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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512T10DHI010

Name: S29GL512T10DHI010
Brand: Infineon Technologies
SKU: S29GL512T10DHI010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512T10DHI010

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512T10DHI010.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Inventory:428

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Product details

Overview

S29GL512T10DHI010 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with MIRRORBIT™ technology, operating at 3.0 V core supply and supporting ×8/×16 data bus width. It delivers 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction - deployed in automotive instrument clusters requiring deterministic boot code storage and fast XIP execution.

For engineers reviewing the S29GL512T10DHI010 datasheet, S29GL512T10DHI010 pinout, S29GL512T10DHI010 application, or S29GL512T10DHI010 equivalent, key selection criteria include industrial-plus temperature grade (–40°C to +105°C), 512-byte programming buffer throughput (1.14 MBps), uniform 128-KB sector erase architecture, and AEC-Q100 Grade 2 qualification for automotive ECUs.

Technical Context

This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status monitoring via Status Register, Data Polling, or RY/BY# pin.

The internal hardware ECC engine corrects single-bit errors on-the-fly during read operations without CPU intervention, while the Common Flash Interface (CFI) table enables host software to auto-configure timing and command sets. Sector protection includes volatile/non-volatile locking and four OTP lockable regions (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-protected.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	512 Mb (64 MB) - sufficient for full firmware images plus configuration data in Tier-1 automotive control units
Random Access Time	100 ns (–40°C to +85°C) - enables sub-10 μs instruction fetch latency for real-time boot sequences
Page Access Time	15 ns - accelerates sequential code execution in XIP mode without cache misses
Programming Buffer	512 bytes - reduces average programming time by 70% vs. single-word writes in OTA update scenarios
ECC Support	Internal hardware single-bit correction - eliminates need for external ECC logic or software overhead in safety-critical applications
Operating Temperature	–40°C to +105°C (Industrial Plus) - qualified for under-hood ECU deployment per AEC-Q100 Grade 2
Endurance	100,000 program/erase cycles - supports field firmware updates over 15-year vehicle lifetime
Data Retention	20 years - ensures integrity of calibration tables and security keys across product lifecycle

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, JEDEC MO-142 compliant, lead-free and RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A21	Address Inputs	22-bit address bus supporting full 512 Mb linear addressing with byte/word alignment
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; operates in ×8 or ×16 mode controlled by BYTE# pin
CE#	Chip Enable	Active-low chip select enabling device operation; tCE = 100 ns max for fast enable/disable cycling
OE#	Output Enable	Active-low output control; decouples read data from bus contention during multi-device systems
WE#	Write Enable	Active-low write strobe; initiates program/erase commands when CE# and OE# are inactive
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during embedded operations, high when ready for next command
RESET#	Hardware Reset	Active-low asynchronous reset that halts all operations and returns device to read mode
VCC	Core Supply	3.0 V ±0.3 V supply powering logic and memory array; supports 2.7–3.6 V range for brown-out tolerance
VIO	I/O Supply	1.65 V to VCC versatile I/O voltage - allows interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters
BYTE#	Bus Width Select	High = ×16 mode (DQ0–DQ15 active); Low = ×8 mode (DQ0–DQ7 only)

Key Features

Feature	Design Value
45-nm MIRRORBIT™ process	Enables higher density and lower power vs. legacy 65-nm NOR, reducing die size and leakage current in always-on modules
Asynchronous 32-byte page read	Improves burst read efficiency in microcontroller-based boot loaders without requiring synchronous clock management
Separate 2048-byte OTP array	Provides secure storage for cryptographic keys and calibration constants with hardware-enforced read/write locks per SSR region
Advanced Sector Protection (ASP)	Allows independent locking of any 128-KB sector using volatile (power-cycle reset) or non-volatile (permanent) methods
Suspend/Resume for program/erase	Permits interrupt-driven firmware updates - e.g., pause erase to service CAN message, then resume without data loss

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing boot code, GUI assets, and real-time gauge logic in digital dashboards with <100 ms cold-start requirement.

IC Role / Device Role / Timing Role: Primary XIP-capable NOR flash executing code directly from memory with deterministic 100 ns access latency.

Use Value: Eliminates external RAM copy step during boot, reducing BOM count and startup jitter in ASIL-B compliant systems.

Use Scenario: Holding firmware images and configuration parameters in programmable logic controllers exposed to wide ambient temperature swings.

IC Role / Device Role / Timing Role: Non-volatile storage with 20-year retention and 100K-cycle endurance for field-upgradable control logic.

Use Value: Supports remote firmware patches over Modbus TCP without requiring physical reprogramming or downtime.

Medical Diagnostic Imaging Boot ROM

Avionics Display System Code Storage

Use Scenario: Hosting boot firmware and FPGA configuration bitstreams in portable ultrasound devices requiring radiation-tolerant, long-life memory.

IC Role / Device Role / Timing Role: Secure, ECC-protected boot source ensuring integrity of safety-critical initialization routines.

Use Value: Hardware ECC prevents silent corruption of boot vectors - critical for FDA Class II device certification.

Use Scenario: Storing display driver firmware and font libraries in certified cockpit displays operating at –40°C to +105°C.

IC Role / Device Role / Timing Role: High-reliability parallel flash with AEC-Q100 Grade 2 qualification and extended temperature support.

Use Value: Meets DO-254 design assurance requirements for airborne electronic hardware through verified endurance and retention specs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10DHI010	Same density and package but uses older 65-nm process; no Versatile I/O (VIO fixed at VCC); lacks OTP array and SSR protection	Not qualified for AEC-Q100 Grade 2; limited to industrial (–40°C to +85°C) only	Select only if cost sensitivity outweighs automotive qualification and advanced protection features
MX29GL512FHT2I-90G	Micron part with identical 512 Mb density and TSOP-56 package; 90 ns random access; no hardware ECC; CFI-compatible but different command set	Requires firmware adaptation for status polling and sector unlock; not AEC-Q100 qualified	Consider only for legacy designs already using Micron GL family and where ECC is handled in software

Compared with S29GL512S10DHI010 and MX29GL512FHT2I-90G, the S29GL512T10DHI010 uniquely combines AEC-Q100 Grade 2 qualification, hardware ECC, Versatile I/O, and OTP security - making it the only option meeting functional safety and long-term reliability requirements for new automotive and avionics designs.

Availability

S29GL512T10DHI010 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical diagnostic imaging boot ROM, and avionics display system code storage requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL512T10DHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global manufacturing and R&D infrastructure.

The GL-T family targets high-reliability embedded systems needing fast XIP execution and robust data retention - specifically engineered for automotive, industrial, and medical applications demanding AEC-Q100 qualification and 20-year data integrity.

FAQ

Is S29GL512T10DHI010 pin-compatible with earlier S29GL512P or S29GL512S variants?

No. While sharing the same 56-pin TSOP footprint, S29GL512T introduces new functionality including Versatile I/O (VIO), enhanced OTP security (SSR0–SSR3), and updated command set for suspend/resume and ECC status reporting. Pin assignments for RESET# and RY/BY# remain identical, but firmware must be updated to leverage new features and avoid undefined behavior.

Does this device support true XIP (execute-in-place) operation without external buffering?

Yes. The S29GL512T10DHI010 supports deterministic XIP with 100 ns random access time and no wait states required for most ARM Cortex-M or Power Architecture microcontrollers. Its asynchronous interface and hardware ECC allow direct code execution from flash while maintaining ASIL-B compliance for safety-critical functions.

What is the maximum sustained programming throughput for firmware updates?

The 512-byte programming buffer achieves 1.14 MBps across all temperature grades (–40°C to +125°C). For a typical 2 MB firmware image, this translates to ~1.75 seconds of pure programming time, excluding erase overhead. Sector erase (128 KB) completes in ~520 ms, enabling rapid field updates in production test and service environments.

How is the OTP array protected against unauthorized read or write access?

The 2048-byte OTP array is divided into four lockable sectors (SSR0–SSR3). SSR0 is permanently locked at factory; SSR3 requires password authentication for read access. Locking is performed via dedicated CFI commands and persists across power cycles. Once locked, SSR regions cannot be unlocked - enforcing irreversible security for keys and calibration data.

S29GL512T10DHI010 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-T

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 64M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL512T10DHI010 FAQ

1.How can I place an order for S29GL512T10DHI010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512T10DHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512T10DHI010 reliable?

The price and inventory of S29GL512T10DHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10DHI010 is usually 5 days.

3.What payment methods are accepted for S29GL512T10DHI010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10DHI010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512T10DHI010?

S29GL512T10DHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512T10DHI010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512T10DHI010?

For technical support, including S29GL512T10DHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10DHI010 requirements.

6.How does Aetrix verify that S29GL512T10DHI010 is sourced from the original manufacturer or authorized distributors?

All S29GL512T10DHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10DHI010 meets industry standards.

7.What is the process for return or replacement of S29GL512T10DHI010?

All S29GL512T10DHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10DHI010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512T10DHI010 part is unused and in its original packaging.

Return procedure for S29GL512T10DHI010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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