Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Nexperia USA Inc. S29GL512S11TFV010

Part No.:
S29GL512S11TFV010
Manufacturer:
Nexperia USA Inc.
Category:
Memory
Package:
-
Datasheet:
AetrixS29GL512S11TFV010.pdf
Description:
S29GL512S - 512-Mbit (64 Mbyte),
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,383

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S29GL512S11TFV010 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, supports Versatile I/O (1.65–VCC), delivers 100 ns random access and 15 ns page access, and integrates hardware ECC for single-bit error correction - deployed in automotive instrument clusters requiring fast XIP boot code execution.

For engineers reviewing the S29GL512S11TFV010 datasheet, S29GL512S11TFV010 pinout, S29GL512S11TFV010 application, or S29GL512S11TFV010 equivalent, this device serves as a high-reliability, AEC-Q100 Grade 2 qualified parallel flash for embedded boot storage where deterministic read latency, sector-level erase control, and OTP-secured configuration data are required.

Technical Context

The S29GL512S11TFV010 implements an asynchronous parallel interface with word-aligned addressing (A0–A24), 32-byte page reads, and 512-byte buffer programming. Its embedded algorithm controller (EAC) handles autonomous program/erase operations including suspend/resume, status register polling, and RY/BY# signaling.

It features uniform 128 kB sectors (512 total), advanced sector protection (volatile/non-volatile lock), a dedicated 1024-byte OTP array with two lockable regions, and CFI-compliant parameter tables for host software identification - all operating across –40°C to +105°C per AEC-Q100 Grade 2.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density 512 Mb (64 MB), enabling full firmware image storage for mid-tier automotive ECUs
Interface type Asynchronous parallel ×16 bus, supporting direct CPU address/data bus connection without glue logic
Random access time 100 ns at VCC = VIO, ensuring sub-100 ns instruction fetch latency for XIP operation
Page access time 15 ns, allowing rapid sequential reads within 32-byte aligned pages during code execution
Erase endurance 100,000 cycles per sector, supporting field firmware updates over full vehicle lifecycle
Data retention 20 years at +85°C, guaranteeing long-term integrity of calibration and security keys
Operating temperature –40°C to +105°C (AEC-Q100 Grade 2), validated for under-hood ECU deployment

Pinout & Package

Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout conforms to standard parallel NOR flash layout with dedicated CE#, OE#, WE#, RESET#, RY/BY#, WP#, and DQ0–DQ15 I/Os.

Pin/Terminal Circuit Role Design Meaning
A0–A24 Address inputs Word-aligned address bus (25 bits); A24 = MSB for 512 Mb addressing (225 × 16-bit words)
DQ0–DQ15 Data I/O Bidirectional 16-bit data bus; supports both read and write transfers on same pins
CE# Chip enable Active-low chip select; enables internal logic and memory array access when asserted
OE# Output enable Active-low control for output drivers; gates data onto DQ bus during read cycles
WE# Write enable Active-low strobe for write operations; latches command sequences and data into registers
RY/BY# Ready/Busy indicator Open-drain output signaling active program/erase; low = busy, high = ready
RESET# Hardware reset Active-low asynchronous reset that aborts ongoing operations and returns device to read mode
WP# Write protect Hardware sector lock override; disables program/erase when asserted low

Key Features

Feature Design Value
512-byte programming buffer Reduces effective programming time by batching up to 256 words per command, minimizing host CPU overhead
Hardware ECC engine Corrects single-bit errors on-the-fly during read, eliminating need for external error-handling firmware
Versatile I/O voltage range Supports 1.65–3.6 V VIO independently of VCC, enabling interoperability with mixed-voltage SoCs
1024-byte OTP array Stores immutable security keys or calibration constants in two separately lockable regions
Suspend/resume capability Pauses active program or erase to service high-priority read requests, improving real-time system responsiveness

Applications

Automotive Instrument Cluster Industrial PLC Firmware Storage

Use Scenario: Storing boot code, GUI assets, and real-time gauge rendering logic in digital dashboards.

IC Role / Device Role / Timing Role: Primary XIP-capable boot flash providing deterministic <100 ns instruction fetch latency.

Use Value: Enables zero-delay startup and smooth animation rendering via 15 ns page-mode reads across 32-byte aligned code blocks.

Use Scenario: Holding field-upgradable ladder logic firmware and I/O configuration maps in modular controllers.

IC Role / Device Role / Timing Role: Non-volatile firmware repository with sector-erase granularity for partial updates.

Use Value: Supports safe in-service firmware patches using 128 kB uniform sectors and hardware write protection.

Medical Imaging Boot Loader Avionics Display System

Use Scenario: Hosting certified boot loader and safety monitor firmware in MRI/X-ray control units.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified flash with 20-year data retention for critical boot assets.

Use Value: Guarantees integrity of safety-critical startup routines under extended thermal stress (–40°C to +105°C).

Use Scenario: Storing display firmware and font libraries in DO-178C-certified cockpit displays.

IC Role / Device Role / Timing Role: High-reliability parallel flash with CFI table for automated host identification and configuration.

Use Value: Simplifies qualification by providing standardized JEDEC CFI parameters for bootloader compatibility verification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL512S11TFI010 Same die, Industrial grade (–40°C to +85°C), no AEC-Q100 qualification Lacks automotive temperature validation and qualification documentation Select for cost-sensitive industrial designs where extended temperature is not required
MX29GL512FHT2I-90G Macronix 512 Mb parallel NOR; 90 ns random access, no integrated ECC, no OTP array Requires external ECC handling and lacks secure key storage capability Choose only if legacy design compatibility or lower unit cost outweighs ECC and OTP benefits

Compared with S29GL512S11TFV010, the S29GL512S11TFI010 sacrifices automotive qualification for lower cost, while the MX29GL512FHT2I-90G omits hardware ECC and OTP-requiring additional firmware and security layers to match functional safety and data integrity.

Availability

S29GL512S11TFV010 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot loaders, and avionics display systems requiring stable component supply and long-term lifecycle support.

Supply support for S29GL512S11TFV010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions.

The GL-S family targets automotive and industrial applications demanding AEC-Q100 qualification, deterministic timing, and embedded firmware storage with hardware-assisted reliability features.

FAQ

Is S29GL512S11TFV010 pin-compatible with earlier S29GL512P or S29GL512N variants?

No. The S29GL512S11TFV010 uses a 64-ball LAE BGA package with different ball map and signal assignments than the legacy TSOP or older BGA packages. Pin mapping must be verified against the official Infineon pinout diagram for LAE package revision V010.

Does the hardware ECC correct errors during programming or only during read operations?

The hardware ECC operates exclusively during read operations: it detects and corrects single-bit errors in retrieved data. It does not validate or correct data written to the array; programming integrity relies on command sequencing and status monitoring.

Can the 1024-byte OTP array be reprogrammed after initial programming?

No. Once a region of the OTP array is locked (via dedicated CFI commands), it cannot be unlocked or rewritten. Each of the two OTP regions supports one-time programming and permanent locking, intended for immutable keys or calibration data.

What is the minimum VIO voltage supported during read operations at 3.3 V VCC?

The minimum VIO voltage is 1.65 V, as specified in the Versatile I/O feature. At VCC = 3.3 V, the device guarantees full read functionality down to VIO = 1.65 V, enabling interoperability with 1.8 V I/O domains without level shifters.

S29GL512S11TFV010 Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
-
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

S29GL512S11TFV010 FAQ

1.How can I place an order for S29GL512S11TFV010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11TFV010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11TFV010 reliable?

The price and inventory of S29GL512S11TFV010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11TFV010 is usually 5 days.

3.What payment methods are accepted for S29GL512S11TFV010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11TFV010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11TFV010?

S29GL512S11TFV010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11TFV010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11TFV010?

For technical support, including S29GL512S11TFV010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11TFV010 requirements.

6.How does Aetrix verify that S29GL512S11TFV010 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11TFV010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11TFV010 meets industry standards.

7.What is the process for return or replacement of S29GL512S11TFV010?

All S29GL512S11TFV010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11TFV010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11TFV010 part is unused and in its original packaging.

Return procedure for S29GL512S11TFV010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S29GL512S11TFV010 Tags

  • S29GL512S11TFV010
  • S29GL512S11TFV010 PDF
  • S29GL512S11TFV010 Datasheet
  • S29GL512S11TFV010 Specifications
  • S29GL512S11TFV010 Images
  • Nexperia USA Inc.
  • Nexperia USA Inc. S29GL512S11TFV010
  • Buy S29GL512S11TFV010
  • S29GL512S11TFV010 Price
  • S29GL512S11TFV010 Distributor
  • S29GL512S11TFV010 Supplier
  • S29GL512S11TFV010 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER