Infineon Technologies S29GL512S11GHI020
- Part No.:
- S29GL512S11GHI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-VFBGA
- Datasheet:
-
S29GL512S11GHI020.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,488
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Product details
Overview
S29GL512S11GHI020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and MIRRORBIT™ Eclipse 65 nm technology. It delivers 100 ns random access time, 15 ns page access time, and supports 512-byte buffer programming for embedded boot code storage in industrial and automotive systems operating from –40°C to +105°C.
For engineers reviewing the S29GL512S11GHI020 datasheet, S29GL512S11GHI020 pinout, S29GL512S11GHI020 application, or S29GL512S11GHI020 equivalent, key selection criteria include its asynchronous 16-bit interface, integrated hardware ECC, uniform 128-kB sector erase, Versatile I/O (1.65 V–VCC), and AEC-Q100 Grade 2 qualification.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes autonomous program/erase operations without external timing control. It uses a 32-byte aligned page read architecture where initial access fetches a full page (32 bytes), and subsequent intra-page reads complete in 15 ns via low-order address toggling.
Hardware ECC provides single-bit error correction with automatic detection and correction during read cycles. Sector protection includes both volatile (lock bits) and non-volatile (ASP) methods, and the device features a dedicated 1024-byte OTP array with two lockable regions for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB); supports large boot images and firmware storage in space-constrained designs |
| Random Access Time | 100 ns at VIO = VCC; enables fast XIP execution for real-time microcontroller boot code |
| Page Access Time | 15 ns; allows rapid sequential reads within 32-byte aligned pages for efficient instruction fetch |
| Programming Buffer | 512 bytes; reduces effective programming time by batching up to 256 words per command |
| ECC Support | Internal hardware single-bit correction; eliminates need for external error-handling logic |
| Endurance & Retention | 100,000 program/erase cycles and 20-year data retention; suitable for long-life industrial deployments |
| Operating Temp | –40°C to +105°C (AEC-Q100 Grade 2); qualified for under-hood automotive ECUs and industrial controllers |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.55 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | 25-bit word address bus (A24 = MSB for 512 Mb); supports 32-byte page-aligned addressing |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates across 1.65 V–VCC (Versatile I/O) |
| CE# | Chip enable | Active-low chip select; controls device power state and enables multi-chip addressing |
| OE# | Output enable | Active-low read strobe; gates output drivers during asynchronous read cycles |
| WE# | Write enable | Active-low write strobe; initiates internal program/erase algorithms when combined with command sequences |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; asserts low during embedded operations (program/erase/suspend) |
| WP# | Write protect | Hardware sector protection enable; prevents accidental writes to protected sectors when asserted |
| VCC | Core supply | 3.0 V ±0.3 V supply for core logic, programming, and erase; no separate VPP required |
| VIO | I/O supply | Independent 1.65 V–VCC supply for interface pins; enables mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page fetch with 15 ns intra-page access; optimizes instruction execution speed in XIP applications |
| 512-Byte Programming Buffer | Reduces average programming time by >3× vs. single-word writes; critical for field firmware updates |
| Hardware ECC Engine | Single-bit correction on every read cycle without CPU intervention; improves system reliability in harsh environments |
| Uniform 128-kB Sectors | 64 identically sized sectors simplify BOM management and enable deterministic erase scheduling |
| Secure OTP Array | 1024-byte one-time-programmable region with dual lock bits; stores cryptographic keys or calibration data permanently |
Applications
| Automotive Powertrain ECU | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader and safety-critical engine control firmware in diesel/gasoline ECUs requiring AEC-Q100 Grade 2 compliance. IC Role / Device Role / Timing Role: Non-volatile boot memory with XIP capability and hardware ECC for fault-tolerant code execution. Use Value: 100,000-cycle endurance and 20-year retention ensure firmware integrity over full vehicle lifetime without refresh. | Use Scenario: Holding programmable logic controller firmware and configuration data in factory automation systems operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: High-reliability parallel NOR flash providing deterministic 100 ns read latency for real-time control loop initialization. Use Value: Versatile I/O (1.65 V–3.6 V) enables direct interface with 1.8 V or 3.3 V FPGA/CPLD masters without level shifters. |
| Medical Imaging System Boot ROM | Railway Signaling Controller Memory |
Use Scenario: Storing certified diagnostic imaging firmware in MRI/CT scanners requiring long-term data integrity and regulatory traceability. IC Role / Device Role / Timing Role: Secure, ECC-protected boot memory with OTP region for storing digital signatures and calibration certificates. Use Value: Dedicated 1024-byte OTP array with dual lock bits ensures immutable storage of regulatory-critical parameters. | Use Scenario: Hosting fail-safe control logic in EN 5012x-certified railway signaling hardware deployed in outdoor cabinets with wide temperature swings. IC Role / Device Role / Timing Role: Industrial-grade (–40°C to +105°C) parallel flash supporting cold-start operation and sustained high-temp reliability. Use Value: Uniform 128-kB sectors allow atomic firmware updates without disrupting active safety functions during partial reprogramming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFI020 | Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP package | Used where board space is constrained and BGA assembly is available | Select for compact, high-density PCB layouts; requires BGA reflow capability |
| S29GL512S10TFI020 | Same density and features, but rated for –40°C to +85°C (Industrial grade only) | Targeted at cost-sensitive industrial equipment without extended temp requirements | Choose when AEC-Q100 or +105°C operation is not required |
Compared with S29GL512S11GHI020, the TSOP-packaged variant offers direct drop-in compatibility with legacy socketed designs, while the BGA alternatives trade package flexibility for footprint reduction or cost optimization-selection depends strictly on thermal, mechanical, and qualification constraints.
Availability
S29GL512S11GHI020 is available at Aetrix Electronics and suitable for automotive powertrain ECUs, industrial PLCs, and medical imaging systems requiring stable component supply and long-term lifecycle support.
Supply support for S29GL512S11GHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q standards.
The GL-S family targets high-reliability embedded systems needing fast XIP-capable flash with robust data integrity-designed specifically for automotive ECUs, industrial controllers, and medical devices demanding AEC-Q100 or extended temperature operation.
FAQ
Is S29GL512S11GHI020 pin-compatible with earlier S29GL512P or S29GL512N devices?
No. S29GL512S11GHI020 uses a 56-pin TSOP package with updated pin assignments for Versatile I/O and RY/BY# functionality. It is not mechanically or electrically compatible with legacy P/N variants due to changes in address bus width (A24 vs A23), VIO pin routing, and command set enhancements.
Does this device require an external VPP voltage for programming or erase?
No. S29GL512S11GHI020 integrates on-chip charge pumps for programming and erase voltages. Only a single 3.0 V core supply (VCC = 2.7–3.6 V) and independent I/O supply (VIO = 1.65–VCC) are required-no external high-voltage generator or VPP pin is needed.
How is the 512-byte programming buffer utilized in practice?
The buffer accepts up to 512 consecutive bytes (256 words) in a single write transaction. After loading, a single program command initiates internal buffered programming, completing all 256 words atomically. This eliminates per-word command overhead and reduces total programming time by up to 75% versus standard single-word writes.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP array is physically one-time programmable. Once a bit is set to '0', it cannot be reset to '1'. Two independent lock bits prevent further writes to each 512-byte region-locking is permanent and irreversible, ensuring cryptographic key or calibration data immutability.
S29GL512S11GHI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-FBGA (9x7)
S29GL512S11GHI020 FAQ
1.How can I place an order for S29GL512S11GHI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S11GHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S11GHI020 reliable?
The price and inventory of S29GL512S11GHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11GHI020 is usually 5 days.
3.What payment methods are accepted for S29GL512S11GHI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11GHI020 transactions.
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4.How is shipping managed for S29GL512S11GHI020?
S29GL512S11GHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S11GHI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S11GHI020?
For technical support, including S29GL512S11GHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11GHI020 requirements.
6.How does Aetrix verify that S29GL512S11GHI020 is sourced from the original manufacturer or authorized distributors?
All S29GL512S11GHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11GHI020 meets industry standards.
7.What is the process for return or replacement of S29GL512S11GHI020?
All S29GL512S11GHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11GHI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S11GHI020 part is unused and in its original packaging.
Return procedure for S29GL512S11GHI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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