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Infineon Technologies S29GL512T10DHA013

Name: S29GL512T10DHA013
Brand: Infineon Technologies
SKU: S29GL512T10DHA013
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512T10DHA013

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512T10DHA013.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL512T10DHA013 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial microcontrollers and FPGA configuration.

For engineers reviewing the S29GL512T10DHA013 datasheet, S29GL512T10DHA013 pinout, S29GL512T10DHA013 application, or S29GL512T10DHA013 equivalent, key selection criteria include parallel ×16 bus interface, 100,000 program/erase cycles, OTP array with four lockable regions, CFI compliance, and support for suspend/resume during erase/program operations.

Technical Context

This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both ×8 and ×16 data bus configurations. Its embedded algorithm controller (EAC) manages all program and erase operations, including automatic ECC generation and verification during write cycles.

The architecture includes dedicated address space overlays (ASOs) for device ID/CFI, status register, data polling, SSR (OTP), sector protection control, and ECC status - enabling standardized software compatibility and robust firmware update handling in embedded systems.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	512 Mb (64 MB) - sufficient for full bootloader, firmware image, and parameter storage in resource-constrained edge controllers.
Interface Type	Parallel ×16 (also ×8 configurable) - enables direct connection to microcontroller external memory buses without protocol translation.
Random Access Time	100 ns at –40°C to +85°C - meets real-time boot latency requirements for industrial PLCs and motor drives.
Write Buffer Size	512 bytes - reduces effective programming time by up to 10× vs. single-word writes, critical for field firmware updates.
ECC Support	Internal hardware single-bit error correction - eliminates need for external ECC logic or software overhead in safety-critical applications.
Endurance & Retention	100,000 program/erase cycles / 20-year data retention - validated for long-lifecycle deployments in infrastructure equipment.
Operating Voltage	VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - allows interoperability with mixed-voltage SoCs and low-power I/O domains.
Temperature Grade	Industrial (–40°C to +85°C) - qualified per JEDEC JESD22-A108, suitable for uncooled factory automation environments.

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm body, standard JEDEC MO-141AC footprint. Compatible with automated SMT placement and reflow profiles for high-volume manufacturing.

Pin/Terminal	Circuit Role	Design Meaning
A0–A21	Address Inputs	22-bit address bus supporting full 512 Mb addressing (byte/word aligned); A0 selects LSB/MSB in ×16 mode.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; operates in ×16 mode by default; DQ15 functions as BYTE# control in ×8 mode.
CE#	Chip Enable	Active-low chip select; controls device power state and enables read/write access only when asserted.
OE#	Output Enable	Active-low control for data output drivers; decouples read data timing from address setup.
WE#	Write Enable	Active-low signal initiating internal program/erase algorithms upon command sequence detection.
RY/BY#	Ready/Busy Output	Open-drain status indicator: low = operation in progress; high = ready for next command or read.
VCC	Core Supply	2.7–3.6 V main supply powering core logic, memory array, and EAC - no separate I/O rail required.
VIO	I/O Supply	1.65–VCC voltage rail for interface pins - enables direct connection to 1.8 V, 2.5 V, or 3.3 V host processors.
RESET#	Hardware Reset	Active-low input forcing device into reset state; clears status registers and aborts ongoing operations.

Key Features

Feature	Design Value
Versatile I/O (VIO)	Independent 1.65 V–VCC I/O supply allows seamless integration with mixed-voltage SoCs without level shifters.
512-byte Write Buffer	Enables burst programming of up to 512 bytes per command, reducing firmware update time by >80% vs. single-word writes.
Hardware ECC	On-the-fly single-bit error correction eliminates soft-error-induced boot failures in electrically noisy industrial settings.
OTP Array with SSR Locking	2048-byte one-time-programmable region with four independently lockable sectors (SSR0–SSR3), enabling secure key storage and firmware signing.
Suspend/Resume	Allows interrupting erase or program operations to service high-priority reads, essential for real-time HMI and control loop responsiveness.

Applications

Boot Code Storage

FPGA Configuration

Use Scenario: Storing boot firmware for ARM Cortex-M7-based industrial gateways requiring deterministic startup within 100 ms.

IC Role / Device Role / Timing Role: Primary non-volatile code memory mapped directly to processor's external bus; provides XIP-capable instruction fetch.

Use Value: 100 ns random access ensures immediate instruction execution post-reset; 128-KB uniform sectors simplify OTA update partitioning.

Use Scenario: Holding bitstream images for Xilinx Artix-7 FPGAs in programmable logic controllers with hot-swap capability.

IC Role / Device Role / Timing Role: Configuration memory accessed via parallel slave select during FPGA power-up or reconfiguration cycle.

Use Value: 512-byte write buffer accelerates partial reconfiguration writes; hardware ECC prevents corrupted bitstreams from causing logic faults.

Motor Drive Firmware

Medical Imaging Control

Use Scenario: Hosting safety-certified firmware and calibration tables for IEC 61800-compliant servo drives operating in variable-speed environments.

IC Role / Device Role / Timing Role: Dual-role memory: executes real-time control loops and stores runtime-tuned PID parameters in OTP-protected SSR3.

Use Value: SSR password read-protection secures proprietary tuning algorithms; 20-year retention guarantees calibration integrity over equipment lifetime.

Use Scenario: Storing DICOM-compliant UI assets and diagnostic firmware in portable ultrasound devices subject to strict EMC and thermal constraints.

IC Role / Device Role / Timing Role: Non-volatile storage for GUI resources and application binaries, accessed asynchronously during system initialization and recovery.

Use Value: Low standby current (100 μA) extends battery life; industrial temperature rating ensures reliability inside sealed enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFI010	Same density and core voltage, but uses 64-ball LAE BGA (9 mm × 9 mm); lacks OTP array and SSR locking.	Targeted at space-constrained consumer electronics where firmware security is secondary to footprint reduction.	Select if PCB area is critical and OTP functionality is unused; verify mechanical compatibility with existing layout.
MX29GL512FHI-10G	Micron part with identical 512 Mb density and 100 ns access, but requires separate VCCQ rail and offers no hardware ECC.	Used in cost-sensitive networking equipment where external ECC logic is already present in baseband processor.	Choose only when existing design already implements ECC in host SoC; avoid for new safety-critical designs.

Compared with S29GL512S10TFI010 and MX29GL512FHI-10G, the S29GL512T10DHA013 uniquely combines OTP-based firmware security, on-die ECC, and TSOP packaging - making it optimal for industrial firmware storage where reliability, security, and manufacturability are jointly prioritized.

Availability

S29GL512T10DHA013 is available at Aetrix Electronics and suitable for boot code storage, FPGA configuration, motor drive firmware, and medical imaging control requiring stable component supply across multi-year production cycles.

Supply support for S29GL512T10DHA013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial memory solutions, with global R&D and manufacturing infrastructure.

The GL-T family was designed specifically for high-reliability embedded systems needing fast XIP-capable flash with integrated data integrity features - targeting industrial automation, transportation, and medical equipment.

FAQ

Does S29GL512T10DHA013 support both ×8 and ×16 data bus widths?

Yes. The device supports configurable ×8/×16 operation via the BYTE# signal (DQ15). In ×16 mode, all 16 data lines are active; in ×8 mode, DQ0–DQ7 carry data and DQ15 serves as BYTE# control. Addressing remains word-aligned in both modes, and no external mode pins are required - configuration is handled by the host processor's bus width setting.

What is the function of the SSR (One-Time Programmable) array?

The 2048-byte SSR array contains four lockable regions (SSR0–SSR3). SSR0 is factory-locked and holds device-specific identifiers; SSR3 supports password-based read protection for storing cryptographic keys or calibration data. Once locked, SSR regions cannot be erased or rewritten - providing immutable, tamper-resistant storage for security-critical firmware elements.

How does the Ready/Busy# (RY/BY#) pin behave during embedded operations?

RY/BY# is an open-drain output that goes low at the start of any embedded operation (program or erase) and returns high only after completion or successful suspension. It can be polled synchronously or used to generate interrupts. Unlike status register polling, RY/BY# provides hardware-level timing certainty - essential for deterministic real-time response in motor control and safety systems.

Is the S29GL512T10DHA013 compatible with Common Flash Interface (CFI) readers?

Yes. The device implements a full CFI parameter table accessible via standard command sequences (e.g., Read Query Data at address 0x55). This enables automatic detection and configuration by CFI-aware bootloaders and flash programming tools, eliminating manual timing or command set configuration in development and production environments.

S29GL512T10DHA013 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-T

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 64M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL512T10DHA013 FAQ

1.How can I place an order for S29GL512T10DHA013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512T10DHA013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512T10DHA013 reliable?

The price and inventory of S29GL512T10DHA013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10DHA013 is usually 5 days.

3.What payment methods are accepted for S29GL512T10DHA013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10DHA013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512T10DHA013?

S29GL512T10DHA013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512T10DHA013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512T10DHA013?

For technical support, including S29GL512T10DHA013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10DHA013 requirements.

6.How does Aetrix verify that S29GL512T10DHA013 is sourced from the original manufacturer or authorized distributors?

All S29GL512T10DHA013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10DHA013 meets industry standards.

7.What is the process for return or replacement of S29GL512T10DHA013?

All S29GL512T10DHA013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10DHA013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512T10DHA013 part is unused and in its original packaging.

Return procedure for S29GL512T10DHA013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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