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Infineon Technologies S29GL512S11TFV023
- Part No.:
- S29GL512S11TFV023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512S11TFV023.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,065
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Product details
Overview
S29GL512S11TFV023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), and industrial temperature grade (–40°C to +85°C). It delivers 100 ns random access time, 15 ns page access time, and integrates hardware ECC for single-bit error correction. Used in boot code storage for embedded controllers requiring XIP execution and reliable firmware retention.
For engineers reviewing the S29GL512S11TFV023 datasheet, S29GL512S11TFV023 pinout, S29GL512S11TFV023 application, or S29GL512S11TFV023 equivalent, key selection criteria include page-mode read latency, 512-byte write buffer throughput, sector erase uniformity (128 kB), OTP array availability, and Versatile I/O voltage support (1.65–VCC).
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), 32-byte page-aligned read architecture, and embedded algorithm controller (EAC) for autonomous program/erase operations. It supports status register polling, RY/BY# pin signaling, and data polling for operation completion detection.
The MIRRORBIT™ Eclipse 65 nm process enables uniform 128-kbyte sectors, suspend/resume capability for both program and erase, and advanced sector protection (ASP) with volatile/non-volatile lock options. Internal hardware ECC operates transparently during read cycles without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB), organized as 4,194,304 × 16-bit words - defines maximum firmware image size and address space required |
| Random access time | 100 ns at VCC = VIO - determines worst-case instruction fetch delay in XIP configurations |
| Page access time | 15 ns - enables fast sequential reads within 32-byte aligned pages for tight-loop code execution |
| Write buffer size | 512 bytes (256 words) - reduces effective programming time by batching writes without host CPU overhead |
| ECC capability | Single-bit error correction per 512-byte sector - ensures data integrity without external error-handling logic |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - qualifies for long-lifecycle industrial control firmware storage |
| Operating temperature | –40°C to +85°C (Industrial grade) - supports deployment in uncontrolled ambient environments without thermal derating |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint with gull-wing leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | 25-bit word address bus (A24 = MSB); A22–A0 used for 128 Mb; A24–A0 for 512 Mb - defines physical memory map alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads - matches ARM Cortex-M3/M4/M7 and Power Architecture MCU interfaces |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching - critical for multi-device memory decoding |
| OE# | Output enable | Active-low read strobe; gates output drivers - enables shared bus arbitration with other peripherals |
| WE# | Write enable | Active-low write strobe; initiates internal program/erase algorithms - must meet tCE/tWE timing relative to CE#/OE# |
| RY/BY# | Ready/Busy indicator | Open-drain output; low during embedded operations - allows hardware polling without CPU intervention |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known state and aborts ongoing operations - essential for safe power-cycle recovery |
| VCC | Core supply | 3.0 V ±10% (2.7–3.6 V); powers core logic and charge pumps - eliminates need for separate 1.8 V/3.3 V rails |
| VIO | I/O supply | 1.65 V to VCC; independent of VCC - enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned page access with 15 ns cycle time - accelerates linear code execution without cache coherency management |
| 512-byte write buffer | Reduces average programming time by >3× vs. single-word writes - improves firmware update efficiency in field-deployed systems |
| Hardware ECC engine | Single-bit correction per 512-byte sector with no software overhead - eliminates need for external ECC logic or redundant storage |
| Uniform 128-kB sectors | Enables deterministic erase scheduling and wear leveling across full memory map - simplifies bootloader partitioning and OTA update design |
| OTP array (1024 B) | Two lockable regions for secure key storage or calibration data - provides tamper-resistant non-volatile storage independent of main array |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating in factory-floor environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <100 ns latency and guaranteed 20-year data retention. Use Value: Eliminates external SRAM copy step during boot; supports in-field firmware updates via 512-byte buffered writes without system interruption. |
Use Scenario: Holding calibrated display graphics, safety-critical boot code, and configuration parameters in automotive digital instrument clusters certified to AEC-Q100 Grade 3. IC Role / Device Role / Timing Role: Secure, high-reliability boot memory with hardware ECC and OTP lockable regions for cryptographic keys and calibration constants. Use Value: Meets ASIL-B functional safety requirements through built-in error detection/correction and sector-level write protection. |
| Medical Imaging System BIOS | Telecom Base Station Configuration Storage |
|
Use Scenario: Hosting diagnostic firmware, FPGA configuration bitstreams, and regulatory-compliant boot images in Class II medical imaging equipment requiring traceable firmware revisions. IC Role / Device Role / Timing Role: Trusted firmware repository with CFI-compliant parameter table for automatic driver initialization and sector protection for regulatory partitions. Use Value: Enables FDA audit-ready firmware versioning via OTP region locking and sector-wise write-protection granularity. |
Use Scenario: Storing FPGA configuration, RF calibration tables, and protocol stack parameters in outdoor telecom base station radios exposed to extended thermal cycling. IC Role / Device Role / Timing Role: High-endurance configuration memory supporting 100,000+ field updates over 15-year product lifecycle. Use Value: Delivers consistent 128-kB sector erase performance across –40°C to +85°C, enabling predictable OTA update timing in remote deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFV020 | Same density and package, but 90 ns random access (vs. 100 ns) and industrial-plus temp range (–40°C to +105°C) | Required for extended-temperature industrial edge gateways needing faster initial fetch latency | Select when tighter tACC and higher upper-temperature margin are mandatory; otherwise identical interface and firmware compatibility |
| MX29GL512FHT2I-90G | Macronix 512 Mb parallel NOR; 90 ns tACC, 1.8 V/3.0 V dual VIO, no integrated ECC | Lacks hardware ECC and OTP array; requires external error handling and key management | Choose only if cost sensitivity outweighs reliability requirements and ECC can be implemented in host firmware |
Compared with S29GL512S11TFV023, the S29GL512S10TFV020 offers faster random access and extended temperature range at identical pinout and feature set, while the MX29GL512FHT2I-90G sacrifices ECC and OTP security for lower unit cost and dual-voltage I/O flexibility.
Availability
S29GL512S11TFV023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical imaging system BIOS requiring stable component supply across multi-year production cycles.
Supply support for S29GL512S11TFV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-S family targets high-reliability embedded systems requiring XIP-capable NOR flash with integrated ECC, robust sector protection, and extended temperature operation - optimized for automotive, industrial, and medical firmware storage.
FAQ
Does S29GL512S11TFV023 support common flash interface (CFI) mode?
Yes, it implements a full CFI parameter table compliant with Intel Common Flash Interface specification v1.3. This enables automatic driver detection and configuration in Linux MTD and U-Boot environments without hard-coded timing parameters or vendor-specific initialization sequences.
Can the 1024-byte OTP array be reprogrammed after locking?
No. Once either OTP lock bit is set via the appropriate unlock-bypass-write sequence, that 512-byte region becomes permanently read-only. The two lockable regions operate independently, allowing one to remain programmable while the other is secured for keys or calibration data.
What is the minimum VIO voltage supported during read operations?
The minimum valid VIO is 1.65 V, verified across the full industrial temperature range. At this level, AC timing parameters (tACC, tPACC) are relaxed per datasheet Table 2-2, but DC input thresholds and output drive strength remain fully specified and functional.
Is hardware reset (RESET#) required before power-up?
No. The device includes internal power-on reset (POR) circuitry that asserts RESET# internally during VCC ramp-up. External RESET# assertion is only needed for synchronous recovery from brown-out or watchdog-triggered resets, not for initial power sequencing.
S29GL512S11TFV023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512S11TFV023 FAQ
1.How can I place an order for S29GL512S11TFV023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S11TFV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S11TFV023 reliable?
The price and inventory of S29GL512S11TFV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11TFV023 is usually 5 days.
3.What payment methods are accepted for S29GL512S11TFV023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11TFV023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S11TFV023?
S29GL512S11TFV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S11TFV023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S11TFV023?
For technical support, including S29GL512S11TFV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11TFV023 requirements.
6.How does Aetrix verify that S29GL512S11TFV023 is sourced from the original manufacturer or authorized distributors?
All S29GL512S11TFV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11TFV023 meets industry standards.
7.What is the process for return or replacement of S29GL512S11TFV023?
All S29GL512S11TFV023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11TFV023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S11TFV023 part is unused and in its original packaging.
Return procedure for S29GL512S11TFV023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512S11TFV023 Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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AT24C08C-STUM-T
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