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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11TFB020

Name: S29GL512S11TFB020
Brand: Infineon Technologies
SKU: S29GL512S11TFB020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S11TFB020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL512S11TFB020.pdf

Description:: IC FLASH 512MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Inventory:2,619

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Product details

Overview

S29GL512S11TFB020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse technology, supporting single 3.0 V supply (2.7–3.6 V), 100 ns random access time, and 15 ns page access time for embedded boot code storage in industrial control systems.

For engineers reviewing the S29GL512S11TFB020 datasheet, S29GL512S11TFB020 pinout, S29GL512S11TFB020 application, or S29GL512S11TFB020 equivalent, this device delivers verified ECC-enabled reliability, sector-level erase granularity, Versatile I/O compatibility (1.65–3.6 V), and AEC-Q100 Grade 2 automotive qualification - critical for deterministic boot firmware execution.

Technical Context

This parallel NOR flash implements asynchronous read architecture with 32-byte page-aligned access: initial word fetch requires full address decode (100 ns), while subsequent words within same page require only low-order address change (15 ns). Internal hardware ECC provides single-bit error correction without host intervention.

The embedded algorithm controller (EAC) manages all program/erase operations including suspend/resume, status reporting via status register/data polling/RY/BY# pin, and advanced sector protection with volatile/non-volatile lock options. OTP array supports secure configuration storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	512 Mb (64 MB); sufficient for full boot image + firmware + parameter storage in resource-constrained embedded hosts
Random Access Time	100 ns at VIO = VCC; enables deterministic XIP execution latency for real-time OS boot sequences
Page Access Time	15 ns; accelerates sequential instruction fetch within 32-byte aligned pages during code execution
Programming Buffer	512 bytes; reduces effective programming time by batching writes, minimizing host CPU overhead
ECC Support	Internal hardware single-bit correction; eliminates need for external ECC logic or software overhead
Sector Size	128 kB uniform sectors; allows fine-grained firmware update partitioning without erasing entire device
Endurance	100,000 program/erase cycles per sector; supports field firmware updates over 10+ year product lifecycle
Data Retention	20 years at 85°C; ensures long-term reliability in industrial temperature environments

Pinout & Package

Package: 64-ball LAE Fortified BGA (9 mm × 9 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address Inputs	25-bit address bus supporting full 512 Mb addressing (word-aligned, A0 LSB)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; operates at VIO (1.65–3.6 V) independent of VCC
CE#	Chip Enable	Active-low enable controlling device selection; tCE = 100 ns max determines minimum chip select assertion window
OE#	Output Enable	Active-low control for data output gating; tOE = 35 ns max defines read data valid timing margin
WE#	Write Enable	Active-low signal initiating internal program/erase algorithms; latches command sequences
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during embedded operations, enabling non-polling host synchronization
WP#	Write Protect	Hardware sector protection override; disables program/erase when asserted
VCC	Core Supply	3.0 V core power (2.7–3.6 V); powers logic, EAC, and memory array
VIO	I/O Supply	Independent I/O voltage (1.65–3.6 V); enables interface compatibility with diverse host voltage domains
RESET#	Hardware Reset	Asynchronous reset input clearing internal state and aborting ongoing operations

Key Features

Feature	Design Value
Versatile I/O Interface	VIO range 1.65–3.6 V decouples I/O signaling from core VCC, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V microcontrollers without level shifters
Hardware ECC Engine	On-die single-bit error correction eliminates requirement for external ECC logic or software-based correction routines
512-Byte Programming Buffer	Reduces average programming time by >4× vs. single-word writes, improving firmware update throughput in production and field
Uniform 128-kB Sector Architecture	Enables precise firmware partitioning - e.g., separate boot loader, application, and configuration sectors - with independent protection
Suspend/Resume Capability	Allows interruption of long erase operations (e.g., 477 kBps sector erase) to service high-priority reads, preserving system responsiveness

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot firmware and runtime configuration for programmable logic controllers operating continuously in factory automation environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency and 20-year data retention at 85°C.

Use Value: Eliminates external ECC circuitry and supports AEC-Q100 Grade 2 qualified operation up to +105°C ambient, ensuring deterministic startup after thermal cycling.

Use Scenario: Hosting boot code and safety-critical calibration data for radar processing units in autonomous driving systems.

IC Role / Device Role / Timing Role: Secure, high-reliability NOR flash with OTP region for immutable calibration parameters and hardware ECC for ASIL-B compliance.

Use Value: 100,000 erase cycles and sector-level protection allow safe over-the-air (OTA) firmware updates without compromising integrity of safety-critical partitions.

Medical Imaging System BIOS

Telecom Base Station Control Code

Use Scenario: Storing diagnostic BIOS and FPGA configuration bitstreams in portable ultrasound devices requiring regulatory traceability and long shelf life.

IC Role / Device Role / Timing Role: Trusted boot source with CFI-compliant interface for BIOS self-test and secure initialization sequence verification.

Use Value: Common Flash Interface (CFI) table enables automatic host detection of geometry and command set, simplifying bootloader portability across platforms.

Use Scenario: Holding control plane firmware and protocol stack images in 5G baseband units deployed in outdoor cabinets with wide temperature swings.

IC Role / Device Role / Timing Role: High-density parallel flash delivering 1.5 MBps buffered programming speed for rapid field upgrades during maintenance windows.

Use Value: Page-mode read (15 ns) accelerates instruction fetch during real-time radio resource management tasks, reducing jitter in scheduling latency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S11TFI020	Same die, TSOP-56 package (vs. LAE BGA); no VIO flexibility - fixed 3.0 V I/O	Limited to legacy PCBs with through-hole or wide-pitch routing; lacks Versatile I/O for mixed-voltage designs	Select only when board layout prohibits BGA or requires legacy footprint compatibility
MX29GL512FHTI-90G	Macronix part; 90 ns random access (vs. 100 ns), no integrated ECC, CFI support limited to basic geometry	Requires external ECC implementation; less suitable for safety-critical or long-lifecycle deployments	Consider for cost-sensitive consumer applications where ECC and 20-year retention are not required

Compared with S29GL512S11TFB020, the TSOP variant trades packaging flexibility for legacy compatibility, while the Macronix alternative sacrifices ECC and retention for marginal speed gain - making the Infineon BGA variant optimal for automotive and industrial systems demanding robustness and longevity.

Availability

S29GL512S11TFB020 is available at Aetrix Electronics and suitable for industrial control, automotive ADAS, medical imaging, and telecom infrastructure applications requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualification.

Supply support for S29GL512S11TFB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems needing deterministic boot performance, ECC-protected firmware storage, and extended temperature operation - directly addressing requirements in automotive ECUs and industrial HMIs.

FAQ

What is the maximum operating temperature grade supported by S29GL512S11TFB020?

S29GL512S11TFB020 is qualified to AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C ambient. This rating is validated per Infineon's qualification test plan and applies to the LAE BGA package variant specifically. Thermal derating is not required within this range.

Does this device support execute-in-place (XIP) functionality?

Yes - S29GL512S11TFB020 supports true XIP operation due to its fast random access (100 ns) and page-mode read (15 ns) capabilities. The device delivers deterministic instruction fetch timing without requiring data copying to RAM, enabling real-time boot and interrupt response in microcontroller-based systems.

How is hardware write protection implemented on this flash device?

Hardware write protection is implemented via the WP# pin, which globally disables program and erase commands when asserted low. Additionally, Advanced Sector Protection (ASP) allows individual 128 kB sectors to be locked using volatile (power-cycle reset) or non-volatile (permanent until unlock command) methods, controlled through status register bits.

Can the Versatile I/O feature interface directly with a 1.8 V microcontroller?

Yes - the Versatile I/O feature allows VIO to be set between 1.65 V and 3.6 V. When VIO = 1.8 V, all input thresholds and output drive levels comply with 1.8 V logic standards, enabling direct connection to 1.8 V microcontrollers without level-shifting circuitry, provided VCC remains within 2.7–3.6 V.

S29GL512S11TFB020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL512S11TFB020 FAQ

1.How can I place an order for S29GL512S11TFB020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11TFB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11TFB020 reliable?

The price and inventory of S29GL512S11TFB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11TFB020 is usually 5 days.

3.What payment methods are accepted for S29GL512S11TFB020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11TFB020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11TFB020?

S29GL512S11TFB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11TFB020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11TFB020?

For technical support, including S29GL512S11TFB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11TFB020 requirements.

6.How does Aetrix verify that S29GL512S11TFB020 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11TFB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11TFB020 meets industry standards.

7.What is the process for return or replacement of S29GL512S11TFB020?

All S29GL512S11TFB020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11TFB020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11TFB020 part is unused and in its original packaging.

Return procedure for S29GL512S11TFB020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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