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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11FHIV20

Name: S29GL512S11FHIV20
Brand: Infineon Technologies
SKU: S29GL512S11FHIV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S11FHIV20

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512S11FHIV20.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL512S11FHIV20 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and MIRRORBIT™ Eclipse 65 nm technology. It delivers 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring high reliability and fast XIP execution.

For engineers reviewing the S29GL512S11FHIV20 datasheet, S29GL512S11FHIV20 pinout, S29GL512S11FHIV20 application, or S29GL512S11FHIV20 equivalent, key selection criteria include uniform 128-kbyte sector erase, 512-byte programming buffer throughput (1.5 MBps), Versatile I/O support (1.65 V to VCC), AEC-Q100 Grade 2 qualification, and CFI-compliant interface compatibility.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status monitoring via RY/BY#, data polling, or status register.

The architecture integrates dedicated erase voltage and program voltage generators, on-die ECC logic, and advanced sector protection (ASP) with volatile/non-volatile lock options. The OTP array (1024 bytes, two lockable regions) enables secure configuration storage independent of main array operations.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	512 Mb (64 MB); supports full boot image storage for mid-range microcontrollers without external memory expansion.
Random Access Time	100 ns at VCC = VIO; enables deterministic timing for real-time interrupt response in safety-critical firmware execution.
Page Access Time	15 ns; allows rapid sequential instruction fetch within 32-byte aligned pages during XIP operation.
Programming Buffer	512 bytes; reduces effective programming time by batching up to 256 words per command, improving firmware update efficiency.
ECC Support	Hardware single-bit error correction; eliminates need for external ECC logic and simplifies system-level data integrity design.
Endurance & Retention	100,000 program/erase cycles / 20 years data retention; meets long-lifecycle requirements for industrial automation and automotive ECUs.
Operating Temperature	–40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2); qualified for under-hood and factory-floor deployment.
I/O Voltage Range	VIO = 1.65 V to VCC; enables direct interfacing with mixed-voltage SoCs (e.g., 1.8 V I/O with 3.3 V core).

Pinout & Package

Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.5 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address Inputs	Word-aligned address bus (25-bit); A24 MSB selects upper half of 512 Mb space; no byte addressing.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports simultaneous read/write of one word (16 bits) per cycle.
CE#	Chip Enable	Active-low chip select; controls device power state and enables internal logic only when asserted.
OE#	Output Enable	Active-low read strobe; gates output drivers without affecting internal state or timing.
WE#	Write Enable	Active-low write strobe; initiates command latching or data loading during program/erase sequences.
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during active program/erase, high when ready for next command.
RESET#	Hardware Reset	Active-low asynchronous reset; forces device into known state and aborts ongoing operations.
WP#	Write Protect	Hardware sector lock override; disables program/erase to protected sectors when asserted.

Key Features

Feature	Design Value
Asynchronous Page Read	32-byte aligned page access with 15 ns intra-page timing; accelerates linear code execution in XIP mode.
Uniform Sector Architecture	512 × 128-kbyte sectors; enables granular firmware partitioning (e.g., bootloader, app, config) with independent protection.
Versatile I/O Interface	VIO range 1.65 V to VCC; eliminates level-shifter requirement when interfacing with 1.8 V or 2.5 V controllers.
Embedded Algorithm Controller	On-chip state machine handles full program/erase sequences; reduces host CPU overhead and ensures timing compliance.
Secure OTP Array	1024-byte one-time-programmable region with dual lock bits; stores cryptographic keys or calibration data immune to field reprogramming.
CFI Compliance	Standard Common Flash Interface parameter table; enables automatic driver detection and configuration in Linux/U-Boot environments.

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot firmware and real-time control logic in programmable logic controllers deployed in factory automation lines.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory enabling XIP execution of safety-critical ladder logic with deterministic <100 ns latency.

Use Value: 100,000 erase cycles and 20-year retention ensure firmware integrity over 15+ year equipment lifespans without field replacement.

Use Scenario: Hosting boot code and sensor calibration data for radar processing units in Level 2+ ADAS systems.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified boot memory providing fast random access for cold-start initialization under –40°C to +105°C conditions.

Use Value: Integrated ECC and sector protection prevent corruption from EMI or voltage transients during vehicle cranking events.

Medical Imaging System BIOS

Telecom Base Station Configuration

Use Scenario: Storing diagnostic firmware and regulatory-compliant boot images in portable ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: Secure, tamper-resistant storage for FDA-required boot validation routines using OTP lockable regions.

Use Value: Dual-lock OTP array prevents unauthorized modification of safety-critical startup sequences while allowing field updates to main firmware.

Use Scenario: Holding FPGA configuration bitstreams and runtime parameters in 5G remote radio units operating in outdoor cabinets.

IC Role / Device Role / Timing Role: High-reliability configuration store interfacing directly with 1.8 V FPGAs via Versatile I/O without level shifters.

Use Value: 1.65–3.6 V VIO range matches FPGA I/O voltage tolerance, reducing BOM count and PCB area vs. discrete level translation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFIV20	Same density and architecture, but 100-ball TFBGA (12 mm × 10 mm); lacks TSOP package; identical timing and ECC.	Targeted at space-constrained designs where board area is prioritized over manual assembly or socket compatibility.	Select when footprint reduction and automated assembly outweigh need for through-hole or socket-based prototyping.
MX29GL512FHT2I-90G	Micron part with same 512 Mb density, 90 ns access, but no integrated ECC; requires external error handling logic.	Used in cost-sensitive telecom infrastructure where ECC is implemented in FPGA or SoC rather than flash.	Choose only if host processor provides full ECC coverage and system-level error correction is already architected.

Compared with S29GL512S11FHIV20, the Infineon TFBGA variant trades package flexibility for miniaturization, while the Micron alternative shifts ECC responsibility to the host-making the original optimal for robustness-first embedded designs needing guaranteed on-die error resilience.

Availability

S29GL512S11FHIV20 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.

Supply support for S29GL512S11FHIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.

The GL-S family targets embedded systems needing fast, secure, and long-life parallel NOR flash for boot code and firmware storage-optimized for XIP performance, AEC-Q100 compliance, and seamless integration with legacy 16-bit buses.

FAQ

What is the maximum operating frequency supported by S29GL512S11FHIV20?

The device does not operate synchronously and has no clock input; its performance is defined by access times-not frequency. Maximum effective throughput is determined by 100 ns random access and 15 ns page-mode timing. For sustained reads, page-mode achieves ~66.7 MHz equivalent bandwidth (1/15 ns), but actual system speed depends on bus protocol overhead and controller wait-state configuration.

Does S29GL512S11FHIV20 support byte-level writes?

No. This is a 16-bit word-wide NOR flash; all program operations require writing 16-bit words (DQ0–DQ15) simultaneously. There is no provision for individual byte programming. Partial-word writes must be handled by the host system reading-modifying-writing full words, as the device lacks internal byte masking logic.

How is the 512-byte programming buffer utilized in practice?

The buffer accepts up to 256 consecutive 16-bit words (512 bytes) before committing to flash. Host software loads data sequentially via WE#-strobed writes, then issues a single program command. This reduces total programming time by ~4× versus single-word programming, especially beneficial for firmware updates where contiguous blocks are written.

Can S29GL512S11FHIV20 be used in place of older S29GL512P devices?

No direct drop-in replacement: S29GL512S uses MIRRORBIT™ Eclipse (65 nm) technology with different command set timing and enhanced features (e.g., hardware ECC, Versatile I/O), whereas S29GL512P is based on older 90 nm process and lacks ECC. Migration requires firmware driver updates and validation of timing margins per datasheet Rev. *U.

S29GL512S11FHIV20 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (11x13)

S29GL512S11FHIV20 FAQ

1.How can I place an order for S29GL512S11FHIV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11FHIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11FHIV20 reliable?

The price and inventory of S29GL512S11FHIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11FHIV20 is usually 5 days.

3.What payment methods are accepted for S29GL512S11FHIV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11FHIV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11FHIV20?

S29GL512S11FHIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11FHIV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11FHIV20?

For technical support, including S29GL512S11FHIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11FHIV20 requirements.

6.How does Aetrix verify that S29GL512S11FHIV20 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11FHIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11FHIV20 meets industry standards.

7.What is the process for return or replacement of S29GL512S11FHIV20?

All S29GL512S11FHIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11FHIV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11FHIV20 part is unused and in its original packaging.

Return procedure for S29GL512S11FHIV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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