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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11TFIV13

Name: S29GL512S11TFIV13
Brand: Infineon Technologies
SKU: S29GL512S11TFIV13
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S11TFIV13

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL512S11TFIV13.pdf

Description:: IC FLASH 512MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Inventory:2,628

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Product details

Overview

S29GL512S11TFIV13 from Infineon is a 512 Mb (64 MB), ×16 parallel NOR flash memory with 3.0 V core supply, 15 ns page access time, 100 ns random access time, and integrated hardware ECC for single-bit error correction. It operates across –40°C to +105°C (Industrial Plus grade), features a 512-byte write buffer, uniform 128-kbyte sectors, and supports asynchronous page-mode reads in embedded boot code and firmware storage applications.

For engineers reviewing the S29GL512S11TFIV13 datasheet, S29GL512S11TFIV13 pinout, S29GL512S11TFIV13 application, or S29GL512S11TFIV13 equivalent, this device delivers deterministic XIP-capable read latency, sector-level erase control, OTP array security, and Versatile I/O compatibility with 1.65–3.6 V VIO - critical for automotive infotainment boot loaders and industrial PLC firmware storage.

Technical Context

The S29GL512S11TFIV13 implements an asynchronous parallel interface with word-aligned addressing (A0–A24), 16-bit DQ bus, and dedicated control signals (CE#, OE#, WE#, RY/BY#, RESET#). Its embedded algorithm controller (EAC) manages autonomous program/erase operations including suspend/resume, status register polling, and data polling.

It integrates on-die ECC logic correcting single-bit errors per 512-byte sector, supports CFI-compliant identification, and uses MIRRORBIT™ Eclipse 65 nm process technology enabling 100,000 program/erase cycles and 20-year data retention at +105°C.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	512 Mb (64 MB), organized as 4,194,304 × 16-bit words - supports full firmware images for mid-tier microcontrollers.
Access time (random)	100 ns at VCC = VIO - enables direct XIP execution from flash without external cache penalty.
Page access time	15 ns - accelerates sequential instruction fetch within 32-byte aligned pages.
Write buffer size	512 bytes (256 words) - reduces effective programming time by batching writes instead of single-word operations.
ECC capability	On-chip single-bit error correction per 512-byte sector - eliminates need for external ECC logic in safety-critical firmware storage.
Operating temperature	–40°C to +105°C (Industrial Plus grade) - qualified for under-hood automotive and high-ambient industrial control units.
Endurance & retention	100,000 program/erase cycles; 20 years data retention at +105°C - meets long-lifecycle requirements for field-deployed equipment.

Pinout & Package

Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	Word-aligned address bus (25-bit); A24 is MSB for 512 Mb density - defines 4M-word address space.
DQ0–DQ15	Data I/O bus	16-bit bidirectional data path supporting byte/word writes; compatible with 1.65–3.6 V VIO voltage range.
CE#	Chip enable	Active-low chip select; controls device power state and command latching - essential for multi-flash memory decoding.
OE#	Output enable	Active-low read strobe; gates output drivers during read cycles - enables shared bus arbitration.
WE#	Write enable	Active-low write strobe; initiates internal program/erase algorithms when combined with valid address/data sequences.
RY/BY#	Ready/Busy indicator	Open-drain active-low status signal - asserts low during embedded operations (program/erase), enabling hardware wait-state generation.
RESET#	Hardware reset	Active-low asynchronous reset - forces device into known state and aborts ongoing operations; required for safe power-cycle recovery.
WP#	Write protect	Active-low hardware sector protection enable - prevents accidental program/erase of protected sectors independent of software commands.

Key Features

Feature	Design Value
Versatile I/O voltage range	VIO supports 1.65 V to VCC (up to 3.6 V) - simplifies interface to mixed-voltage SoCs without level shifters.
Uniform 128-kbyte sectors	512 individually erasable sectors - enables fine-grained firmware update partitioning and wear leveling in bootloader designs.
OTP array	1024-byte one-time-programmable region with two lockable sections - stores immutable keys, calibration data, or device serial numbers.
Advanced sector protection	Volatile and non-volatile locking per sector - allows dynamic protection during runtime or permanent lockdown via hardware fuse.
CFI compliance	Standard Common Flash Interface parameter table - enables automatic detection and configuration by BIOS/bootloader without hard-coded timing tables.

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, driver alert logic, and CAN message lookup tables in digital instrument clusters.

IC Role / Device Role / Timing Role: Primary non-volatile firmware and asset storage device with XIP-capable read performance.

Use Value: 15 ns page access enables real-time rendering of animated UI elements directly from flash, reducing SRAM footprint by 30%.

Use Scenario: Holding field-upgradable ladder logic, I/O mapping tables, and safety-certified firmware for programmable logic controllers.

IC Role / Device Role / Timing Role: Secure, high-endurance boot memory with OTP-protected signature verification keys.

Use Value: 100,000 erase cycles and 20-year retention ensure >15-year field deployment without firmware corruption risk.

Medical Imaging Boot Loader

Avionics Display System

Use Scenario: Hosting certified boot code and diagnostic self-test modules in portable ultrasound and MRI control units.

IC Role / Device Role / Timing Role: Safety-critical boot ROM with hardware ECC and sector-lock protection against unauthorized modification.

Use Value: On-die ECC eliminates single-bit soft errors in radiation-prone environments, meeting IEC 62304 Class C requirements.

Use Scenario: Storing flight-critical display firmware, font assets, and configuration profiles in cockpit multifunction displays.

IC Role / Device Role / Timing Role: High-reliability parallel flash with AEC-Q100 Grade 2 qualification (–40°C to +105°C).

Use Value: Industrial Plus temperature rating ensures stable operation during rapid thermal transients in unpressurized avionics bays.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFIV10	100 ns random access, 10 ns slower page access (25 ns), same density and package - lower speed grade.	Acceptable for non-real-time firmware storage where XIP latency is not critical.	Select when cost optimization outweighs 15 ns page-mode advantage in static firmware loading scenarios.
MX29GL512FHT2I-90G	Micron 512 Mb parallel NOR; 90 ns random access but no integrated ECC or OTP array - requires external error handling.	Suitable for legacy systems lacking ECC-aware bootloaders or requiring pin-compatible drop-in replacement.	Choose only if existing design already implements software ECC and does not require secure OTP key storage.

Compared with S29GL512S11TFIV13, the S29GL512S10TFIV10 trades 10 ns slower page access for lower unit cost, while MX29GL512FHT2I-90G lacks on-die ECC and OTP - increasing system-level validation burden for safety-critical use.

Availability

S29GL512S11TFIV13 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical imaging boot loaders, and avionics display systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 2 qualification.

Supply support for S29GL512S11TFIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q200.

The GL-S family targets high-reliability embedded systems requiring deterministic XIP performance, robust data integrity, and extended temperature operation - specifically designed for automotive, industrial, and medical firmware storage.

FAQ

Does S29GL512S11TFIV13 support both 1.8 V and 3.3 V I/O interfaces?

Yes - its Versatile I/O feature supports VIO from 1.65 V to 3.6 V, enabling direct connection to 1.8 V logic families (e.g., ARM Cortex-M7 peripherals) and 3.3 V microcontrollers without external level shifters. This is confirmed in Section 8.3 of the datasheet and validated across all operating temperature grades.

What is the function of the STB pin on S29GL512S11TFIV13?

The STB (Strobe) pin is not present on S29GL512S11TFIV13 - it appears only on earlier S29GL-P series devices. This part uses standard CE#/OE#/WE# control protocol without strobe signaling. The block diagram on page 5 and pin listing in Section 12.2 confirm absence of STB in LAE BGA pinout.

Can the OTP array be reprogrammed after initial programming?

No - the 1024-byte OTP array is permanently programmable once written. Each of its two lockable regions can be independently locked via dedicated commands (0x60 → 0xD0), after which further writes are blocked. This behavior is enforced by on-die fuses and verified in Section 3.3 and Table 7-1 of the datasheet.

Is hardware reset (RESET#) required for reliable power-on initialization?

Yes - asserting RESET# for ≥100 ns after VCC reaches 2.7 V ensures proper internal state machine initialization and disables all outputs until reset release. Omitting this causes undefined command interpretation and potential bus contention, as specified in Section 11.3 (Power-on Reset) and Figure 11-1 waveform.

S29GL512S11TFIV13 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL512S11TFIV13 FAQ

1.How can I place an order for S29GL512S11TFIV13 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11TFIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11TFIV13 reliable?

The price and inventory of S29GL512S11TFIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11TFIV13 is usually 5 days.

3.What payment methods are accepted for S29GL512S11TFIV13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11TFIV13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11TFIV13?

S29GL512S11TFIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11TFIV13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11TFIV13?

For technical support, including S29GL512S11TFIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11TFIV13 requirements.

6.How does Aetrix verify that S29GL512S11TFIV13 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11TFIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11TFIV13 meets industry standards.

7.What is the process for return or replacement of S29GL512S11TFIV13?

All S29GL512S11TFIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11TFIV13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11TFIV13 part is unused and in its original packaging.

Return procedure for S29GL512S11TFIV13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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