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Infineon Technologies S29GL512S11TFAV10
- Part No.:
- S29GL512S11TFAV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512S11TFAV10.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,639
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Product details
Overview
S29GL512S11TFAV10 from Infineon is a 512 Mb (64 MB), 16-bit parallel NOR flash memory IC with 3.0 V core supply, 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across –40°C to +105°C (Industrial Plus grade) and supports uniform 128-kbyte sector erase, 512-byte buffer programming, and versatile I/O (1.65 V to VCC).
For engineers reviewing the S29GL512S11TFAV10 datasheet, S29GL512S11TFAV10 pinout, S29GL512S11TFAV10 application, or S29GL512S11TFAV10 equivalent, this device serves as a high-reliability, XIP-capable boot and firmware storage solution in automotive infotainment ECUs, industrial PLCs, and telecom baseband modules requiring deterministic read latency and long-term data retention.
Technical Context
The S29GL512S11TFAV10 implements an asynchronous parallel interface with word-aligned addressing (A0–A24), 16-bit DQ bus, and dual power domains: VCC (2.7–3.6 V) for core logic and VIO (1.65–VCC) for I/O buffers. Its embedded algorithm controller (EAC) manages autonomous program/erase operations without host intervention.
It features hardware-based ECC covering all array reads, status register monitoring via RY/BY# pin or data polling, and advanced sector protection (ASP) supporting both volatile lock bits and non-volatile sector lockdown. The device uses MIRRORBIT™ Eclipse 65-nm technology to achieve 100,000 program/erase cycles and 20-year data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB); supports full firmware image storage for mid-tier microcontrollers and DSPs. |
| Random access time (tACC) | 100 ns at full VCC = VIO; enables real-time XIP execution in safety-critical boot code paths. |
| Page access time (tPACC) | 15 ns; allows rapid sequential reads within 32-byte aligned pages for instruction prefetch efficiency. |
| Programming buffer size | 512 bytes; reduces effective programming time by batching up to 256 words per command cycle. |
| ECC capability | Single-bit error correction per 512-byte sector; ensures data integrity without software overhead. |
| Operating temperature | –40°C to +105°C (Industrial Plus grade); qualified for under-hood automotive and factory-floor environments. |
| Endurance & retention | 100,000 program/erase cycles; 20 years data retention at +85°C - meets AEC-Q100 Grade 2 requirements. |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | 25-bit address bus; A24 is MSB for 512 Mb density (225 × 16-bit = 64 MB). |
| DQ0–DQ15 | Data I/O bidirectional bus | 16-bit wide data path; supports byte/word writes and reads; VIO-referenced I/O voltage range 1.65–VCC. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables internal logic during access windows. |
| OE# | Output enable | Active-low control for output drivers; used to gate read data onto DQ bus without affecting internal timing. |
| WE# | Write enable | Active-low strobe for write cycles; initiates command latching and embedded program/erase sequences. |
| RY/BY# | Ready/Busy indicator | Open-drain output; low during active program/erase; enables hardware polling without CPU intervention. |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known state and aborts ongoing embedded operations. |
| VCC | Core supply | 2.7–3.6 V main power; powers core logic, EAC, and voltage generators for program/erase. |
| VIO | I/O supply | 1.65–VCC; independently configurable I/O voltage for interfacing with mixed-voltage SoCs and FPGAs. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page mode read | 32-byte aligned page access with 15 ns intra-page timing - improves instruction fetch throughput over standard random access. |
| Hardware ECC engine | On-the-fly single-bit correction per 512-byte sector - eliminates need for external error-handling firmware in safety-critical systems. |
| Versatile I/O (VIO) | Independent 1.65–VCC I/O rail - enables direct connection to 1.8 V, 2.5 V, or 3.3 V host interfaces without level shifters. |
| Advanced sector protection (ASP) | Volatile and non-volatile lock bits per 128-kB sector - supports secure bootloader partitioning and field-upgrade isolation. |
| OTP array | 1024-byte one-time-programmable region with two lockable sectors - stores cryptographic keys or calibration data permanently. |
Applications
| Automotive Infotainment Head Unit | Industrial Programmable Logic Controller (PLC) |
|---|---|
|
Use Scenario: Storing boot firmware, OS kernel, and UI assets in a head unit requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Primary XIP-capable boot flash providing deterministic <100 ns read latency for ARM Cortex-A7/A53 cores. Use Value: Hardware ECC and 20-year retention ensure firmware integrity over vehicle lifetime; ASP prevents accidental overwrite of secure boot partition. |
Use Scenario: Holding ladder logic programs and configuration data in DIN-rail mounted PLCs operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile program storage with sector-erase granularity enabling incremental firmware updates without full reflash. Use Value: 100,000 erase cycles and –40°C to +105°C operation support >15-year deployment; 512-byte buffer programming cuts update time by 3× vs. byte-wise writes. |
| Telecom Baseband Processing Module | Medical Imaging Control Board |
|
Use Scenario: Hosting FPGA configuration bitstreams and DSP firmware in LTE/5G remote radio units exposed to thermal cycling. IC Role / Device Role / Timing Role: High-density parallel flash interfaced to Xilinx Zynq-7000 PS side for fast configuration load and runtime parameter storage. Use Value: 15 ns page access accelerates FPGA reconfiguration; VIO flexibility simplifies integration with 1.8 V FPGA I/O banks. |
Use Scenario: Storing FDA-certified diagnostic algorithms and calibration tables in portable ultrasound or MRI control boards. IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware repository with OTP key storage and hardware ECC for audit-trail compliance. Use Value: Non-volatile sector locks prevent unauthorized firmware modification; 20-year retention satisfies medical device lifecycle documentation requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFIV10 | Same die and timing, but Industrial (–40°C to +85°C) grade; no +105°C rating. | Lacks extended temperature support; unsuitable for under-hood automotive or high-ambient industrial use. | Select only when ambient operating temperature remains ≤+85°C and cost optimization is prioritized. |
| MX29GL512FPTI-90G | Macronix 512 Mb parallel NOR; 90 ns tACC, no integrated ECC, CFI-compatible but different command set. | Requires external ECC implementation and custom driver adaptation; lower reliability assurance for safety-critical use. | Consider only for legacy designs already using MX29GL family and where ECC is handled in software or external logic. |
Compared with S29GL512S11TFIV10, the S29GL512S11TFAV10 adds guaranteed +105°C operation and tighter thermal derating margins; versus MX29GL512FPTI-90G, it delivers built-in ECC, standardized CFI query, and unified Infineon support infrastructure - reducing validation effort in regulated markets.
Availability
S29GL512S11TFAV10 is available at Aetrix Electronics and suitable for automotive infotainment systems, industrial PLCs, and telecom baseband modules requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant flash memory.
Supply support for S29GL512S11TFAV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.
The GL-S family targets mission-critical embedded systems needing deterministic XIP performance, robust data integrity, and extended temperature operation - specifically designed for automotive, industrial, and communications infrastructure applications.
FAQ
Does S29GL512S11TFAV10 support common flash interface (CFI) queries?
Yes. The device implements a full CFI parameter table accessible via standard command sequences (0x98 at address 0x55). This enables automatic detection of geometry, timing, and command set by host bootloaders and flash utilities without hard-coded assumptions.
What is the function of the STB pin on S29GL512S11TFAV10?
The STB (Strobe) pin is not present on the S29GL512S11TFAV10. It appears only on earlier S29GL-P series devices. This part uses standard CE#/OE#/WE# control signals and has no STB pin - confirmed by the VBU BGA pinout diagram in Rev. *U datasheet Section 12.3.
Can S29GL512S11TFAV10 be used with a 1.8 V I/O interface?
Yes. With VIO supplied at 1.8 V (within 1.65–VCC range) and VCC at ≥1.8 V, the device supports full 16-bit read/write operations at 1.8 V I/O levels. All input thresholds and output drive strengths are specified for 1.8 V VIO in the DC characteristics table (Section 10.5).
Is the OTP array on S29GL512S11TFAV10 field-programmable?
Yes. The 1024-byte OTP array is programmable in-system using standard command sequences (0x60 → 0xD0), with two independent lockable regions. Once locked, each region becomes permanently read-only - verified by OTP lock bit status in the status register and CFI query data.
S29GL512S11TFAV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512S11TFAV10 FAQ
1.How can I place an order for S29GL512S11TFAV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S11TFAV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S11TFAV10 reliable?
The price and inventory of S29GL512S11TFAV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11TFAV10 is usually 5 days.
3.What payment methods are accepted for S29GL512S11TFAV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11TFAV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S11TFAV10?
S29GL512S11TFAV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S11TFAV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S11TFAV10?
For technical support, including S29GL512S11TFAV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11TFAV10 requirements.
6.How does Aetrix verify that S29GL512S11TFAV10 is sourced from the original manufacturer or authorized distributors?
All S29GL512S11TFAV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11TFAV10 meets industry standards.
7.What is the process for return or replacement of S29GL512S11TFAV10?
All S29GL512S11TFAV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11TFAV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S11TFAV10 part is unused and in its original packaging.
Return procedure for S29GL512S11TFAV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512S11TFAV10 Tags
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