Infineon Technologies S29GL512S11TFI010
- Part No.:
- S29GL512S11TFI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512S11TFI010.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:507
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL512S11TFI010 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 100 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It implements MIRRORBIT™ Eclipse 65 nm technology with hardware ECC, 128 kB uniform sectors, and 512-byte programming buffer for embedded boot code storage in microcontroller-based systems.
For engineers reviewing the S29GL512S11TFI010 datasheet, S29GL512S11TFI010 pinout, S29GL512S11TFI010 application, or S29GL512S11TFI010 equivalent, this device supports XIP-capable boot firmware storage, sector-level erase control, Versatile I/O (1.65–3.6 V), CFI-compliant interface, and AEC-Q100 Grade 3 qualification - critical for automotive and industrial MCU host designs requiring deterministic read latency and long-term data retention.
Technical Context
This parallel NOR flash operates asynchronously with word-aligned addressing (A0–A24), supporting both single-word and 512-byte buffered programming. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status reporting via RY/BY# pin or status register, and automatic single-bit error correction using on-die ECC logic.
The device features dual protection mechanisms: volatile/non-volatile Advanced Sector Protection (ASP) per 128 kB sector and a dedicated 1024-byte OTP array with two lockable regions. It supports suspend/resume during erase or program, enabling real-time interrupt handling without data corruption risk.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB); supports full firmware image storage for mid-range MCUs |
| Interface | Parallel ×16 asynchronous; requires no clock or protocol stack overhead |
| Access Time | 100 ns random / 15 ns page; enables fast XIP execution from flash without cache penalty |
| Programming Buffer | 512 bytes; reduces average programming time by >3× vs. single-word writes |
| ECC | On-die hardware single-bit correction; eliminates need for external ECC logic or SW overhead |
| Endurance & Retention | 100,000 program/erase cycles / 20 years data retention; validated for automotive ECU lifetime |
| Temperature Grade | Industrial (–40°C to +85°C); qualified per AEC-Q100 Grade 3 for under-hood applications |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | Word-aligned addressing; A24 = MSB for 512 Mb (225 × 16-bit words) |
| DQ0–DQ15 | Data I/O bus | Bi-directional 16-bit data path; supports byte/word reads and writes |
| CE# | Chip enable | Active-low chip select; controls device power state and bus contention |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state |
| WE# | Write enable | Active-low write strobe; initiates command latching or data programming |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal; asserts low during program/erase, high when ready |
| VCC | Core supply | 3.0 V ±0.3 V; powers logic, array, and ECC circuitry |
| VIO | I/O supply | 1.65–3.6 V; independent of VCC for flexible host interface voltage matching |
Key Features
| Feature | Design Value |
|---|---|
| Page mode read (32-byte aligned) | 15 ns subsequent access; enables burst-like throughput for sequential instruction fetch |
| Buffered programming (512 B) | 1.5 MBps effective write rate; minimizes CPU wait states during firmware updates |
| Hardware ECC engine | Single-bit correction with no software intervention; ensures boot reliability over 20-year life |
| Advanced Sector Protection (ASP) | Volatile and non-volatile locking per 128 kB sector; prevents accidental overwrite of bootloader region |
| OTP array (1024 B) | Two lockable regions; stores immutable keys, calibration data, or security credentials |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader and calibrated engine maps in under-hood ECUs subject to thermal cycling and vibration. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 100 ns read latency and AEC-Q100 Grade 3 qualification. Use Value: Eliminates need for external SRAM copy-on-boot; supports secure OTA update via sector-protected reprogramming. | Use Scenario: Holding firmware and configuration data for programmable logic controllers operating in factory-floor environments. IC Role / Device Role / Timing Role: High-reliability parallel flash with 128 kB uniform sectors and suspend/resume for real-time task interruption. Use Value: Enables field firmware upgrades without halting I/O scanning; ASP prevents corruption during brown-out events. |
| Medical Diagnostic Imaging Boot Memory | Avionics Display System Code Storage |
Use Scenario: Hosting boot firmware and safety-critical initialization routines in FDA-regulated imaging equipment. IC Role / Device Role / Timing Role: CFI-compliant NOR flash with 20-year data retention and hardware ECC for integrity verification at power-up. Use Value: Meets IEC 62304 SOUP requirements for Class C software; OTP stores cryptographic keys for secure boot chain. | Use Scenario: Storing display controller firmware and font assets in DO-178C-certified cockpit displays. IC Role / Device Role / Timing Role: Parallel interface flash with -40°C to +85°C operation and 100,000-cycle endurance for mission-critical updates. Use Value: Supports deterministic boot timing and sector-level firmware rollback without external memory management. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFI020 | Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP package | Used where board space is constrained and BGA assembly is available | Select for compact layouts; requires rework-capable PCB process |
| MX29GL512FHI-90G | Macronix 512 Mb parallel NOR; 90 ns random access; no integrated ECC; CFI-compatible but different command set | Lower cost where external ECC or SW error handling is acceptable | Choose only if firmware validation includes ECC coverage and timing margins allow 90 ns vs. 100 ns |
Compared with S29GL512S11TFI010, the TSOP-packaged Infineon variant offers superior integration (on-die ECC, ASP, OTP) and automotive qualification, while the LAE-BGA alternative trades package form factor for identical functionality, and the Macronix part reduces cost at the expense of reliability features and qualification rigor.
Availability
S29GL512S11TFI010 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, medical diagnostic imaging systems, and avionics display systems requiring stable component supply across extended product lifecycles.
Supply support for S29GL512S11TFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT markets.
The GL-S family targets high-reliability embedded systems needing XIP-capable, long-life flash with integrated data integrity and protection - specifically designed for automotive ECUs, industrial controllers, and safety-critical boot memory applications.
FAQ
What is the maximum operating frequency supported by S29GL512S11TFI010?
S29GL512S11TFI010 is an asynchronous parallel NOR flash and does not use a clock signal. Its performance is defined by access times: 100 ns random access and 15 ns page access. These values correspond to effective throughput up to ~10 MBps for sequential reads and 1.5 MBps for buffered programming, independent of system clock frequency.
Does S29GL512S11TFI010 support both 3.3 V and 1.8 V I/O interfaces?
Yes. The Versatile I/O (VIO) feature allows S29GL512S11TFI010 to operate with VIO between 1.65 V and 3.6 V, including 1.8 V and 3.3 V logic levels. VIO is independent of VCC (2.7–3.6 V), enabling direct interfacing with mixed-voltage microcontrollers without level shifters.
How is sector protection implemented, and can it be changed in-system?
Sector protection uses Advanced Sector Protection (ASP) with both volatile (power-on reset) and non-volatile (permanent until unlocked) modes. Protection status is controlled via specific unlock sequences and command registers. Non-volatile protection persists through power cycles and can be modified in-system using valid command sequences, provided the appropriate unlock keys are written first.
Is the 1024-byte OTP array one-time programmable per bit or per byte?
The 1024-byte OTP array is organized into two independently lockable 512-byte regions. Programming is performed via standard write commands, and once a region is locked (via dedicated lock bits), further writes to that region are permanently disabled. Each byte can be programmed individually before locking, but no bits can be erased after programming.
S29GL512S11TFI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512S11TFI010 FAQ
1.How can I place an order for S29GL512S11TFI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S11TFI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S11TFI010 reliable?
The price and inventory of S29GL512S11TFI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11TFI010 is usually 5 days.
3.What payment methods are accepted for S29GL512S11TFI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11TFI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S11TFI010?
S29GL512S11TFI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S11TFI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S11TFI010?
For technical support, including S29GL512S11TFI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11TFI010 requirements.
6.How does Aetrix verify that S29GL512S11TFI010 is sourced from the original manufacturer or authorized distributors?
All S29GL512S11TFI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11TFI010 meets industry standards.
7.What is the process for return or replacement of S29GL512S11TFI010?
All S29GL512S11TFI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11TFI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S11TFI010 part is unused and in its original packaging.
Return procedure for S29GL512S11TFI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512S11TFI010 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

