S11FHIV13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11FHIV13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11FHIV13?

S29GL512S11FHIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11FHIV13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11FHIV13?

For technical support, including S29GL512S11FHIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11FHIV13 requirements.

6.How does Aetrix verify that S29GL512S11FHIV13 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11FHIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11FHIV13 meets industry standards.

7.What is the process for return or replacement of S29GL512S11FHIV13?

All S29GL512S11FHIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11FHIV13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11FHIV13 part is unused and in its original packaging.

Return procedure for S29GL512S11FHIV13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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