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Infineon Technologies S29GL512S11GHI023

Part No.:
S29GL512S11GHI023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
56-VFBGA
Datasheet:
AetrixS29GL512S11GHI023.pdf
Description:
IC FLASH 512MBIT PARALLEL 56FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,203

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Product details

Overview

S29GL512S11GHI023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring high reliability and long data retention.

For engineers reviewing the S29GL512S11GHI023 datasheet, S29GL512S11GHI023 pinout, S29GL512S11GHI023 application, or S29GL512S11GHI023 equivalent, key selection criteria include its 128 kB uniform sector erase architecture, 512-byte programming buffer, Versatile I/O (1.65 V–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and TSOP-56/LAA/LAE/VBU package compatibility.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages all program/erase operations, including suspend/resume, status monitoring via RY/BY#, and automatic ECC generation/correction during read.

The flash array is organized into uniform 128 kB sectors, each independently erasable. Sector protection uses advanced methods-volatile (via status register) and non-volatile (via ASP bits)-and includes a dedicated 1024-byte OTP array with two lockable regions for secure configuration storage.

Key Specifications

ParameterValue and Actual Design Meaning
Density512 Mb (64 MB); supports full boot image storage for mid-range microcontrollers
Random Access Time100 ns at VCC = VIO; enables deterministic XIP execution timing in real-time systems
Page Access Time15 ns; allows rapid sequential reads within 32-byte aligned pages
Programming Buffer512 bytes; reduces effective programming time by batching up to 256 words per operation
ECCInternal hardware single-bit correction; eliminates need for external ECC logic in safety-critical designs
Endurance100,000 program/erase cycles per sector; suitable for firmware update partitions with frequent rewrites
Data Retention20 years at +85°C; ensures long-term reliability in unattended industrial deployments

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 20.0 mm × 10.16 mm × 1.2 mm body, JEDEC MO-141AC compliant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A24Address InputsWord-aligned address bus (A24 = MSB); supports 32 MB address space for 512 Mb density
DQ0–DQ15Data I/O16-bit bidirectional data bus; operates at VIO (1.65 V–VCC) independent of core voltage
CE#Chip EnableActive-low device select; controls power state and enables command decoding
OE#Output EnableActive-low read strobe; gates output drivers without affecting internal state
WE#Write EnableActive-low write strobe; initiates program/erase commands and data latching
RY/BY#Ready/Busy OutputOpen-drain status indicator; low during embedded operations, high when ready
RESET#Hardware ResetActive-low asynchronous reset; forces device into reading state and clears internal state
WP#Write ProtectActive-low hardware sector protection enable; overrides software-based protection

Key Features

FeatureDesign Value
Versatile I/O Voltage RangeVIO supports 1.65 V to VCC, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters
Uniform 128 kB Sector ArchitectureEnables precise firmware partitioning and atomic updates without disturbing adjacent code or data regions
Suspend/Resume for Program & EraseAllows temporary interruption of long-duration operations (e.g., 477 kBps sector erase) to service higher-priority interrupts
Common Flash Interface (CFI)Provides standardized parameter table for runtime identification and driver auto-configuration across host platforms
Advanced Sector Protection (ASP)Combines volatile (status register) and non-volatile (lock bits) methods to prevent accidental writes during power transitions

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP capability and deterministic 100 ns read latency.

Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity over extended maintenance intervals without refresh.

Use Scenario: Holding safety-critical boot code and calibration data for radar processing units in Level 2+ ADAS systems.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel NOR flash providing fail-safe startup under –40°C to +105°C ambient conditions.

Use Value: Hardware ECC and sector-level protection prevent corruption from radiation-induced bit flips during vehicle operation.

Medical Imaging System BIOSTelecom Base Station Configuration

Use Scenario: Hosting BIOS and FPGA configuration images in portable ultrasound and MRI subsystems requiring regulatory-compliant reliability.

IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with OTP region for cryptographic keys and calibration constants.

Use Value: Dedicated 1024-byte OTP array with dual lockable regions enables secure provisioning of sensitive parameters during manufacturing.

Use Scenario: Storing field-upgradable firmware and protocol stack configurations in 5G remote radio units exposed to wide temperature swings.

IC Role / Device Role / Timing Role: High-density parallel flash supporting fast page-mode reads for low-latency baseband processor initialization.

Use Value: 15 ns page access time accelerates boot sequence, reducing system downtime during over-the-air (OTA) firmware recovery.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL512S10TFI020Same density and architecture, but TSOP-56 package with 100 ns tACC and industrial (–40°C to +85°C) gradeLacks AEC-Q100 qualification and +105°C operation; unsuitable for automotive under-hood useSelect when cost-sensitive industrial designs do not require extended temperature or automotive certification
MX29GL512FHT2I-90G512 Mb parallel NOR flash from Macronix; 90 ns tACC, 48-ball FBGA, no integrated ECCRequires external ECC implementation; different command set and CFI structureChoose only if existing design already uses MX29GL family and can accommodate software ECC integration

Compared with S29GL512S10TFI020, the S29GL512S11GHI023 adds AEC-Q100 Grade 2 qualification and extended temperature support; versus MX29GL512FHT2I-90G, it provides built-in ECC and tighter timing consistency across voltage/temperature ranges.

Availability

S29GL512S11GHI023 is available at Aetrix Electronics and suitable for industrial control systems, automotive ADAS modules, medical imaging devices, and telecom infrastructure requiring stable component supply and long-term lifecycle assurance.

Supply support for S29GL512S11GHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.

The GL-S family targets high-reliability embedded systems needing robust, pin-compatible NOR flash with enhanced endurance, ECC, and extended temperature operation - especially where legacy parallel interfaces remain essential.

FAQ

What is the maximum operating temperature range for S29GL512S11GHI023?

The S29GL512S11GHI023 is qualified to AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C. This rating applies to both functional performance and data retention specifications, validated per Infineon's automotive qualification test plan. The device maintains full timing compliance and ECC functionality across this entire range.

Does S29GL512S11GHI023 support hardware reset recovery after brown-out events?

Yes. The RESET# pin provides asynchronous hardware reset that forces the device into reading mode, clears internal command registers, and resets the embedded algorithm controller. When asserted during power ramp-up or brown-out, it ensures predictable initialization and prevents spurious writes or corrupted erase states.

Can S29GL512S11GHI023 be used with a 1.8 V I/O interface?

Yes. Its Versatile I/O feature supports VIO from 1.65 V to VCC. With VCC = 3.0 V, VIO may be set to 1.8 V, allowing direct connection to 1.8 V microcontrollers without level-shifting circuitry. All timing parameters in the datasheet are specified and guaranteed for this configuration.

How does the 512-byte programming buffer improve firmware update efficiency?

The buffer allows up to 512 bytes (256 words) to be loaded before initiating a program operation, reducing bus arbitration overhead and minimizing CPU wait states. In practice, this achieves ~1.5 MBps effective programming rate - up to 3× faster than single-word programming - significantly shortening field firmware update windows.

S29GL512S11GHI023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
56-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
32M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
110 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-FBGA (9x7)

S29GL512S11GHI023 FAQ

1.How can I place an order for S29GL512S11GHI023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11GHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11GHI023 reliable?

The price and inventory of S29GL512S11GHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11GHI023 is usually 5 days.

3.What payment methods are accepted for S29GL512S11GHI023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11GHI023 transactions.

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4.How is shipping managed for S29GL512S11GHI023?

S29GL512S11GHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11GHI023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11GHI023?

For technical support, including S29GL512S11GHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11GHI023 requirements.

6.How does Aetrix verify that S29GL512S11GHI023 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11GHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11GHI023 meets industry standards.

7.What is the process for return or replacement of S29GL512S11GHI023?

All S29GL512S11GHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11GHI023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11GHI023 part is unused and in its original packaging.

Return procedure for S29GL512S11GHI023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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