Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11GHB023

Name: S29GL512S11GHB023
Brand: Infineon Technologies
SKU: S29GL512S11GHB023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL512S11GHB023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-VFBGA

Datasheet:: S29GL512S11GHB023.pdf

Description:: IC FLASH 512MBIT CFI 56FBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,712

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL512S11GHB023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.

For engineers reviewing the S29GL512S11GHB023 datasheet, S29GL512S11GHB023 pinout, S29GL512S11GHB023 application, or S29GL512S11GHB023 equivalent, this device serves as a high-reliability, XIP-capable boot flash for microcontroller-based systems requiring deterministic read latency, robust data retention (20 years), and AEC-Q100-compliant variants.

Technical Context

This device implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling simultaneous bit-line sensing for faster read throughput. Its asynchronous interface uses CE#, OE#, and WE# control signals with RY/BY# status pin, and supports both full-voltage (VCC = VIO) and versatile I/O (VIO = 1.65–VCC) operation modes.

The embedded algorithm controller handles all program/erase operations autonomously, including suspend/resume capability, automatic ECC generation and correction, and sector-level protection via volatile/non-volatile ASP. The 512-byte write buffer enables burst programming at up to 1.5 MBps effective rate.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	512 Mb (64 MB), organized as 4,194,304 × 16-bit words - supports full firmware image storage for mid-tier MCUs.
Random access time	100 ns at full VCC = VIO - ensures sub-10 MHz bus timing compatibility without wait states.
Page access time	15 ns - enables fast sequential reads within 32-byte aligned pages for XIP execution efficiency.
Erase endurance	100,000 program/erase cycles per sector - suitable for field-upgradable firmware with infrequent reprogramming.
Data retention	20 years at 85°C - guarantees long-term reliability in unattended industrial deployments.
Operating voltage	VCC: 2.7–3.6 V; VIO: 1.65–VCC - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic without level shifters.
Temperature grade	Industrial (–40°C to +85°C) - qualified for factory automation, networking, and motor control environments.
Write buffer size	512 bytes - reduces total programming time by batching up to 256 words per command, improving firmware update throughput.

Pinout & Package

Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.5 mm pitch). Pinout validated per Infineon datasheet Rev. *U (2024-06-25), Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	25-bit address bus supporting 4,194,304-word addressing (A24 = MSB); word-aligned only.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports 16-bit MCU interface without byte-lane splitting.
CE#	Chip enable	Active-low chip select; controls device power state and enables read/write/erase operations.
OE#	Output enable	Active-low read strobe; gates output drivers during asynchronous read cycles.
WE#	Write enable	Active-low write strobe; initiates program/erase commands and data latching.
RY/BY#	Ready/busy indicator	Open-drain output signaling active embedded operation (low = busy); eliminates polling overhead.
RESET#	Hardware reset	Active-low asynchronous reset that halts ongoing operations and returns device to read mode.
WP#	Write protect	Active-low hardware lock for top/bottom sectors; complements software-based ASP protection.

Key Features

Feature	Design Value
Hardware ECC engine	Single-bit error correction with automatic detection and correction during read - eliminates need for external ECC logic or software overhead.
512-byte programming buffer	Enables 256-word buffered writes in one command - cuts typical firmware page programming time by >60% vs. byte-by-byte methods.
Suspend/resume capability	Pauses active program or erase to service higher-priority read requests - essential for real-time boot loaders and interrupt-driven systems.
Advanced sector protection (ASP)	Volatile and non-volatile locking per 128-kbyte sector - prevents accidental overwrite of bootloader or calibration data across power cycles.
One-time programmable (OTP) array	1024-byte dedicated region with two lockable segments - stores immutable keys, serial numbers, or security credentials.
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands - enables OS/driver auto-detection and vendor-agnostic firmware tools.

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot code and configuration parameters in programmable logic controllers deployed in factory-floor environments with wide temperature swings and EMI exposure.

IC Role / Device Role / Timing Role: Primary XIP-capable boot flash providing deterministic 100 ns read access to MCU instruction fetch pipeline.

Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity over full equipment lifecycle without recalibration or replacement.

Use Scenario: Holding safety-critical boot firmware for radar processing units in Level 2+ ADAS systems requiring AEC-Q100 Grade 2 qualification.

IC Role / Device Role / Timing Role: Non-volatile boot memory with hardware ECC and sector lock, ensuring verified code execution after cold start or brown-out recovery.

Use Value: Integrated single-bit ECC and ASP prevent silent corruption or unauthorized modification of boot images under automotive ESD and transient conditions.

Networking Equipment Configuration

Medical Imaging System BIOS

Use Scenario: Storing FPGA configuration bitstreams and switch ASIC microcode in enterprise routers and switches operating 24/7 in climate-controlled data centers.

IC Role / Device Role / Timing Role: High-speed parallel flash accessed via 16-bit bus for rapid FPGA reconfiguration and firmware patching.

Use Value: 15 ns page access time accelerates bitstream loading, reducing system boot time and enabling hot-swap firmware updates.

Use Scenario: Hosting BIOS and diagnostic self-test routines in portable ultrasound and MRI console systems requiring regulatory compliance and long-term traceability.

IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware storage with OTP region for device serialization and cryptographic key binding.

Use Value: Dedicated 1024-byte OTP array with dual lock bits meets IEC 62304 and FDA cybersecurity requirements for immutable identity and audit logs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFB020	Same density and core specs; differs in package (64-ball LAE FBGA, 9 mm × 9 mm) and timing (100 ns tACC, same tPACC).	Designed for space-constrained PCB layouts where TSOP footprint is prohibitive; requires different layout and thermal management.	Select when board area is constrained and BGA assembly capability exists.
S29GL512S11DHI020	Identical electrical specs but automotive-grade (AEC-Q100 Grade 2, –40°C to +105°C) and enhanced ESD rating (±8 kV HBM).	Qualified for under-hood automotive use; includes extended reliability testing and lot traceability per IATF 16949.	Select for automotive applications requiring full AEC-Q100 compliance beyond industrial temperature range.

Compared with S29GL512S11GHB023, the TSOP-packaged variant offers easiest drop-in replacement in legacy designs, while the LAE FBGA version trades ease-of-use for miniaturization, and the DHI020 variant adds automotive qualification at no performance cost.

Availability

S29GL512S11GHB023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, networking equipment configuration, and medical imaging system BIOS requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.

Supply support for S29GL512S11GHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems needing deterministic XIP performance, robust data integrity, and long-term firmware storage - optimized for industrial, automotive, and medical applications demanding AEC-Q100 or extended temperature compliance.

FAQ

Does S29GL512S11GHB023 support byte-level writes?

No. This device operates exclusively on 16-bit word boundaries. All read and write operations transfer 16 bits simultaneously via DQ0–DQ15. Byte-level access is not supported - external logic or MCU software must handle byte-to-word alignment if required by the host interface.

What is the function of the STB pin on this device?

The STB (Strobe) pin is not present on S29GL512S11GHB023. It appears only in certain automotive-grade variants (e.g., S29GL512SxxDHI020) for synchronous timing control. The TSOP-packaged S29GL512S11GHB023 uses fully asynchronous operation with CE#, OE#, and WE# only.

Can this flash be used with a 1.8 V I/O interface?

Yes. Its versatile I/O feature supports VIO from 1.65 V to VCC. With VCC = 3.3 V, VIO can be set to 1.8 V, allowing direct connection to 1.8 V logic without level shifters - confirmed in datasheet Section 8.3 and Table 2 on page 73.

Is the OTP array pre-programmed or blank at shipment?

The 1024-byte OTP array is delivered blank and fully programmable. Each of the two lockable regions (512 bytes each) can be independently programmed and permanently locked using dedicated CFI commands - no factory pre-programming is performed unless specified in custom ordering codes.

S29GL512S11GHB023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-VFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR (SLC)

Memory Size:: 512Mbit

Memory Organization:: 64M x 8

Memory Interface:: CFI

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 56-FBGA (9x7)

S29GL512S11GHB023 FAQ

1.How can I place an order for S29GL512S11GHB023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11GHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11GHB023 reliable?

The price and inventory of S29GL512S11GHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11GHB023 is usually 5 days.

3.What payment methods are accepted for S29GL512S11GHB023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11GHB023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11GHB023?

S29GL512S11GHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11GHB023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11GHB023?

For technical support, including S29GL512S11GHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11GHB023 requirements.

6.How does Aetrix verify that S29GL512S11GHB023 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11GHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11GHB023 meets industry standards.

7.What is the process for return or replacement of S29GL512S11GHB023?

All S29GL512S11GHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11GHB023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11GHB023 part is unused and in its original packaging.

Return procedure for S29GL512S11GHB023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

2026-06-27 Machine Vision System: Components, Inspection Applications and Integration Guide

Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

2026-06-23 Electronic Devices and Circuits: Fundamentals, Components and Applications

Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…