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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S11TFIV23

Name: S29GL512S11TFIV23
Brand: Infineon Technologies
SKU: S29GL512S11TFIV23
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S11TFIV23

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL512S11TFIV23.pdf

Description:: IC FLASH 512MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL512S11TFIV23 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), and industrial temperature grade (–40°C to +85°C). It features 128-kbyte uniform sectors, 512-byte write buffer, hardware ECC for single-bit correction, and page-mode read with 15 ns page access time. Used in boot code storage for industrial controllers requiring deterministic XIP execution.

For engineers reviewing the S29GL512S11TFIV23 datasheet, S29GL512S11TFIV23 pinout, S29GL512S11TFIV23 application, or S29GL512S11TFIV23 equivalent, key selection criteria include sector erase granularity, Versatile I/O voltage range (1.65 V to VCC), asynchronous timing compliance, and OTP array support for secure configuration storage.

Technical Context

This device implements an embedded algorithm controller (EAC) that executes autonomous program/erase operations without host CPU intervention. It supports command-set-compatible operation per Common Flash Interface (CFI) v1.4 and includes dedicated status register, data polling, and RY/BY# pin for real-time operation monitoring.

The MIRRORBIT™ Eclipse architecture enables dual-bit-per-cell storage on 65 nm process, delivering 100,000 program/erase cycles and 20-year data retention. Its 32-byte page-aligned read path and 512-byte buffer programming optimize throughput for firmware update and boot image loading in resource-constrained embedded systems.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	512 Mb (64 MB), organized as 4,194,304 × 16-bit words - defines maximum boot image or firmware partition size.
Random access time (tACC)	100 ns at full VCC = VIO - determines worst-case instruction fetch latency in XIP mode.
Page access time (tPACC)	15 ns - enables fast sequential reads within 32-byte aligned pages for tight-loop code execution.
Write buffer size	512 bytes (256 words) - reduces effective programming time by batching writes, critical for field firmware updates.
ECC capability	Internal hardware single-bit error correction - ensures data integrity without software overhead during long-term storage.
Sector size	Uniform 128 kbyte sectors - simplifies flash translation layer design and wear leveling in bootloader implementations.
Operating temperature	–40°C to +85°C (Industrial grade) - validated for continuous operation in factory automation and motor control environments.
Endurance & retention	100,000 program/erase cycles / 20 years data retention - meets industrial lifecycle requirements for unattended equipment.

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint, lead-free and RoHS compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	25-bit address bus supporting full 512 Mb addressing; A24 is MSB for this density.
DQ0–DQ15	Data I/O bus	16-bit bidirectional data path; supports word-wide reads/writes and CFI parameter table access.
CE#	Chip enable	Active-low device select; controls power state entry and output driver enable/disable timing.
OE#	Output enable	Active-low read strobe; gates output buffers during asynchronous read cycles.
WE#	Write enable	Active-low control for write/program command latching and internal EAC trigger initiation.
RY/BY#	Ready/Busy indicator	Open-drain active-low signal reflecting internal EAC status; used for polling instead of software timeouts.
RESET#	Hardware reset	Active-low asynchronous reset that aborts ongoing program/erase and returns device to read mode.
VCC	Core supply	3.0 V ±10% (2.7–3.6 V); powers logic, array, and embedded algorithms - no separate VPP required.
VIO	I/O supply	1.65 V to VCC; enables interface compatibility with 1.8 V, 2.5 V, or 3.3 V host buses.
WP#	Write protect	Hardware sector protection enable; when asserted, blocks program/erase commands to protected sectors.

Key Features

Feature	Design Value
Versatile I/O voltage range	VIO supports 1.65 V to VCC - eliminates level shifters when interfacing with mixed-voltage SoCs or FPGAs.
Asynchronous page-mode read	15 ns tPACC within 32-byte pages - improves effective instruction fetch bandwidth over standard random access.
Embedded Algorithm Controller (EAC)	Autonomous sector erase and buffer programming - removes host CPU dependency and guarantees timing-compliant execution.
Secure OTP array	1024-byte one-time-programmable region with two lockable sections - stores immutable keys or calibration data in safety-critical applications.
Advanced Sector Protection (ASP)	Volatile and non-volatile sector locking - enables dynamic protection during runtime and permanent lockdown for production firmware.
Common Flash Interface (CFI)	CFI v1.4 compliant parameter table - allows generic flash drivers to auto-detect geometry, timing, and command set without hardcoding.

Applications

Industrial PLC Boot Memory

Automotive ADAS Camera Firmware Storage

Use Scenario: Stores boot loader and real-time OS kernel in programmable logic controllers deployed in harsh factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP-capable read performance and sector-level firmware update isolation.

Use Value: 128-kbyte uniform sectors allow atomic firmware patching without erasing entire image; 100,000-cycle endurance supports decades of field updates.

Use Scenario: Holds camera sensor initialization firmware and image processing microcode in automotive surround-view systems.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified parallel NOR flash providing deterministic boot timing and secure OTP for calibration data.

Use Value: Hardware ECC ensures integrity of vision firmware under EMI-rich vehicle environments; Versatile I/O interfaces directly with 1.8 V ISP processors.

Medical Imaging System Configuration

Telecom Base Station Boot ROM

Use Scenario: Stores device-specific calibration tables, safety-critical configuration parameters, and diagnostic firmware in portable ultrasound units.

IC Role / Device Role / Timing Role: Secure configuration store using OTP lockable regions and non-volatile sector protection for regulatory compliance.

Use Value: Two independent OTP lock bits prevent accidental overwrite of FDA-mandated calibration data while allowing field service updates to other sectors.

Use Scenario: Hosts boot ROM and FPGA configuration bitstreams in 5G remote radio units operating in outdoor cabinets.

IC Role / Device Role / Timing Role: High-reliability parallel flash with 20-year data retention and thermal stability across –40°C to +85°C ambient.

Use Value: 15 ns page access time accelerates FPGA reconfiguration after power cycle; 100 µA standby current minimizes cabinet cooling load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFIV20	100 ns tACC (vs. 100 ns), same package and density, but rated for Industrial Plus (–40°C to +105°C)	Required for extended-temperature base station or rail signaling applications	Select when ambient operating temperature exceeds +85°C; otherwise identical functional behavior.
MX29GL512FHI-90G	Micron 512 Mb parallel NOR; 90 ns tACC, no built-in ECC, CFI v1.3, different command set timing	Lacks hardware ECC and OTP array; requires external error handling and custom driver adaptation	Choose only if cost sensitivity outweighs reliability requirements and firmware validation effort is acceptable.

Compared with S29GL512S11TFIV23, the S29GL512S10TFIV20 extends thermal range without sacrificing timing or features, while the MX29GL512FHI-90G trades ECC and OTP capability for marginal speed gain and higher integration risk in safety-critical designs.

Availability

S29GL512S11TFIV23 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, medical imaging devices, and telecom base stations requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.

Supply support for S29GL512S11TFIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.

The GL-S family targets embedded systems needing deterministic boot performance, field-upgradable firmware, and long-term data integrity - optimized for industrial automation, automotive, and medical applications where failure modes must be bounded and verified.

FAQ

Does S29GL512S11TFIV23 require an external VPP voltage for programming?

No. This device uses single-supply operation: VCC (2.7–3.6 V) powers all functions including read, program, and erase. Internal charge pumps generate necessary high voltages, eliminating need for external VPP pins or circuitry - simplifying PCB layout and reducing BOM count.

Can the OTP array be reprogrammed after initial programming?

No. The 1024-byte OTP array is physically one-time programmable. Once a byte is written, it cannot be altered. Each of the two lockable regions can be permanently locked via dedicated CFI commands, preventing further writes even to unlocked portions - ensuring irreversible security for calibration or keys.

How does the Versatile I/O feature affect timing specifications?

Versatile I/O introduces two timing modes: "Full VCC = VIO" (tighter specs, e.g., 100 ns tACC) and "VersatileIO VIO" (relaxed specs, e.g., 110 ns tACC) when VIO < VCC. Timing parameters scale with VIO voltage level - designers must select appropriate AC characteristics table based on actual VIO value used in system design.

Is hardware reset (RESET#) required before power-up?

No. Power-on reset (POR) is fully internal and automatic. RESET# is optional and used only for synchronous recovery from error states or forced return to read mode during active operations. Asserting RESET# aborts pending program/erase and clears status registers - useful for fault recovery in safety-critical firmware.

S29GL512S11TFIV23 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL512S11TFIV23 FAQ

1.How can I place an order for S29GL512S11TFIV23 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11TFIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11TFIV23 reliable?

The price and inventory of S29GL512S11TFIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11TFIV23 is usually 5 days.

3.What payment methods are accepted for S29GL512S11TFIV23?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11TFIV23 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11TFIV23?

S29GL512S11TFIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11TFIV23 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11TFIV23?

For technical support, including S29GL512S11TFIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11TFIV23 requirements.

6.How does Aetrix verify that S29GL512S11TFIV23 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11TFIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11TFIV23 meets industry standards.

7.What is the process for return or replacement of S29GL512S11TFIV23?

All S29GL512S11TFIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11TFIV23, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11TFIV23 part is unused and in its original packaging.

Return procedure for S29GL512S11TFIV23:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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