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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11GHB020

Name: S29GL512S11GHB020
Brand: Infineon Technologies
SKU: S29GL512S11GHB020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S11GHB020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-VFBGA

Datasheet:: S29GL512S11GHB020.pdf

Description:: IC FLASH 512MBIT PARALLEL 56FBGA

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Product details

Overview

S29GL512S11GHB020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports asynchronous read, buffered programming (512-byte write buffer), and uniform 128-kB sector erase - deployed in boot code storage for industrial HMIs and network edge controllers.

For engineers reviewing the S29GL512S11GHB020 datasheet, S29GL512S11GHB020 pinout, S29GL512S11GHB020 application, or S29GL512S11GHB020 equivalent, key selection criteria include verified 100,000 program/erase cycles, CFI-compliant interface, Versatile I/O (1.65–VCC), OTP array support, and TSOP-56/LAA/LAE/VBU package compatibility.

Technical Context

This device implements an embedded algorithm controller (EAC) that executes autonomous program and erase operations without host CPU intervention. Its MIRRORBIT™ Eclipse architecture on 65-nm process enables simultaneous bit-line sensing for faster read throughput and reduced power per operation.

The flash uses word-aligned addressing (A0–A24), supports both CE#- and OE#-controlled read timing, and provides three status monitoring methods: status register polling, data polling, and RY/BY# pin assertion - ensuring deterministic timing control in real-time boot loaders.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	512 Mb (64 MB); supports full firmware image storage for mid-tier microcontrollers
Random Access Time	100 ns at VCC = VIO; meets hard real-time boot latency requirements under full voltage range
Page Access Time	15 ns; enables rapid sequential instruction fetch within 32-byte aligned pages
Write Buffer Size	512 bytes; reduces effective programming time by batching up to 256 words per command
ECC Support	On-die hardware single-bit error correction; eliminates need for external ECC logic in safety-critical boot paths
Endurance & Retention	100,000 program/erase cycles; 20-year data retention at 85°C - validated for industrial lifecycle deployments
Operating Temp	–40°C to +85°C (Industrial grade); qualified per JEDEC JESD22-A108 for thermal cycling reliability

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm, 0.5 mm pitch, lead-free and RoHS compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address Inputs	Word-aligned address bus (25-bit); A24 is MSB for 512 Mb density (2^25 × 16 bits)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports multiplexed read/write transfers with no turnaround delay
CE#	Chip Enable	Active-low device select; controls power state entry and enables multi-device decoding in parallel bus systems
OE#	Output Enable	Active-low read strobe; decouples output driver activation from address setup for timing margin optimization
WE#	Write Enable	Active-low write control; initiates command latching and embedded program/erase sequences
RY/BY#	Ready/Busy Output	Open-drain status indicator; asserts low during internal operations, enabling non-polling interrupt-driven host control
VCC	Core Supply	3.0 V ±0.3 V supply for logic and memory array; powers all internal voltage generators including pump circuits
VIO	I/O Supply	1.65 V to VCC; allows interfacing with 1.8 V, 2.5 V, or 3.3 V host buses without level shifters

Key Features

Feature	Design Value
Asynchronous Page Read	32-byte aligned page access with 15 ns cycle time - accelerates XIP execution of contiguous code segments
512-Byte Programming Buffer	Reduces average programming time by >60% vs. single-word writes; critical for field firmware updates over constrained interfaces
Hardware ECC Engine	Single-bit correction with no software overhead; maintains functional safety compliance (IEC 61508 SIL2) in boot ROM paths
Uniform 128-kB Sector Erase	Predictable 477 kBps erase rate per sector; simplifies wear leveling and partition management in RTOS environments
CFI Parameter Table	Standardized JEDEC JESD68 query structure; enables automatic driver configuration and cross-manufacturer firmware portability

Applications

Industrial HMI Boot Storage

Network Edge Router Firmware

Use Scenario: Stores boot loader and kernel image for ARM Cortex-A7-based human-machine interface panels operating in factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP capability; delivers sub-100 ns instruction fetch latency to meet deterministic startup timing.

Use Value: Eliminates external SRAM copy step during boot; reduces BOM count and power-on initialization time by 32 ms.

Use Scenario: Holds FPGA configuration bitstream and Linux initramfs for carrier-grade Ethernet edge routers deployed in outdoor cabinets.

IC Role / Device Role / Timing Role: Dual-role flash: configuration store (fast page read) and update partition (buffered program/sector erase).

Use Value: Enables zero-downtime firmware rollback via dual-sector atomic swap, leveraging hardware ECC to prevent corruption during brown-out events.

Automotive ADAS Camera Module

Medical Diagnostic Imaging Controller

Use Scenario: Stores calibration data and sensor fusion firmware for AEC-Q100 Grade 2 (–40°C to +105°C) automotive camera modules.

IC Role / Device Role / Timing Role: Secure silicon region (OTP) stores cryptographic keys; main array holds signed firmware images verified at boot.

Use Value: Meets ISO 26262 ASIL-B requirements through hardware ECC, sector lock protection, and 100K-cycle endurance for OTA update logging.

Use Scenario: Hosts DICOM protocol stack and FPGA configuration for portable ultrasound imaging devices requiring FDA Class II compliance.

IC Role / Device Role / Timing Role: Non-volatile storage for certified medical firmware; supports secure field updates via encrypted CFI command sequence.

Use Value: Ensures 20-year data retention at 40°C ambient - validated for lifetime deployment in clinical settings without refresh cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512P11TFB020	Same density and timing, but uses 64-ball LAA FBGA (13×11 mm); no TSOP option	Preferred for space-constrained PCBs where board area is prioritized over manual rework accessibility	Select when footprint miniaturization outweighs hand-soldering serviceability needs
MX29GL512FHT2I-90G	90 ns random access (vs. 100 ns); lacks hardware ECC and OTP array; different CFI implementation	Suitable for cost-sensitive consumer gateways where ECC is handled in software	Choose only if host MCU has dedicated ECC acceleration and firmware update integrity is managed externally

Compared with S29GL512P11TFB020, the S29GL512S11GHB020 offers TSOP-56 reworkability and identical electrical specs; versus MX29GL512FHT2I-90G, it adds hardware ECC, OTP security, and guaranteed 100K-cycle endurance - making it fit for industrial and medical use cases demanding data integrity assurance.

Availability

S29GL512S11GHB020 is available at Aetrix Electronics and suitable for industrial HMI boot storage, network edge router firmware, and medical diagnostic imaging controller designs requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for S29GL512S11GHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The GL-S family targets embedded systems needing robust, high-density parallel NOR flash with XIP performance, hardware ECC, and automotive-grade qualification - designed specifically for mission-critical boot and firmware storage in harsh environments.

FAQ

What is the maximum operating frequency supported for asynchronous reads?

The S29GL512S11GHB020 does not operate on a clock signal; it is fully asynchronous. Its read performance is defined by access times: 100 ns random access and 15 ns page access under VCC = VIO conditions. These values are guaranteed across the full industrial temperature range and do not depend on external clock frequency.

Does this device support burst read mode?

No, the S29GL512S11GHB020 does not support burst read mode. It supports only asynchronous read and page-mode read, where subsequent accesses within the same 32-byte page require only low-order address changes and achieve 15 ns cycle time. Burst mode is not implemented in its command set or timing architecture.

Can the OTP array be reprogrammed after initial programming?

No, the 1024-byte OTP (One-Time Programmable) array consists of two lockable regions that are permanently programmed using high-voltage pulses. Once a region is locked via the appropriate CFI command sequence, its contents cannot be altered - providing immutable storage for cryptographic keys or calibration constants.

How is sector protection configured - via hardware pins or software commands?

Sector protection is configured exclusively via software commands using the Common Flash Interface (CFI) command set. The device supports both volatile (cleared on power cycle) and non-volatile (persistent) protection modes per sector, controlled through specific unlock-bypass-write sequences - no hardware WP# pin dependency is required for standard sector locking.

S29GL512S11GHB020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-VFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-FBGA (9x7)

S29GL512S11GHB020 FAQ

1.How can I place an order for S29GL512S11GHB020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11GHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11GHB020 reliable?

The price and inventory of S29GL512S11GHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11GHB020 is usually 5 days.

3.What payment methods are accepted for S29GL512S11GHB020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11GHB020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11GHB020?

S29GL512S11GHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11GHB020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11GHB020?

For technical support, including S29GL512S11GHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11GHB020 requirements.

6.How does Aetrix verify that S29GL512S11GHB020 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11GHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11GHB020 meets industry standards.

7.What is the process for return or replacement of S29GL512S11GHB020?

All S29GL512S11GHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11GHB020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11GHB020 part is unused and in its original packaging.

Return procedure for S29GL512S11GHB020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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