Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11TFI020

Name: S29GL512S11TFI020
Brand: Infineon Technologies
SKU: S29GL512S11TFI020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL512S11TFI020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL512S11TFI020.pdf

Description:: IC FLASH 512MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:578

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL512S11TFI020 from Infineon is a 512 Mb (64 MB), ×16 parallel NOR flash memory with 3.0 V core supply, 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across –40°C to +85°C (industrial grade), features a 512-byte write buffer, uniform 128-kbyte sectors, and supports suspend/resume during program/erase - deployed in boot code storage for industrial HMIs and network edge controllers.

For engineers reviewing the S29GL512S11TFI020 datasheet, S29GL512S11TFI020 pinout, S29GL512S11TFI020 application, or S29GL512S11TFI020 equivalent, key selection criteria include verified 100,000 program/erase cycles, CFI-compliant interface compatibility, OTP array support for secure configuration, and TSOP-56 mechanical footprint alignment with legacy board layouts.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), 16-bit bidirectional DQ bus, and dedicated control signals (CE#, OE#, WE#, RY/BY#, RESET#). Its embedded algorithm controller (EAC) manages autonomous sector erase and buffer programming without host CPU intervention.

The MIRRORBIT™ Eclipse architecture enables dual-bit-per-cell storage on 65 nm process, delivering density scaling while maintaining XIP-capable read performance. Hardware ECC operates transparently during read, correcting single-bit errors in real time using on-die syndrome calculation and correction logic.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	512 Mb (64 MB), organized as 4,194,304 × 16-bit words - supports full firmware image storage for mid-tier microcontrollers.
Access Time	100 ns random access (VCC = VIO), 15 ns page access - enables deterministic boot timing in real-time systems.
Write Buffer Size	512 bytes (256 words) - reduces effective programming time by >3× vs. single-word writes in firmware update routines.
ECC Support	On-die hardware single-bit error correction - eliminates need for external ECC logic or software overhead in safety-critical reads.
Sector Architecture	Uniform 128-kbyte sectors (512 total) - simplifies partitioning for bootloader, app, and parameter storage with consistent erase granularity.
Endurance & Retention	100,000 program/erase cycles; 20-year data retention at 85°C - validated for industrial deployments with infrequent field updates.
Operating Voltage	VCC = 2.7 V to 3.6 V; VIO = 1.65 V to VCC - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V I/O domains without level shifters.

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP-I, Type 1), 14 mm × 20 mm body, 0.5 mm pitch, JEDEC MO-141AC compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address Inputs	Word-aligned address bus; A24 is MSB for 512 Mb (2²⁵ × 16), enabling full memory mapping without banking logic.
DQ0–DQ15	Data Input/Output	16-bit bidirectional data bus; supports byte-wide access via upper/lower byte enable (not separately signaled - requires external gating).
CE#	Chip Enable	Active-low chip select; controls device power state - deassertion places flash in low-current standby (<100 µA).
OE#	Output Enable	Active-low read strobe; gates output drivers only - does not affect internal timing or current draw during read cycles.
WE#	Write Enable	Active-low write strobe; initiates command latching or data loading into write buffer during programming sequences.
RY/BY#	Ready/Busy Output	Open-drain status indicator; low = operation in progress (program/erase), high = ready - used for polling instead of status register reads.
RESET#	Hardware Reset	Active-low asynchronous reset; aborts ongoing embedded operations and returns device to read mode within 100 ns.
VCC, VSS, VIO	Power Supplies	VCC (2.7–3.6 V) powers core logic; VIO (1.65–VCC) sets I/O voltage - decoupling required per JEDEC TSOP layout guidelines.

Key Features

Feature	Design Value
Asynchronous Page Read	32-byte aligned page access with 15 ns cycle time - accelerates sequential instruction fetch in XIP configurations.
Versatile I/O Interface	VIO range 1.65 V to VCC - permits direct connection to mixed-voltage SoCs (e.g., 1.8 V core + 3.3 V I/O) without external translators.
OTP Array	1024-byte one-time-programmable region with two lockable sectors - stores immutable keys or calibration data resistant to field reprogramming.
Advanced Sector Protection	Volatile and non-volatile locking per 128-kbyte sector - enables runtime protection of bootloader region while allowing app partition updates.
CFI Compliance	Standard Common Flash Interface parameter table at fixed address - enables automatic driver detection and configuration in Linux MTD or U-Boot.

Applications

Industrial HMI Boot Storage

Network Edge Router Firmware

Use Scenario: Storing boot loader and kernel image for ARM Cortex-A series-based human-machine interface panels operating in factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability; delivers sub-100 ns instruction fetch latency to meet deterministic boot deadlines.

Use Value: Eliminates external SRAM buffering for boot code, reducing BOM count and PCB area while sustaining 20-year data integrity at 85°C ambient.

Use Scenario: Holding firmware images and configuration tables for managed Ethernet switches deployed in telecom central offices.

IC Role / Device Role / Timing Role: Dual-bank firmware storage supporting A/B update schemes; sector erase enables atomic image replacement without runtime interruption.

Use Value: 100,000 erase cycles ensure >10 years of field updates at quarterly cadence; OTP region secures MAC address binding and licensing tokens.

Automotive Instrument Cluster

Medical Diagnostic Equipment

Use Scenario: Storing calibrated display assets and safety-critical boot code in AEC-Q100 Grade 3 instrument clusters (–40°C to +85°C).

IC Role / Device Role / Timing Role: Fail-safe firmware repository with hardware ECC - corrects bit flips induced by cosmic radiation during vehicle operation.

Use Value: Meets ISO 26262 ASIL-B requirements for memory integrity without software ECC overhead; CFI enables standardized driver reuse across vehicle platforms.

Use Scenario: Hosting application firmware and regulatory-mandated audit logs in portable ultrasound and ECG devices requiring long-term reliability.

IC Role / Device Role / Timing Role: Secure, tamper-resistant storage for FDA 21 CFR Part 11-compliant event logs and calibration constants.

Use Value: Non-volatile OTP lock prevents unauthorized modification of medical calibration data; 20-year retention satisfies device lifecycle compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S11TFI021	Same die, identical specs, but rated for Industrial Plus (–40°C to +105°C) temperature range.	Required for extended-temperature industrial control cabinets or under-hood automotive modules.	Select when ambient operating temperature exceeds +85°C; otherwise, S29GL512S11TFI020 offers cost-optimized industrial-grade performance.
MX29GL512FHI-90G	512 Mb parallel NOR flash (Spansion/Infineon heritage), 90 ns random access, no integrated ECC, 128-kbyte sectors.	Lacks on-die ECC - requires external error handling or software mitigation in safety-critical contexts.	Choose only if ECC is implemented externally or not required; S29GL512S11TFI020 provides superior data integrity with zero software overhead.

Compared with S29GL512S11TFI021, the 020 variant saves cost in standard industrial environments; versus MX29GL512FHI-90G, it adds hardware ECC and tighter timing control - critical for functional safety and deterministic boot.

Availability

S29GL512S11TFI020 is available at Aetrix Electronics and suitable for industrial HMI boot storage, network edge router firmware, and automotive instrument cluster applications requiring stable component supply, long-lifecycle support, and guaranteed TSOP-56 footprint compatibility.

Supply support for S29GL512S11TFI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100 standards.

The GL-S family targets embedded systems needing high-reliability, XIP-capable parallel NOR flash - designed specifically for deterministic boot, firmware update resilience, and extended-temperature operation in industrial and automotive control units.

FAQ

Does S29GL512S11TFI020 support byte-level writes?

No. This device operates exclusively on word (16-bit) boundaries. All write operations - including single-word programming and buffer writes - require 16-bit data alignment and address increments of 2 bytes. Byte masking is not supported; partial-word updates must be handled by the host system via read-modify-write sequences.

What is the purpose of the STB pin listed in the block diagram?

The STB (Strobe) signal shown in Figure 1 is an internal functional label within the device's architectural diagram, not a physical pin. S29GL512S11TFI020 has no STB pin; all control is handled via CE#, OE#, and WE#. The block diagram uses STB to denote internal address/data latch timing - external interface relies solely on standard parallel NOR control signals.

Can the OTP array be erased or rewritten after programming?

No. The 1024-byte OTP (One-Time Programmable) array is permanently programmable only. Once a bit is set to '0', it cannot be changed back to '1'. Each of the two lockable regions can be individually locked via dedicated commands, making the contents immutable for the life of the device - intended for security keys or factory calibration data.

How does suspend/resume functionality interact with the write buffer?

Suspend/resume applies only to sector erase and buffer programming operations - not to individual word writes. When suspended during a 512-byte buffer program, the device halts mid-buffer and retains partial programming state. Resume restores execution from the exact point of suspension, preserving all successfully written data up to that point without requiring restart or retransmission.

S29GL512S11TFI020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL512S11TFI020 FAQ

1.How can I place an order for S29GL512S11TFI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11TFI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11TFI020 reliable?

The price and inventory of S29GL512S11TFI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11TFI020 is usually 5 days.

3.What payment methods are accepted for S29GL512S11TFI020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11TFI020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11TFI020?

S29GL512S11TFI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11TFI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11TFI020?

For technical support, including S29GL512S11TFI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11TFI020 requirements.

6.How does Aetrix verify that S29GL512S11TFI020 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11TFI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11TFI020 meets industry standards.

7.What is the process for return or replacement of S29GL512S11TFI020?

All S29GL512S11TFI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11TFI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11TFI020 part is unused and in its original packaging.

Return procedure for S29GL512S11TFI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…