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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11GHIV20

Name: S29GL512S11GHIV20
Brand: Infineon Technologies
SKU: S29GL512S11GHIV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S11GHIV20

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-VFBGA

Datasheet:: S29GL512S11GHIV20.pdf

Description:: IC FLASH 512MBIT PARALLEL 56FBGA

Quantity:: RFQ Add To RFQ list

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Inventory:3,170

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Product details

Overview

S29GL512S11GHIV20 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial control systems.

For engineers reviewing the S29GL512S11GHIV20 datasheet, S29GL512S11GHIV20 pinout, S29GL512S11GHIV20 application, or S29GL512S11GHIV20 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant interface for BIOS/UEFI compatibility.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supporting both random and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via RY/BY# pin, status register, or data polling.

The internal architecture includes a dedicated ECC engine correcting single-bit errors on-the-fly during read, a 1024-byte OTP array with dual lockable regions, and Advanced Sector Protection (ASP) enabling independent volatile/non-volatile locking per 128 kB sector-critical for secure firmware partitioning in automotive ECUs.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	512 Mb (64 MB), organized as 4,194,304 × 16-bit words-supports full firmware images for mid-tier microcontrollers.
Random access time	100 ns at VCC = VIO-enables direct XIP execution without external cache in real-time control loops.
Page access time	15 ns-accelerates sequential instruction fetch within 32-byte aligned pages.
Write buffer size	512 bytes (256 words)-reduces effective programming time by batching writes, improving firmware update efficiency.
ECC capability	Hardware-based single-bit error correction-ensures data integrity without host CPU overhead during boot ROM reads.
Endurance & retention	100,000 program/erase cycles; 20-year data retention-meets long-life requirements for industrial gateways and automotive modules.
Operating temperature	–40°C to +105°C (AEC-Q100 Grade 2)-validated for under-hood automotive applications and high-ambient industrial environments.

Pinout & Package

Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.2.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	Word-aligned address bus (25 bits); A24 MSB selects top 128 kB sector in 512 Mb map.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports 1.65–3.6 V I/O voltage (VIO) independent of core VCC.
CE#	Chip enable	Active-low chip select; enables device for read/write; tCE = 100 ns max (Versatile I/O mode).
OE#	Output enable	Active-low output control; gates DQ outputs during read; tOE = 35 ns max (Versatile I/O mode).
WE#	Write enable	Active-low write strobe; initiates program/erase commands; latches command sequences on rising edge.
RY/BY#	Ready/Busy indicator	Open-drain status output; low during embedded operations (program/erase); enables hardware polling without software overhead.
WP#	Write protect	Hardware sector protection override; disables program/erase when asserted-used for critical boot sector lockdown.
RESET#	Hardware reset	Asynchronous reset input; forces device into standby and clears internal state-required for power-cycle recovery.

Key Features

Feature	Design Value
65 nm MIRRORBIT™ Eclipse technology	Enables higher density and lower power vs. older floating-gate NOR, reducing active read current to 60 mA @ 5 MHz.
Versatile I/O (1.65–3.6 V)	Decouples I/O voltage from core VCC, allowing seamless interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters.
Uniform 128 kB sector architecture	Eliminates complexity of mixed-sector sizes; simplifies flash translation layer (FTL) design and wear leveling in firmware update stacks.
Embedded suspend/resume	Allows interrupting long erase operations (e.g., 477 kBps sector erase) to service high-priority reads-essential for real-time OS responsiveness.
CFI parameter table	Provides standardized JEDEC-compliant identification and timing data at known address offset, enabling auto-configuration in UEFI/BIOS and bootloader portability.

Applications

Automotive Engine Control Unit (ECU)

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated engine maps and diagnostic routines in AEC-Q100 Grade 2 qualified ECU modules.

IC Role / Device Role / Timing Role: Boot ROM executing XIP code during cold start; provides deterministic 100 ns read latency for real-time fuel injection timing.

Use Value: Hardware ECC ensures bit-error resilience in radiation-prone under-hood environments; ASP allows locking boot sectors against unauthorized reprogramming.

Use Scenario: Holding field-upgradable ladder logic and safety-critical firmware in DIN-rail mounted programmable logic controllers.

IC Role / Device Role / Timing Role: Non-volatile firmware repository with 20-year retention; supports over-the-air updates via 512-byte buffered writes (1.5 MBps).

Use Value: Uniform 128 kB sectors simplify FTL management; suspend/resume enables deterministic response to emergency stop interrupts during firmware patching.

Medical Imaging System Boot Memory

Avionics Display Processor Code Storage

Use Scenario: Hosting boot loader and FPGA configuration bitstreams in Class II medical imaging devices requiring long-term reliability.

IC Role / Device Role / Timing Role: Primary boot device accessed at power-on; delivers 15 ns page-mode reads for rapid initialization of image processing pipelines.

Use Value: 100,000 erase cycles exceed typical field lifetime; OTP array secures calibration constants with dual-lock regions preventing accidental overwrite.

Use Scenario: Storing display firmware and graphics assets in DO-178C-certifiable avionics display units operating across extended temperature ranges.

IC Role / Device Role / Timing Role: High-integrity code memory with AEC-Q100 Grade 2 thermal rating (–40°C to +105°C) and hardware ECC for EDAC compliance.

Use Value: CFI interface enables automated flash detection and timing setup in certified bootloader; RY/BY# pin supports deterministic hardware polling in safety-critical contexts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S11TFIV20	Same die, 56-pin TSOP package (vs. 64-ball LAE BGA); no VBU or LAA variants supported.	Limited board space flexibility; less suitable for high-density automotive PCBs requiring fine-pitch BGA routing.	Select when legacy PCB layout or socket-based prototyping requires through-hole or gull-wing packaging.
MX29GL512FHT2I-90G	Macronix part; 90 ns random access (vs. 100 ns); no integrated ECC; requires external error handling.	Lower cost but increases host firmware complexity for error detection/correction in safety-critical use cases.	Choose only where ECC is managed externally and tighter timing margins justify added software validation effort.

Compared with S29GL512S11TFIV20 and MX29GL512FHT2I-90G, the S29GL512S11GHIV20 uniquely combines AEC-Q100 Grade 2 qualification, on-die ECC, and LAE BGA packaging-making it optimal for space-constrained, safety-aware automotive and industrial designs where firmware integrity and thermal robustness are non-negotiable.

Availability

S29GL512S11GHIV20 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging system boot memory applications requiring stable component supply across extended product lifecycles.

Supply support for S29GL512S11GHIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets mission-critical embedded systems requiring deterministic XIP performance, long-term data retention, and automotive-grade reliability-designed specifically for boot code, firmware, and secure configuration storage in harsh environments.

FAQ

Does S29GL512S11GHIV20 support execute-in-place (XIP) operation?

Yes. The device supports true XIP operation with 100 ns random access and 15 ns page-mode reads, enabling direct CPU instruction fetch from flash without copying to RAM. Its architecture includes dedicated address/data paths and no internal wait-state insertion, verified in Infineon's application note AN229222 for ARM Cortex-M and Power Architecture platforms.

What is the function of the WP# pin during sector protection?

The WP# (Write Protect) pin provides hardware-level override of sector protection. When asserted low, it globally disables all program and erase commands-even if software-based Advanced Sector Protection (ASP) is unlocked-preventing accidental modification of critical boot sectors during field updates or debug sessions.

How does the 512-byte write buffer improve firmware update speed?

The buffer allows up to 512 bytes to be loaded before initiating a single embedded program operation, achieving 1.5 MBps effective throughput. This reduces total update time by ~4× versus single-word programming, and minimizes host CPU intervention-verified in benchmark tests using Infineon's FLASHPROG tool with JTAG boundary scan on i.MX6-based reference designs.

Is the OTP array accessible after permanent locking?

No. Once either of the two 512-byte OTP lock bits is programmed (via CFI command 0x60 → 0xD0), that region becomes permanently read-only and cannot be reprogrammed or unlocked. The lock status is retained across power cycles and is verified by reading the CFI Query Structure at offset 0x002E, as defined in Section 7.2 of datasheet 001-98285.

S29GL512S11GHIV20 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-VFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-FBGA (9x7)

S29GL512S11GHIV20 FAQ

1.How can I place an order for S29GL512S11GHIV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11GHIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11GHIV20 reliable?

The price and inventory of S29GL512S11GHIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11GHIV20 is usually 5 days.

3.What payment methods are accepted for S29GL512S11GHIV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11GHIV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11GHIV20?

S29GL512S11GHIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11GHIV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11GHIV20?

For technical support, including S29GL512S11GHIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11GHIV20 requirements.

6.How does Aetrix verify that S29GL512S11GHIV20 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11GHIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11GHIV20 meets industry standards.

7.What is the process for return or replacement of S29GL512S11GHIV20?

All S29GL512S11GHIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11GHIV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11GHIV20 part is unused and in its original packaging.

Return procedure for S29GL512S11GHIV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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