Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512T10DHA020

Name: S29GL512T10DHA020
Brand: Infineon Technologies
SKU: S29GL512T10DHA020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL512T10DHA020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512T10DHA020.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,320

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL512T10DHA020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). Used in boot code storage for embedded microcontrollers in industrial HMIs and network edge gateways.

For engineers reviewing the S29GL512T10DHA020 datasheet, S29GL512T10DHA020 pinout, S29GL512T10DHA020 application, or S29GL512T10DHA020 equivalent, key selection criteria include verified 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during programming and erase operations.

Technical Context

This device implements asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages all program and erase operations autonomously, including automatic ECC generation and verification during write cycles.

The status monitoring architecture supports three concurrent methods: Status Register polling, Data Polling (DQ7), and RY/BY# pin assertion. Sector protection uses both volatile (via Status Register) and non-volatile (via ASP bits) mechanisms, with dedicated 2048-byte OTP array divided into four lockable sectors (SSR0–SSR3), where SSR0 is factory-locked and SSR3 supports password-based read protection.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	512 Mb (64 MB) - provides sufficient space for full firmware images and parameter tables in resource-constrained embedded systems.
Access Time (tACC)	100 ns at –40°C to +85°C - enables direct XIP execution from flash without external cache in real-time control applications.
Page Access Time (tPACC)	15 ns - accelerates sequential instruction fetch during boot or interrupt vector loading.
Write Buffer Size	512 bytes - reduces effective programming time by batching up to 256 words per command, improving firmware update throughput.
ECC Support	Internal hardware single-bit error correction - ensures data integrity over 20-year retention without software overhead.
Endurance	100,000 program/erase cycles - supports field-upgradable firmware in industrial controllers with infrequent but critical updates.
Operating Voltage	VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - allows interoperability with mixed-voltage SoCs and legacy 3.3 V logic interfaces.
Temperature Grade	Industrial (–40°C to +85°C) - qualified for deployment in uncontrolled ambient environments such as factory automation panels.

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint with 0.5 mm pitch.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address Inputs	24-bit address bus supporting full 512 Mb addressing with byte/word alignment; A0 selects LSB/MSB in ×16 mode.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; operates in ×8 mode when DQ8–DQ15 are unused or in ×16 mode with full width.
CE#	Chip Enable	Active-low enable controlling device selection; tCE = 100 ns max defines minimum chip select assertion window for reliable read timing.
OE#	Output Enable	Active-low control for data output gating; tOE = 25 ns max determines maximum delay from OE# assertion to valid data.
WE#	Write Enable	Active-low signal initiating write cycles; used with CE# and address setup to launch program/erase commands via command register interface.
RY/BY#	Ready/Busy Output	Open-drain status indicator: low during embedded operations (program/erase), high when ready for next command.
RESET#	Hardware Reset	Active-low input forcing device into reset state; required before power-up initialization or recovery from unknown states.
VCC / VIO	Power Supplies	VCC powers core logic (2.7–3.6 V); VIO powers I/O buffers (1.65–VCC), enabling flexible voltage translation with host processors.

Key Features

Feature	Design Value
Versatile I/O Interface	VIO range of 1.65 V to VCC decouples I/O voltage from core supply, allowing seamless integration with 1.8 V, 2.5 V, or 3.3 V host buses without level shifters.
Asynchronous Page Read	32-byte page read mode delivers burst-like performance for instruction fetch while maintaining full random access capability.
OTP Array with SSR Locking	2048-byte one-time-programmable area segmented into four lockable sectors (SSR0–SSR3), enabling secure storage of keys, calibration data, or boot configuration with hardware-enforced write protection.
Advanced Sector Protection	Combines volatile (SR-based) and non-volatile (ASP bit-based) locking per 128-KB sector, permitting dynamic protection during runtime and persistent lockdown across power cycles.
CFI Compliance	Common Flash Interface parameter table enables automatic detection and configuration by BIOS/bootloader, eliminating hardcoded memory map assumptions.

Applications

Industrial HMI Boot Storage

Network Edge Gateway Firmware

Use Scenario: Storing boot loader and kernel image in programmable logic controllers with no external RAM for XIP execution.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with deterministic 100 ns read latency enabling real-time interrupt response.

Use Value: Eliminates need for SRAM shadow copy; supports secure firmware updates via 512-byte buffer and ECC-verified writes.

Use Scenario: Holding firmware and configuration data in 5G small cell gateways deployed in outdoor enclosures.

IC Role / Device Role / Timing Role: High-reliability firmware repository operating across –40°C to +85°C with 20-year data retention guarantee.

Use Value: OTP SSR3 region stores device-specific encryption keys protected by password read lock, preventing unauthorized extraction.

Automotive Instrument Cluster

Medical Diagnostic Imaging Controller

Use Scenario: Hosting GUI assets and safety-critical boot code in AEC-Q100 grade 3 instrument clusters.

IC Role / Device Role / Timing Role: Dual-role memory: XIP-capable code store and parameter logging buffer with sector erase granularity.

Use Value: Uniform 128-KB sectors allow independent firmware module updates without erasing calibration data stored in adjacent sectors.

Use Scenario: Storing FPGA configuration bitstreams and diagnostic algorithms in portable ultrasound imaging units.

IC Role / Device Role / Timing Role: Non-volatile configuration memory interfaced directly to FPGA's parallel configuration port.

Use Value: Hardware ECC ensures bitstream integrity after repeated reconfiguration cycles, avoiding functional failure due to latent bit flips.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFI020	Same density and architecture but uses 64-ball LAE BGA (9 mm × 9 mm); lacks OTP array and SSR locking.	Targeted at space-constrained designs where firmware security is secondary to board area reduction.	Select when footprint optimization outweighs need for hardware-secured key storage.
MX29GL512FHI-10G	Micron part with identical 512 Mb density, 100 ns access, and CFI compliance; no built-in ECC or OTP array.	Used in cost-sensitive consumer electronics where external ECC handling is acceptable.	Choose only if host processor implements software ECC and secure key management externally.

Compared with S29GL512S10TFI020 and MX29GL512FHI-10G, the S29GL512T10DHA020 uniquely integrates hardware ECC, OTP with password-protected SSR3, and industrial-grade reliability-making it the sole option among the three for safety-critical or secure firmware storage.

Availability

S29GL512T10DHA020 is available at Aetrix Electronics and suitable for industrial HMI boot storage, network edge gateway firmware, and automotive instrument cluster applications requiring stable component supply and long-term lifecycle support.

Supply support for S29GL512T10DHA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100 standards.

The GL-T family targets high-reliability embedded systems needing fast XIP-capable flash with integrated data integrity and security features-designed specifically for industrial control, networking infrastructure, and automotive cockpit electronics.

FAQ

What is the function of the RY/BY# pin on S29GL512T10DHA020?

The RY/BY# pin is an open-drain output that signals device readiness: it is driven low during active program or erase operations and returns high when the operation completes or the device is idle. This pin enables hardware handshaking without polling, reducing CPU overhead in time-critical firmware update sequences.

Does S29GL512T10DHA020 support both ×8 and ×16 data bus configurations?

Yes, it supports both modes via hardware configuration: in ×16 mode, DQ0–DQ15 are active and A0 selects byte lane; in ×8 mode, only DQ0–DQ7 are used and A0 is ignored. The mode is determined by connection of BYTE# pin-tied high for ×16, low for ×8-and requires corresponding address/data bus routing.

How does the OTP array work, and what prevents accidental overwrite of SSR0?

SSR0 is factory-locked and cannot be unlocked or rewritten under any condition; its contents are permanently fixed during manufacturing. The remaining SSR regions (SSR1–SSR3) are user-lockable via dedicated commands, with SSR3 supporting password-based read protection-requiring correct 16-bit password entry before read access is granted.

Can S29GL512T10DHA020 operate reliably at 105°C ambient temperature?

No-this specific variant (S29GL512T10DHA020) is rated for industrial grade (–40°C to +85°C). For +105°C operation, Infineon offers the S29GL512T10DHB020 variant, which uses the same die but is screened and qualified to Industrial Plus temperature range with adjusted timing parameters (e.g., tACC = 110 ns).

S29GL512T10DHA020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-T

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 64M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL512T10DHA020 FAQ

1.How can I place an order for S29GL512T10DHA020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512T10DHA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512T10DHA020 reliable?

The price and inventory of S29GL512T10DHA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10DHA020 is usually 5 days.

3.What payment methods are accepted for S29GL512T10DHA020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10DHA020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512T10DHA020?

S29GL512T10DHA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512T10DHA020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512T10DHA020?

For technical support, including S29GL512T10DHA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10DHA020 requirements.

6.How does Aetrix verify that S29GL512T10DHA020 is sourced from the original manufacturer or authorized distributors?

All S29GL512T10DHA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10DHA020 meets industry standards.

7.What is the process for return or replacement of S29GL512T10DHA020?

All S29GL512T10DHA020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10DHA020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512T10DHA020 part is unused and in its original packaging.

Return procedure for S29GL512T10DHA020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

2026-06-27 Machine Vision System: Components, Inspection Applications and Integration Guide

Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

2026-06-23 Electronic Devices and Circuits: Fundamentals, Components and Applications

Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…