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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11TFIV20

Name: S29GL512S11TFIV20
Brand: Infineon Technologies
SKU: S29GL512S11TFIV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S11TFIV20

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL512S11TFIV20.pdf

Description:: IC FLASH 512MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL512S11TFIV20 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware update storage in industrial control units.

For engineers reviewing the S29GL512S11TFIV20 datasheet, S29GL512S11TFIV20 pinout, S29GL512S11TFIV20 application, or S29GL512S11TFIV20 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant interface for host BIOS/UEFI compatibility.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status reporting via RY/BY# pin or status register, and suspend/resume capability during active programming or erasing.

The internal architecture includes a 32-byte page-aligned read path, 1024-byte OTP array with dual lockable regions, and Advanced Sector Protection (ASP) enabling independent volatile/non-volatile locking per 128 kB sector-critical for secure firmware partitioning in automotive ECUs.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	512 Mb (64 MB); supports full firmware image storage for mid-tier microcontrollers.
Interface	Asynchronous parallel ×16; requires no clock signal, simplifies host MCU interface design.
Random Access Time	100 ns at VCC = VIO; enables fast XIP execution from flash without external cache.
Page Access Time	15 ns; allows rapid sequential reads within same 32-byte aligned page.
Write Buffer Size	512 bytes; reduces effective programming time by batching up to 256 words per command.
ECC Support	On-die hardware single-bit error correction; eliminates need for external ECC logic in safety-critical systems.
Endurance	100,000 program/erase cycles per sector; ensures long-term reliability in field-updatable devices.
Data Retention	20 years at +85°C; meets automotive and industrial lifecycle requirements.

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm body, JEDEC MO-141AC compliant. Pin pitch: 0.5 mm. RoHS-compliant, lead-free finish.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	Word-aligned address bus; A24 is MSB for 512 Mb density (2²⁵ × 16-bit words).
DQ0–DQ15	Data I/O	Bidirectional 16-bit data bus; supports both read and write transfers on same pins.
CE#	Chip enable	Active-low chip select; controls device power state and command latching timing window.
OE#	Output enable	Active-low read strobe; gates output drivers during read cycles only.
WE#	Write enable	Active-low write strobe; initiates program/erase command sequences when CE# and OE# are inactive.
RY/BY#	Ready/Busy indicator	Open-drain output; low during embedded operations, high when ready for next command.
RESET#	Hardware reset	Active-low asynchronous reset; forces device into known state, clears status register.
VCC	Core supply	2.7–3.6 V single supply for core logic, programming, and erase functions.
VIO	I/O supply	1.65–3.6 V versatile I/O voltage; decouples I/O level from core voltage for mixed-signal host interfacing.
WP#	Write protect	Hardware sector protection enable; disables program/erase when asserted low.

Key Features

Feature	Design Value
65 nm MIRRORBIT™ Eclipse technology	Enables higher density and lower power vs. older floating-gate NOR, with improved endurance and retention.
512-byte programming buffer	Reduces average programming time by >70% vs. single-word writes-critical for OTA firmware updates.
Uniform 128 kB sectors	Supports fine-grained firmware partitioning (e.g., bootloader, app, config) with independent erase control.
Common Flash Interface (CFI)	Enables automatic detection and configuration by BIOS/UEFI or bootloader without hard-coded timing tables.
OTP array with dual lockable regions	Stores immutable keys or calibration data; each region can be permanently locked after programming.
Suspend/resume during program/erase	Allows host to pause long operations (e.g., 477 kBps sector erase) to service real-time interrupts.

Applications

Automotive Engine Control Unit (ECU)

Industrial PLC Firmware Storage

Use Scenario: Stores boot loader, safety-critical control algorithms, and calibration maps in AEC-Q100 Grade 2 qualified ECU.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 100 ns read latency and hardware ECC.

Use Value: Enables safe, certified over-the-air (OTA) firmware updates with sector-level erase isolation and OTP-secured keys.

Use Scenario: Holds firmware, configuration parameters, and HMI assets in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: High-reliability parallel flash with 20-year data retention at +85°C and 100k-cycle endurance.

Use Value: Eliminates need for external ECC circuitry while supporting hot-swappable module reprogramming via buffered writes.

Medical Imaging System Boot ROM

Avionics Data Recorder

Use Scenario: Stores certified boot firmware and diagnostic routines in FDA-regulated imaging equipment requiring traceable firmware integrity.

IC Role / Device Role / Timing Role: Secure, CFI-compliant boot memory with ASP-enabled sector locking and OTP-based signature storage.

Use Value: Meets IEC 62304 software lifecycle requirements via hardware-enforced write protection and ECC-verified reads.

Use Scenario: Captures flight-critical telemetry and event logs in DO-178C-certified avionics recorders with extended temperature operation.

IC Role / Device Role / Timing Role: Radiation-tolerant (tested) parallel flash with –40°C to +105°C operation and suspend/resume for deterministic interrupt handling.

Use Value: Guarantees uninterrupted logging during power transients via RY/BY# status signaling and robust erase recovery.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFIV20	Same die, 90 ns random access (vs. 100 ns); tighter timing spec, identical package and pinout.	Preferred where sub-100 ns XIP latency is required (e.g., real-time DSP boot).	Select when system timing margin is constrained; otherwise, S29GL512S11TFIV20 offers better cost/performance balance.
MX29GL512FHTI-90G	Micron 512 Mb parallel NOR; 90 ns access, no integrated ECC, requires external error management.	Suitable for cost-sensitive non-safety applications lacking ECC mandates.	Choose only if ECC is handled at software level and AEC-Q100 qualification is not required.

Compared with S29GL512S10TFIV20 and MX29GL512FHTI-90G, the S29GL512S11TFIV20 uniquely combines AEC-Q100 Grade 2 qualification, on-die ECC, and Versatile I/O in a TSOP package-making it optimal for automotive and industrial designs requiring functional safety and mixed-voltage host interfacing.

Availability

S29GL512S11TFIV20 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, medical imaging boot systems, and avionics data recorders requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL512S11TFIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure memory solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems requiring deterministic boot performance, firmware security, and long-term data integrity-especially in automotive, industrial, and medical applications demanding AEC-Q100 or extended temperature compliance.

FAQ

Is S29GL512S11TFIV20 pin-compatible with earlier S29GL512P or S29GL512N variants?

No. The S29GL512S uses a revised pinout optimized for Versatile I/O and enhanced sector protection logic. Key differences include relocated WP# and RESET# pins and updated timing behavior on RY/BY#. Migration requires PCB layout revision and firmware timing validation per datasheet Rev. *U.

Does this device support synchronous burst reads or DDR interface modes?

No. S29GL512S11TFIV20 is strictly asynchronous parallel NOR flash. It does not support clocked interfaces, burst modes, or DDR signaling. All read/write operations are controlled solely by CE#, OE#, and WE# timing-no clock input is present or required.

Can the OTP array be reprogrammed after initial lock?

No. Once either of the two OTP regions is permanently locked via the dedicated lock bit, that region becomes read-only and cannot be erased or rewritten-even with hardware reset or power cycle. Programming and locking must be performed in controlled production environments with verified data.

What is the maximum sustained write throughput using the 512-byte buffer?

The datasheet specifies 1.5 MBps for buffer programming (512 bytes). This translates to ~337 µs per full buffer write under optimal conditions (VCC = 3.3 V, T = 25°C). Actual throughput may decrease slightly at temperature extremes or lower VCC due to internal voltage regulation overhead.

S29GL512S11TFIV20 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Bulk

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL512S11TFIV20 FAQ

1.How can I place an order for S29GL512S11TFIV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11TFIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11TFIV20 reliable?

The price and inventory of S29GL512S11TFIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11TFIV20 is usually 5 days.

3.What payment methods are accepted for S29GL512S11TFIV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11TFIV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11TFIV20?

S29GL512S11TFIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11TFIV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11TFIV20?

For technical support, including S29GL512S11TFIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11TFIV20 requirements.

6.How does Aetrix verify that S29GL512S11TFIV20 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11TFIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11TFIV20 meets industry standards.

7.What is the process for return or replacement of S29GL512S11TFIV20?

All S29GL512S11TFIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11TFIV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11TFIV20 part is unused and in its original packaging.

Return procedure for S29GL512S11TFIV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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