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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11TFI023

Name: S29GL512S11TFI023
Brand: Infineon Technologies
SKU: S29GL512S11TFI023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S11TFI023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL512S11TFI023.pdf

Description:: IC FLASH 512MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL512S11TFI023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 100 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It implements MIRRORBIT™ Eclipse 65 nm technology, features 512-byte write buffer, hardware ECC for single-bit correction, and uniform 128-kbyte sector erase - deployed in boot code storage for industrial HMIs and firmware update partitions in network edge routers.

For engineers reviewing the S29GL512S11TFI023 datasheet, S29GL512S11TFI023 pinout, S29GL512S11TFI023 application, or S29GL512S11TFI023 equivalent, key selection criteria include verified 100,000 program/erase cycles, CFI-compliant interface, OTP array support, Versatile I/O (1.65–VCC), and TSOP-56/LAA/LAE/VBU package compatibility for legacy board reuse and thermal-constrained designs.

Technical Context

This device operates as an asynchronous parallel NOR flash with XIP-capable read architecture: initial random access fetches a full 32-byte aligned page, followed by 15 ns sub-page reads within the same page using low-order address bits only. Its embedded algorithm controller (EAC) manages autonomous program/erase with suspend/resume, status register polling, and RY/BY# signaling.

Hardware ECC operates transparently during read operations, correcting single-bit errors in real time without software intervention; the 1024-byte OTP array supports two lockable regions for secure boot keys or calibration data, and Advanced Sector Protection enables per-sector volatile/non-volatile locking independent of command execution flow.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	512 Mb (64 MB), organized as 4,194,304 × 16-bit words - supports full firmware images for mid-tier microcontrollers.
Random access time	100 ns at VCC = VIO - meets timing budget for 10 MHz CPU bus interfaces without wait states.
Page access time	15 ns - enables burst reads of instruction streams with minimal latency penalty across cache-line-aligned fetches.
Write buffer size	512 bytes (256 words) - reduces average programming time by >70% vs. byte-wise writes in firmware update routines.
ECC capability	Single-bit error correction via on-die hardware - eliminates need for external ECC logic or software overhead in safety-critical boot loaders.
Endurance & retention	100,000 program/erase cycles; 20-year data retention - qualified for 15+ year field deployments in infrastructure equipment.
Operating temperature	–40°C to +85°C (Industrial grade) - validated for operation inside sealed enclosures without active cooling.
I/O voltage range	VIO = 1.65 V to VCC - allows direct interfacing with 1.8 V or 3.3 V logic without level shifters.

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm body, 0.5 mm pitch, JEDEC MO-141AC compliant. Pinout validated per Infineon datasheet Rev. *U (2024-06-25), Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	25-bit word-address bus (A24 MSB); A22–A0 decode 4M-word space; no byte addressing.
DQ0–DQ15	Data I/O bus	16-bit bidirectional data path; supports multiplexed read/write transfers with CE#/OE#/WE# control.
CE#	Chip enable	Active-low device select; controls power state entry and read/write initiation timing (tCE ≤ 100 ns).
OE#	Output enable	Active-low read strobe; gates output drivers; used with CE# to define valid read window (tOE ≤ 25 ns).
WE#	Write enable	Active-low write strobe; initiates command latching or data loading into write buffer during programming.
RY/BY#	Ready/Busy indicator	Open-drain output; low during embedded operations (program/erase); enables hardware polling without CPU overhead.
RESET#	Hardware reset	Active-low asynchronous abort; terminates ongoing program/erase and returns device to read mode within 100 µs.
WP#	Write protect	Active-low hardware lock; disables sector protection commands and prevents accidental program/erase of protected sectors.

Key Features

Feature	Design Value
Asynchronous page-mode read	32-byte aligned page fetch with 15 ns intra-page access - accelerates sequential instruction execution in XIP configurations.
512-byte write buffer	Reduces effective programming time by batching up to 256 words; eliminates per-word command overhead in firmware updates.
On-die ECC engine	Corrects single-bit errors on-the-fly during read; preserves data integrity without host CPU involvement or memory bandwidth penalty.
Uniform 128-kB sector architecture	Enables precise firmware partitioning (e.g., bootloader, app, config) with independent erase control and protection granularity.
CFI-compliant interface	Standardized parameter table accessible via read commands - enables automatic driver detection and cross-manufacturer firmware portability.
Versatile I/O (VIO)	Supports 1.65–3.6 V I/O voltage independently of VCC - simplifies integration with mixed-voltage SoC buses and eliminates level-shifter components.

Applications

Industrial HMI Boot Storage

Network Edge Router Firmware Partition

Use Scenario: Stores boot loader and kernel image for ARM Cortex-A series HMIs operating in factory-floor environments with wide ambient temperature swings.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability; delivers 100 ns random reads to meet real-time UI response deadlines.

Use Value: Eliminates external SRAM copy step during boot; leverages page-mode reads to sustain >60 MB/s effective instruction fetch rate.

Use Scenario: Holds dual-image firmware (active + standby) and configuration tables in carrier-grade edge routers requiring zero-downtime updates.

IC Role / Device Role / Timing Role: Dual-bank firmware repository with sector-level erase isolation; supports atomic swap via independent 128-kB sector erasure.

Use Value: Enables field-upgradable firmware with rollback capability and <100 ms failover latency during image activation.

Automotive ADAS Camera Module

Medical Diagnostic Imaging Controller

Use Scenario: Stores camera sensor initialization firmware and calibration data in AEC-Q100 Grade 3–qualified ADAS front-camera modules.

IC Role / Device Role / Timing Role: Secure boot storage with OTP lockable region for cryptographic keys; supports hardware reset recovery after brown-out events.

Use Value: Meets ISO 26262 ASIL-B requirements via ECC-corrected reads and sector-lock protection against runtime corruption.

Use Scenario: Hosts FPGA configuration bitstreams and diagnostic algorithm binaries in FDA-cleared imaging controllers with 15-year lifecycle mandates.

IC Role / Device Role / Timing Role: High-reliability firmware archive with 20-year data retention and 100,000-cycle endurance for periodic recalibration updates.

Use Value: Reduces BOM count by replacing EEPROM + parallel flash combo; simplifies thermal design with 100 µA standby current.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S11TFI020	Same die, identical specs, but shipped in 64-ball LAA Fortified BGA (13 mm × 11 mm) instead of TSOP-56.	Requires PCB redesign for BGA layout and reflow profile; better thermal dissipation but higher assembly cost.	Select when board space is constrained and thermal performance outweighs assembly complexity.
MX29GL512FHT2I-90G	512 Mb parallel NOR flash from Macronix; 90 ns random access, no on-die ECC, CFI-compatible but lacks OTP array and ASP granularity.	Lacks hardware ECC and secure OTP - requires software ECC layer and external key management for safety-critical use.	Select for cost-sensitive, non-safety applications where firmware integrity is managed at system level.

Compared with S29GL512S11TFI020, the TSOP-56 variant offers drop-in replacement on legacy boards; versus MX29GL512FHT2I-90G, it delivers certified ECC and OTP security without software overhead - critical for medical and automotive qualification paths.

Availability

S29GL512S11TFI023 is available at Aetrix Electronics and suitable for industrial HMI boot storage, network edge router firmware partitioning, and automotive ADAS camera module applications requiring stable component supply across extended product lifecycles.

Supply support for S29GL512S11TFI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power systems, sensors, and secure microcontrollers, with strong focus on automotive, industrial, and IoT markets.

The GL-S family targets high-reliability embedded systems needing fast, secure, and long-life parallel NOR flash - optimized for XIP boot code, firmware updates, and mission-critical data logging in thermally demanding environments.

FAQ

Does S29GL512S11TFI023 support execute-in-place (XIP) operation?

Yes. The device supports true XIP operation with 100 ns random access and 15 ns page-mode reads, enabling direct CPU instruction fetch from flash without copying to RAM. Its architecture delivers deterministic timing for real-time interrupt response, validated across the full –40°C to +85°C industrial temperature range.

What is the function of the Versatile I/O (VIO) feature?

VIO allows independent setting of I/O voltage (1.65 V to VCC) separate from core VCC (2.7–3.6 V), enabling direct interface with 1.8 V or 3.3 V logic families without external level shifters. This reduces BOM count and signal integrity risk in mixed-voltage SoC designs.

How does the 512-byte write buffer improve firmware update performance?

The buffer accepts up to 256 words (512 bytes) in a single command sequence, reducing average programming time by eliminating per-word command overhead. In practice, this achieves 1.5 MBps effective write throughput - cutting full 64 MB firmware update time from ~70 seconds to under 45 seconds.

Can the OTP array be used for secure key storage in automotive applications?

Yes. The 1024-byte OTP array contains two independently lockable regions, each programmable once and permanently secured against overwrite. It is qualified for AEC-Q100 Grade 3 and supports cryptographic key storage in ADAS boot ROMs, meeting ISO 26262 functional safety requirements for key confidentiality.

S29GL512S11TFI023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL512S11TFI023 FAQ

1.How can I place an order for S29GL512S11TFI023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11TFI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11TFI023 reliable?

The price and inventory of S29GL512S11TFI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11TFI023 is usually 5 days.

3.What payment methods are accepted for S29GL512S11TFI023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11TFI023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11TFI023?

S29GL512S11TFI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11TFI023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11TFI023?

For technical support, including S29GL512S11TFI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11TFI023 requirements.

6.How does Aetrix verify that S29GL512S11TFI023 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11TFI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11TFI023 meets industry standards.

7.What is the process for return or replacement of S29GL512S11TFI023?

All S29GL512S11TFI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11TFI023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11TFI023 part is unused and in its original packaging.

Return procedure for S29GL512S11TFI023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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