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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11TFB023

Name: S29GL512S11TFB023
Brand: Infineon Technologies
SKU: S29GL512S11TFB023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S11TFB023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL512S11TFB023.pdf

Description:: IC FLASH 512MBIT CFI 56TSOP

Quantity:: RFQ Add To RFQ list

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Inventory:4,785

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Product details

Overview

S29GL512S11TFB023 from Infineon is a 512 Mb (64 MB), 16-bit parallel NOR flash memory IC using 65 nm MIRRORBIT™ Eclipse technology, with 128 kB uniform sectors, 512-byte programming buffer, and hardware ECC for single-bit error correction. It operates from 2.7 V to 3.6 V V_CC, supports industrial temperature range (–40°C to +85°C), and delivers 100 ns random access and 15 ns page access for embedded boot code and firmware storage in microcontroller-based systems.

For engineers reviewing the S29GL512S11TFB023 datasheet, S29GL512S11TFB023 pinout, S29GL512S11TFB023 application, or S29GL512S11TFB023 equivalent, key selection criteria include sector-erase granularity, Versatile I/O voltage support (1.65 V to V_CC), OTP array availability, CFI compliance, and AEC-Q100 grade 3 qualification status.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), 16-bit DQ bus, and dedicated control signals (CE#, OE#, WE#, RY/BY#, RESET#). Its embedded algorithm controller (EAC) manages autonomous program/erase operations, suspend/resume capability, and status reporting via status register, data polling, or RY/BY# pin.

The architecture integrates on-die ECC logic, advanced sector protection (volatile/non-volatile lock), and a 1024-byte one-time-programmable (OTP) array split into two lockable regions. It supports both full-V_CC and Versatile I/O modes, enabling interoperability with mixed-voltage host systems without level shifters.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	512 Mb (64 MB); supports large boot images and firmware binaries in space-constrained designs
Interface	Asynchronous parallel ×16; enables direct MPU/MCU bus connection without glue logic
Random Access Time	100 ns at full V_CC; meets real-time boot latency requirements for industrial controllers
Page Access Time	15 ns; accelerates sequential instruction fetch during XIP execution
Programming Buffer	512 bytes; reduces effective programming time by batching up to 256 words per command
ECC	On-die hardware single-bit correction; eliminates need for external ECC logic in safety-critical systems
Endurance	100,000 program/erase cycles per sector; supports field firmware updates over product lifetime
Data Retention	20 years at 85°C; ensures long-term reliability in unattended embedded deployments

Pinout & Package

Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	25-bit word address bus; A24 is MSB for 512 Mb density (2²⁵ × 16 bits)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes and reads without external multiplexing
CE#	Chip enable	Active-low device select; controls power state and enables multi-device decoding
OE#	Output enable	Active-low read strobe; gates output drivers to prevent bus contention
WE#	Write enable	Active-low write strobe; initiates internal program/erase algorithms when combined with command sequences
RY/BY#	Ready/Busy indicator	Open-drain status flag; low during embedded operations, high when ready for next command
RESET#	Hardware reset	Active-low asynchronous reset; forces device into known state and aborts ongoing operations
V_CC	Core supply	2.7–3.6 V single supply for read/program/erase; eliminates need for separate V_PP generator
V_IO	I/O supply	1.65–V_CC versatile I/O; allows interfacing with 1.8 V, 2.5 V, or 3.3 V controllers
WP#	Write protect	Hardware sector lock override; disables program/erase when asserted, independent of software protection

Key Features

Feature	Design Value
Uniform 128-kB sectors	Enables precise firmware partitioning-e.g., separate bootloader, app, and config sectors-with independent erase control
Suspend/resume for program & erase	Allows interrupting long-duration operations (e.g., 477 kBps sector erase) to service higher-priority reads
Common Flash Interface (CFI)	Provides standardized JEDEC-compliant parameter table for automatic driver configuration across toolchains and OS loaders
Secure Silicon Region (OTP)	1024-byte factory-programmable area with dual lock bits; stores cryptographic keys or calibration data permanently
Advanced Sector Protection (ASP)	Combines volatile (SRAM-based) and non-volatile (flash-based) lock bits per sector for flexible, field-updatable security policies

Applications

Industrial PLC Firmware Storage

Automotive Instrument Cluster Boot Memory

Use Scenario: Storing boot firmware and runtime application code for programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and deterministic 100 ns read latency.

Use Value: Uniform 128 kB sectors allow isolated update of application code without erasing bootloader; 20-year retention ensures reliability over 15+ year equipment lifecycles.

Use Scenario: Hosting boot loader and gauge graphics assets in automotive digital instrument clusters requiring AEC-Q100 Grade 3 compliance.

IC Role / Device Role / Timing Role: Certified flash memory for ASIL-B relevant subsystems, supporting secure boot via OTP key storage and hardware ECC.

Use Value: On-die ECC corrects bit flips induced by radiation; ASP and WP# provide layered protection against unauthorized firmware modification.

Medical Imaging System Configuration

Telecom Base Station Field Upgrade Storage

Use Scenario: Holding calibration tables, sensor profiles, and UI assets in portable ultrasound and MRI control units.

IC Role / Device Role / Timing Role: High-reliability data storage with guaranteed 100,000 erase cycles for frequent recalibration updates.

Use Value: 512-byte programming buffer cuts reprogramming time by >3× vs. single-word writes; Versatile I/O simplifies integration with 1.8 V FPGA interfaces.

Use Scenario: Storing field-upgradable protocol stacks and feature modules in carrier-grade 5G baseband units deployed in remote sites.

IC Role / Device Role / Timing Role: Robust firmware archive with CFI support for automated flash driver generation across heterogeneous SoC platforms.

Use Value: CFI table enables plug-and-play compatibility with Linux MTD and U-Boot; 128 kB sector granularity permits atomic module replacement without full image reload.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S11TFI020	Same die, 56-pin TSOP-56 package; no BGA mechanical footprint compatibility	Limited to PCBs with through-hole or edge-mount constraints; lacks LAE BGA thermal performance	Select for legacy board reuse or manual assembly where BGA rework is impractical
MX29GL512FHTI-90G	Macronix part; 90 ns max random access, no integrated ECC, CFI v1.3 vs. v1.4	Requires external ECC implementation; lower endurance (100K vs. same, but no ECC-assisted wear leveling)	Choose only if cost sensitivity outweighs ECC requirement and CFI version compatibility is verified

Compared with S29GL512S11TFB023, the TSOP variant trades BGA miniaturization for assembly simplicity, while the Macronix alternative omits hardware ECC-increasing system-level validation burden for safety-critical use cases.

Availability

S29GL512S11TFB023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and telecom base station field upgrade storage requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 3 qualification.

Supply support for S29GL512S11TFB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including IATF 16949.

The GL-S family targets mission-critical embedded systems needing deterministic boot performance, robust data integrity, and automotive-grade reliability-designed specifically for XIP-capable firmware storage in safety-aware environments.

FAQ

Does S29GL512S11TFB023 support execute-in-place (XIP) operation?

Yes. The device supports true XIP with 15 ns page-mode read access and 100 ns random access, enabling CPU instruction fetch directly from flash without copying to RAM. Its architecture includes dedicated address/data latches and optimized Y-decoder routing to sustain burst reads across 32-byte pages without wait states.

What is the function of the Versatile I/O (VIO) feature?

VIO allows independent setting of I/O voltage (1.65 V to V_CC) separate from core V_CC, enabling direct interfacing with 1.8 V or 2.5 V microcontrollers without external level shifters. This reduces BOM count and signal integrity risk while maintaining full timing compliance per V_IO voltage grade.

How is the 1024-byte OTP array structured and secured?

The OTP region consists of two independently lockable 512-byte blocks. Once locked via dedicated CFI commands or hardware fuse, each block becomes permanently read-only. It is used for storing immutable keys, calibration constants, or serial numbers, and is protected from accidental overwrite by both software commands and WP# assertion.

Can S29GL512S11TFB023 be used in automotive applications beyond Grade 3?

Yes-Infineon offers AEC-Q100 Grade 2 (–40°C to +105°C) variants under different order codes (e.g., S29GL512S11TFB022). The S29GL512S11TFB023 itself is qualified only for Grade 3 (–40°C to +85°C); use Grade 2 versions for under-hood ECUs requiring extended temperature operation.

S29GL512S11TFB023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: -

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR (SLC)

Memory Size:: 512Mbit

Memory Organization:: 64M x 8

Memory Interface:: CFI

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL512S11TFB023 FAQ

1.How can I place an order for S29GL512S11TFB023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11TFB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11TFB023 reliable?

The price and inventory of S29GL512S11TFB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11TFB023 is usually 5 days.

3.What payment methods are accepted for S29GL512S11TFB023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11TFB023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11TFB023?

S29GL512S11TFB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11TFB023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11TFB023?

For technical support, including S29GL512S11TFB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11TFB023 requirements.

6.How does Aetrix verify that S29GL512S11TFB023 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11TFB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11TFB023 meets industry standards.

7.What is the process for return or replacement of S29GL512S11TFB023?

All S29GL512S11TFB023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11TFB023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11TFB023 part is unused and in its original packaging.

Return procedure for S29GL512S11TFB023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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