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Infineon Technologies S29GL512S12TFBV10
- Part No.:
- S29GL512S12TFBV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512S12TFBV10.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,831
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Product details
Overview
S29GL512S12TFBV10 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial controllers and automotive ECUs.
For engineers reviewing the S29GL512S12TFBV10 datasheet, S29GL512S12TFBV10 pinout, S29GL512S12TFBV10 application, or S29GL512S12TFBV10 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and TSOP-56 / BGA package options.
Technical Context
This device implements asynchronous parallel interface logic with dedicated CE#, OE#, and WE# control lines, supporting XIP-capable read operations and embedded program/erase algorithms managed by an on-chip Embedded Algorithm Controller (EAC). Its architecture enables page-mode reads (32-byte aligned, 15 ns subsequent access) and buffer programming of up to 512 bytes per command.
The flash array is organized into uniform 128 kB sectors, each independently erasable, and includes a 1024-byte OTP array with dual lockable regions. Status monitoring uses status register polling, data polling, and RY/BY# pin assertion-enabling concurrent host operation during long-duration erase cycles via suspend/resume commands.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB), organized as 4,194,304 × 16-bit words |
| Random access time | 100 ns at VCC = VIO, enabling fast instruction fetch in XIP systems |
| Page access time | 15 ns for same-page reads, reducing latency in burst firmware access |
| Write buffer size | 512 bytes (256 words), allowing high-throughput firmware updates |
| ECC capability | On-die hardware single-bit error correction, eliminating need for external ECC logic |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention at 85°C |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2), validated for under-hood automotive use |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, 0.5 mm pitch, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | 25-bit address bus supporting full 512 Mb addressing (A24 MSB active) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65–3.6 V Versatile I/O voltage range |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low control for data bus output drivers during read operations |
| WE# | Write enable | Active-low strobe for latching address/data during program/erase commands |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling internal operation progress (low = busy) |
| WP# | Write protect | Hardware sector protection enable; low = lock all sectors against accidental erase/write |
| VCC | Core supply | 2.7–3.6 V single supply powering core logic, charge pumps, and interface |
| VIO | I/O supply | Independent 1.65–VCC supply for data/address buffers, decoupled from core rail |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse technology | Enables higher density and lower power vs. older floating-gate NOR, with improved endurance |
| Asynchronous 32-byte page read | Reduces average read latency in sequential firmware access without requiring clock synchronization |
| Automatic hardware ECC | Corrects single-bit errors on-the-fly during read, ensuring reliability without software overhead |
| Advanced sector protection (ASP) | Supports both volatile (power-cycle reset) and non-volatile (permanent) locking per 128 kB sector |
| Secure OTP array | 1024-byte one-time-programmable region with two independent lock bits for secure key or calibration storage |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in engine management systems requiring AEC-Q100 compliance. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability and deterministic 100 ns read access for deterministic startup timing. Use Value: Meets Grade 2 temperature range (–40°C to +105°C) and 100,000-cycle endurance for 15+ year vehicle service life. | Use Scenario: Holding field-upgradable ladder logic and configuration data in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: High-reliability firmware archive with sector-level erase isolation to prevent corruption during partial updates. Use Value: 128 kB uniform sectors allow safe in-field patching without full device reprogramming. |
| Medical Imaging System Boot Memory | Avionics Display Processor Code Storage |
Use Scenario: Hosting certified boot firmware and safety-critical initialization routines in FDA-regulated diagnostic imaging equipment. IC Role / Device Role / Timing Role: Secure, ECC-protected boot memory with OTP region for cryptographic key binding and tamper resistance. Use Value: Hardware ECC and dual-lock OTP meet IEC 62304 Class C software safety requirements. | Use Scenario: Storing display controller microcode and graphics assets in DO-178C-certified cockpit displays. IC Role / Device Role / Timing Role: Deterministic parallel read interface enabling sub-100 ns instruction fetch for real-time rendering pipelines. Use Value: Page-mode read (15 ns) minimizes CPU stall cycles during graphics asset streaming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512P11TFIV10 | Same density and architecture, but 110 ns random access (vs. 100 ns) and Industrial grade only (–40°C to +85°C) | Lacks AEC-Q100 Grade 2 qualification; unsuitable for under-hood automotive use | Select when cost sensitivity outweighs temperature or speed requirements |
| MX29GL512FHT2I-90G | Micron 512 Mb parallel NOR; 90 ns access, no integrated ECC, requires external error handling | No hardware ECC or OTP; higher system-level validation burden for safety-critical apps | Select only if legacy design compatibility or vendor consolidation drives sourcing |
Compared with S29GL512P11TFIV10 and MX29GL512FHT2I-90G, the S29GL512S12TFBV10 uniquely combines AEC-Q100 Grade 2 qualification, on-die ECC, and 100 ns access-reducing BOM count and certification effort in automotive and medical systems.
Availability
S29GL512S12TFBV10 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware updates, and avionics display controller production requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL512S12TFBV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems needing deterministic boot performance, long-term data integrity, and automotive-grade qualification-designed specifically for code storage in safety-critical ECUs and industrial controllers.
FAQ
What is the purpose of the Versatile I/O (VIO) supply pin?
The VIO pin supplies independent voltage (1.65 V to VCC) to the device's address and data buffers, enabling interoperability with mixed-voltage host systems-such as 1.8 V FPGAs or 3.3 V microcontrollers-without level-shifting components. This reduces board complexity and improves signal integrity in multi-rail designs.
Does S29GL512S12TFBV10 support execute-in-place (XIP) operation?
Yes-it supports true XIP operation due to its fast random access (100 ns) and asynchronous interface, allowing microprocessors to fetch instructions directly from flash without copying to RAM. The 32-byte page read mode further accelerates sequential instruction flow in boot and runtime code execution.
How does the 512-byte write buffer improve programming efficiency?
The 512-byte buffer allows up to 256 words to be loaded before initiating a program operation, reducing command overhead and bus arbitration delays. This achieves 1.5 MBps effective programming rate-over 3× faster than single-word programming-critical for field firmware updates in production and service environments.
Can the OTP array be used for cryptographic key storage?
Yes-the 1024-byte OTP array has two independently lockable regions, supporting permanent storage of asymmetric keys, certificates, or calibration data. Once locked, contents cannot be overwritten or read back, meeting basic hardware root-of-trust requirements for secure boot and device identity binding.
S29GL512S12TFBV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512S12TFBV10 FAQ
1.How can I place an order for S29GL512S12TFBV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S12TFBV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S12TFBV10 reliable?
The price and inventory of S29GL512S12TFBV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S12TFBV10 is usually 5 days.
3.What payment methods are accepted for S29GL512S12TFBV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S12TFBV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S12TFBV10?
S29GL512S12TFBV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S12TFBV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S12TFBV10?
For technical support, including S29GL512S12TFBV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S12TFBV10 requirements.
6.How does Aetrix verify that S29GL512S12TFBV10 is sourced from the original manufacturer or authorized distributors?
All S29GL512S12TFBV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S12TFBV10 meets industry standards.
7.What is the process for return or replacement of S29GL512S12TFBV10?
All S29GL512S12TFBV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S12TFBV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S12TFBV10 part is unused and in its original packaging.
Return procedure for S29GL512S12TFBV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512S12TFBV10 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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