My Inquiry
My Account
Infineon Technologies S29GL512S11TFV013
- Part No.:
- S29GL512S11TFV013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512S11TFV013.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,414
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL512S11TFV013 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile firmware retention.
For engineers reviewing the S29GL512S11TFV013 datasheet, S29GL512S11TFV013 pinout, S29GL512S11TFV013 application, or S29GL512S11TFV013 equivalent, this device supports asynchronous read, sector erase, buffer programming up to 512 bytes, OTP lockable regions, and AEC-Q100 Grade 2 automotive qualification - critical for embedded boot memory selection.
Technical Context
The S29GL512S11TFV013 implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) handles autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and automatic ECC generation/correction during read.
It features uniform 128 kB sectors, suspend/resume capability for program and erase, advanced sector protection (volatile/non-volatile), and a dedicated 1024-byte OTP array split into two lockable regions. The Versatile I/O architecture allows VIO from 1.65 V to VCC, enabling interoperability with mixed-voltage SoCs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB), organized as 4,194,304 × 16-bit words - sufficient for full firmware images in mid-tier industrial controllers. |
| Random access time | 100 ns at VCC = VIO - enables sub-10 MHz CPU bus timing without wait states in XIP configurations. |
| Page access time | 15 ns - accelerates sequential instruction fetch within 32-byte aligned pages during code execution. |
| Programming buffer | 512-byte write buffer - reduces effective programming time by batching up to 256 words per command, improving firmware update throughput. |
| ECC support | On-die single-bit error correction - eliminates need for external ECC logic and enhances long-term data integrity in unattended systems. |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention - meets lifetime requirements for industrial gateways and automotive ECUs. |
| Operating temperature | –40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2) - validated for under-hood and factory-floor deployment. |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | 25-bit address bus; A24 is MSB for 512 Mb density (4M × 16), enabling full memory mapping without bank switching. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads; compatible with 16-bit microcontroller external memory interfaces. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables multi-chip memory expansion with decode logic. |
| OE# | Output enable | Active-low read strobe; gates output drivers independently of CE#, allowing shared bus arbitration in multi-peripheral systems. |
| WE# | Write enable | Active-low write strobe; initiates internal program/erase commands when combined with valid address/data and command sequences. |
| RY/BY# | Ready/Busy indicator | Open-drain status pin; low during embedded operations (program/erase), enabling hardware polling without software overhead. |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known state and aborts ongoing operations - critical for safe power-cycle recovery. |
| VCC | Core supply | 2.7–3.6 V single supply for all functions (read/program/erase); eliminates need for separate VPP or charge pumps. |
| VIO | I/O supply | 1.65–VCC versatile I/O voltage; permits direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic families without level shifters. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned page access with 15 ns cycle time - improves instruction fetch bandwidth over standard random access by >6×. |
| 512-byte programming buffer | Enables single-command programming of up to 256 words - cuts firmware update time vs. byte-by-byte writes and reduces host CPU intervention. |
| Hardware ECC engine | Single-bit correction with no software overhead - ensures boot ROM reliability without adding error-handling firmware complexity. |
| Uniform 128 kB sectors | 64 identically sized erase blocks - simplifies partitioning for bootloader, application, and configuration storage with deterministic erase timing. |
| OTP array with dual lock | 1024-byte one-time-programmable region split into two independently lockable sections - secures cryptographic keys and calibration data permanently. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with <100 ns latency to ARM Cortex-M7-based controllers. Use Value: 20-year data retention and 100k erase cycles ensure firmware integrity across 15+ year equipment lifecycles without field reprogramming risk. |
Use Scenario: Holding safety-critical boot code and sensor fusion algorithms in radar ECU modules operating under hood conditions. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel NOR flash serving as primary boot device for TI Jacinto 7 SoC with hardware ECC validation. Use Value: –40°C to +105°C operation and built-in sector protection prevent unauthorized firmware modification during vehicle OTA updates. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
|
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound machines requiring rapid cold boot and regulatory traceability. IC Role / Device Role / Timing Role: Secure, high-reliability flash with OTP lockable regions storing device-specific calibration parameters and FDA-mandated revision stamps. Use Value: Dual-lock OTP prevents accidental overwrites while maintaining audit-ready firmware version history required for ISO 13485 compliance. |
Use Scenario: Storing baseband processor configuration tables and protocol stack parameters in 5G macrocell radios exposed to wide ambient temperature swings. IC Role / Device Role / Timing Role: Industrial-plus grade parallel flash interfaced to Xilinx Zynq MPSoC via AXI Quad SPI bridge, supporting hot-swap-safe firmware updates. Use Value: Suspend/resume capability allows background sector erase during active traffic, minimizing service interruption during field upgrades. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512P11TFV010 | Same density and package, but lacks Versatile I/O (VIO fixed to VCC) and OTP array - no independent I/O voltage scaling or secure key storage. | Not suitable for mixed-voltage SoC interfaces or applications requiring permanent key storage; limited to legacy 3.3 V-only designs. | Select only if cost sensitivity outweighs I/O flexibility and security needs; verify compatibility with existing 3.3 V-only bus timing. |
| MX29GL512FHI-90G | 512 Mb parallel NOR with 90 ns access, but no on-die ECC, no OTP, and only 10k endurance cycles - requires external error handling and frequent refresh. | Unfit for safety-critical or long-lifecycle deployments; acceptable only for consumer-grade, short-life-cycle products with firmware update infrastructure. | Choose only for non-safety applications where BOM cost is primary driver and ECC/retention are managed externally. |
Compared with S29GL512P11TFV010 and MX29GL512FHI-90G, the S29GL512S11TFV013 uniquely combines AEC-Q100 Grade 2 qualification, hardware ECC, dual-lock OTP, and Versatile I/O - making it the only option among the three qualified for automotive boot memory and industrial firmware storage with zero external error correction.
Availability
S29GL512S11TFV013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.
Supply support for S29GL512S11TFV013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.
The GL-S family targets embedded boot memory applications demanding XIP performance, long-term data integrity, and automotive-grade robustness - specifically engineered for mission-critical firmware storage in harsh environments.
FAQ
Does S29GL512S11TFV013 support quad SPI or other serial interfaces?
No. This device implements a parallel 16-bit asynchronous interface only, with dedicated address (A0–A24), data (DQ0–DQ15), and control (CE#, OE#, WE#) pins. It does not include SPI, QSPI, or HyperBus functionality. Serial interface variants are not offered in the GL-S family - use S29GL512S11TFV013 only in parallel-memory bus architectures.
What is the maximum clock frequency supported for read operations?
The device has no internal clock and performs fully asynchronous reads. Maximum effective throughput depends on bus timing: with 100 ns random access and 15 ns page-mode cycles, sustained read rates reach ~66.7 MBps in page mode (15 ns cycle = 66.7 MHz effective) and ~10 MBps in random access (100 ns = 10 MHz). No external clock signal is required or accepted.
Can the OTP region be reprogrammed after locking?
No. Once either of the two 512-byte OTP lock bits is set (via specific command sequence), that region becomes permanently read-only. The lock is irreversible and cannot be cleared by power cycling, reset, or any command. Programming and locking must be performed during final test or secure provisioning - design systems to write OTP data before lock activation.
Is VIO required to equal VCC, or can it operate at lower voltage?
VIO may be set independently from 1.65 V to VCC, enabling direct connection to 1.8 V or 2.5 V I/O domains while VCC remains at 3.3 V. This eliminates level shifters in mixed-voltage SoC designs. However, VIO must remain stable during all operations - dynamic VIO switching during active read/write is not supported and may cause data corruption.
S29GL512S11TFV013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512S11TFV013 FAQ
1.How can I place an order for S29GL512S11TFV013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S11TFV013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S11TFV013 reliable?
The price and inventory of S29GL512S11TFV013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11TFV013 is usually 5 days.
3.What payment methods are accepted for S29GL512S11TFV013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11TFV013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S11TFV013?
S29GL512S11TFV013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S11TFV013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S11TFV013?
For technical support, including S29GL512S11TFV013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11TFV013 requirements.
6.How does Aetrix verify that S29GL512S11TFV013 is sourced from the original manufacturer or authorized distributors?
All S29GL512S11TFV013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11TFV013 meets industry standards.
7.What is the process for return or replacement of S29GL512S11TFV013?
All S29GL512S11TFV013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11TFV013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S11TFV013 part is unused and in its original packaging.
Return procedure for S29GL512S11TFV013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512S11TFV013 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
