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Infineon Technologies S29GL512T10DHA010
- Part No.:
- S29GL512T10DHA010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T10DHA010.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,615
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Product details
Overview
S29GL512T10DHA010 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring deterministic XIP execution.
For engineers reviewing the S29GL512T10DHA010 datasheet, S29GL512T10DHA010 pinout, S29GL512T10DHA010 application, or S29GL512T10DHA010 equivalent, key selection factors include verified 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) executes internal program and erase sequences without external timing control, while status monitoring uses Status Register, Data Polling, and RY/BY# pin outputs.
The versatile I/O feature enables independent VIO supply (1.65 V to VCC), decoupling I/O voltage from core logic. Sector protection includes volatile and non-volatile methods per sector, and the 2048-byte OTP array contains four SSR regions-SSR0 factory-locked and SSR3 password-read-protected-supporting secure firmware signing and configuration locking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full boot image + firmware partition in industrial HMI systems |
| Random access time | 100 ns at –40°C to +85°C - enables direct XIP execution without cache penalty in real-time PLCs |
| Page access time | 15 ns - accelerates sequential instruction fetch during boot initialization |
| Write buffer size | 512 bytes - reduces effective programming time by up to 4× vs. single-word writes |
| ECC capability | Internal hardware single-bit error correction - maintains data integrity without host CPU overhead |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ year product lifecycle |
| Data retention | 20 years at +85°C - ensures long-term reliability in unattended infrastructure equipment |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AC footprint, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs | 21-bit address bus supporting full 512 Mb linear addressing (byte/word mode) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; operates as DQ0–DQ7 in byte mode or full 16-bit word mode |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write enable | Active-low control for write/program/erase command initiation |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low = busy) |
| VCC | Core supply | 2.7 V–3.6 V single supply powering logic and memory array |
| VIO | I/O supply | 1.65 V–VCC independent I/O voltage enabling mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page read | 32-byte burst capability improves sequential instruction fetch throughput in boot ROM applications |
| Uniform 128-KB sectors | Enables granular firmware update partitioning without cross-sector wear leveling complexity |
| Suspend/Resume commands | Allows interrupting erase or program operations to service high-priority reads - critical for real-time OS boot loaders |
| CFI parameter table | Provides standardized software detection of geometry, timings, and command set - simplifies BSP portability across flash vendors |
| Advanced sector protection | Volatile/non-volatile lock bits per sector prevent accidental overwrite during field firmware upgrades |
Applications
| Industrial PLC Boot Memory | Medical Imaging System Firmware Storage |
|---|---|
Use Scenario: Stores boot loader and real-time OS kernel in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: NOR flash providing eXecute-in-Place (XIP) code execution with deterministic 100 ns access latency. Use Value: Eliminates need for external RAM copy during boot, reducing BOM cost and startup time by >150 ms. | Use Scenario: Holds FPGA configuration bitstreams and diagnostic firmware in portable ultrasound devices. IC Role / Device Role / Timing Role: Non-volatile storage with 20-year data retention and AEC-Q100 grade 3 qualification for medical-grade reliability. Use Value: Ensures firmware persistence through repeated thermal cycling and battery-backed power loss events. |
| Automotive ADAS Camera Module | Energy Meter Secure Configuration Storage |
Use Scenario: Stores calibration data and low-level driver binaries in surround-view camera ECUs operating at –40°C to +105°C. IC Role / Device Role / Timing Role: Automotive-grade (AEC-Q100 Grade 2) parallel flash with suspend/resume for concurrent diagnostics and firmware patching. Use Value: Enables safe over-the-air updates without disrupting real-time image processing pipelines. | Use Scenario: Stores tariff tables, cryptographic keys, and tamper logs in ANSI C12.22-compliant smart electricity meters. IC Role / Device Role / Timing Role: OTP array with password-protected SSR3 region secures root-of-trust keys against physical extraction. Use Value: Meets IEC 62055-41 security requirements for revenue-grade metering without external secure element. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI010 | Same density and architecture but uses 64-ball LAE BGA (9 mm × 9 mm); no TSOP option | Targeted at space-constrained automotive modules where board area is prioritized over socket-based serviceability | Select when PCB layout requires BGA footprint and thermal profile supports reflow-only assembly |
| MX29GL512FHI-10G | Macronix part with identical 512 Mb density, 100 ns tACC, but lacks OTP array and SSR protection features | Used in cost-sensitive consumer gateways where secure key storage is not required | Select only if CFI compatibility suffices and OTP-based firmware signing is unnecessary |
Compared with S29GL512S10TFI010, the TSOP package enables field-replaceable boot memory; compared with MX29GL512FHI-10G, the integrated OTP and SSR3 password protection provide certified secure storage for regulated industrial deployments.
Availability
S29GL512T10DHA010 is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging systems, automotive ADAS modules, and smart energy meters requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL512T10DHA010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-T family targets high-reliability embedded systems needing deterministic XIP performance, robust data retention, and secure firmware storage - bridging the gap between traditional code-execution and data-storage flash architectures.
FAQ
What is the maximum operating temperature range supported by S29GL512T10DHA010?
This part is rated for the industrial temperature range of –40°C to +85°C. It is not qualified for automotive grades (e.g., AEC-Q100 Grade 2 or 3) or extended temperature operation beyond +85°C. The datasheet specifies electrical parameters and endurance only within this range.
Does S29GL512T10DHA010 support both ×8 and ×16 data bus configurations?
Yes - it supports configurable ×8 (byte) or ×16 (word) operation via hardware pin strapping (BYTE# input). In ×16 mode, DQ15–DQ0 form the full data bus; in ×8 mode, only DQ7–DQ0 are active, and DQ15 serves as BYTE# control.
How does the 512-byte write buffer improve programming efficiency?
The buffer allows up to 512 bytes to be loaded before initiating a single embedded program operation, achieving 1.14 MBps effective write speed. This eliminates per-word command overhead and reduces total programming time by ~75% compared to standard single-word programming.
Is the OTP array fully accessible for user programming?
No - the 2048-byte OTP array contains four SSR regions (SSR0–SSR3). SSR0 is factory-locked and permanently read-only; SSR3 supports password-protected read access. Only SSR1 and SSR2 are freely user-programmable and lockable via command sequence.
S29GL512T10DHA010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T10DHA010 FAQ
1.How can I place an order for S29GL512T10DHA010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10DHA010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10DHA010 reliable?
The price and inventory of S29GL512T10DHA010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10DHA010 is usually 5 days.
3.What payment methods are accepted for S29GL512T10DHA010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10DHA010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10DHA010?
S29GL512T10DHA010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10DHA010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10DHA010?
For technical support, including S29GL512T10DHA010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10DHA010 requirements.
6.How does Aetrix verify that S29GL512T10DHA010 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10DHA010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10DHA010 meets industry standards.
7.What is the process for return or replacement of S29GL512T10DHA010?
All S29GL512T10DHA010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10DHA010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10DHA010 part is unused and in its original packaging.
Return procedure for S29GL512T10DHA010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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