Infineon Technologies S29GL512T10DHI020
- Part No.:
- S29GL512T10DHI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T10DHI020.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:275
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Product details
Overview
S29GL512T10DHI020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL512T10DHI020 datasheet, S29GL512T10DHI020 pinout, S29GL512T10DHI020 application, or S29GL512T10DHI020 equivalent, key selection criteria include verified 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI-compliant interface, and support for suspend/resume during embedded operations - all critical for firmware-resident embedded systems with long lifecycle requirements.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, and status monitoring without external intervention, while hardware ECC operates transparently during read operations.
The versatile I/O feature enables independent VIO supply (1.65 V to VCC), decoupling I/O voltage from core logic. Sector protection includes volatile/non-volatile ASP and factory-locked SSR0 plus password-protected SSR3 - supporting secure firmware partitioning in safety-critical applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full boot image + firmware + parameter storage in mid-tier industrial controllers |
| Random Access Time | 100 ns at –40°C to +85°C - enables direct XIP execution without cache penalty in real-time systems |
| Page Access Time | 15 ns - accelerates sequential instruction fetch during boot or firmware update |
| Write Buffer Size | 512 bytes - reduces average programming time by batching up to 256 words per command |
| ECC Capability | Single-bit error correction via on-die hardware - eliminates need for external ECC logic in host MCU |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years of operation |
| Data Retention | 20 years at +85°C - ensures firmware integrity across product lifetime without refresh |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint. Compatible with automated PCB assembly and reflow profiles for industrial-grade boards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 512 Mb linear addressing (byte/word mode) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; operates in ×8 or ×16 mode per configuration pins |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE = 100 ns max for timing-critical boot sequences |
| OE# | Output Enable | Active-low control for data output gating; tOE = 25 ns max ensures clean read strobing |
| WE# | Write Enable | Active-low signal initiating internal program/erase algorithms; synchronized with address/data setup |
| RY/BY# | Ready/Busy Output | Open-drain status indicator - low during embedded operations, enabling host polling or interrupt-driven flow control |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O Voltage | VIO range 1.65 V to VCC allows interoperability with 1.8 V, 2.5 V, or 3.3 V host interfaces without level shifters |
| OTP Array with SSR Locking | 2048-byte one-time-programmable area with four independently lockable sectors (SSR0–SSR3), enabling secure key storage and bootloader locking |
| Suspend/Resume Support | Interrupts ongoing program or erase to service high-priority reads - essential for real-time OS environments |
| CFI Parameter Table | Standardized JEDEC CFI structure enables automatic driver detection and configuration in Linux/U-Boot environments |
Applications
| Industrial PLC Boot Memory | Automotive ADAS Firmware Storage |
|---|---|
Use Scenario: Stores boot loader, RTOS kernel, and configuration tables in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <100 ns latency. Use Value: Eliminates external SRAM copy step during boot; 20-year data retention prevents field corruption in unattended deployments. | Use Scenario: Holds firmware images and calibration data for radar ECU modules operating under AEC-Q100 Grade 2 conditions (–40°C to +105°C). IC Role / Device Role / Timing Role: Secure, high-reliability firmware storage with OTP-protected bootloader and hardware ECC. Use Value: Meets automotive functional safety requirements via sector-level protection and 100K-cycle endurance for OTA updates. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Stores diagnostic BIOS and FPGA configuration bitstreams in portable ultrasound devices requiring certified data integrity. IC Role / Device Role / Timing Role: Trusted firmware repository with factory-locked SSR0 and password-protected SSR3 for regulatory compliance. Use Value: Supports FDA 21 CFR Part 11 audit trails via immutable OTP regions and CFI-verified identity. | Use Scenario: Maintains runtime configuration, encryption keys, and failover profiles in carrier-grade 5G baseband units. IC Role / Device Role / Timing Role: High-availability configuration store with suspend/resume capability during live traffic. Use Value: Enables zero-downtime firmware patching via background sector erase without interrupting RF processing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10DHI020 | Same density and package, but uses older 65-nm process; 110 ns random access vs. 100 ns | Lacks hardware ECC and OTP SSR locking; no CFI support | Select only if legacy design compatibility or cost sensitivity outweighs ECC and security needs |
| MX29GL512FHI-10G | Macronix part with identical 512 Mb density, 100 ns access, and 512-byte buffer; no OTP array | Supports only industrial grade (–40°C to +85°C); no AEC-Q100 qualification | Prefer when automotive qualification is unnecessary and supply chain diversification is required |
Compared with S29GL512S10DHI020 and MX29GL512FHI-10G, the S29GL512T10DHI020 uniquely combines hardware ECC, four-region OTP locking, and AEC-Q100 Grade 2 support - making it the only choice for safety-critical, field-upgradable embedded systems requiring both data integrity and secure firmware partitioning.
Availability
S29GL512T10DHI020 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T10DHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions.
The GL-T family targets embedded systems needing robust, high-density parallel NOR flash with XIP performance, ECC, and secure OTP - specifically designed for industrial control, automotive, and medical applications demanding long-term data integrity.
FAQ
What is the maximum operating temperature range for S29GL512T10DHI020?
This part is qualified for Industrial Plus grade (–40°C to +105°C), confirmed in the datasheet Rev. *M section "Temperature range / grade". It meets AEC-Q100 Grade 2 requirements and supports full electrical specifications-including 100 ns random access and 100,000 endurance cycles-within this range.
Does S29GL512T10DHI020 support both ×8 and ×16 data bus modes?
Yes. The device automatically detects bus width via A0 pin state at power-on reset and configures DQ0–DQ7 (×8) or DQ0–DQ15 (×16). This is defined in Section 8.3 "Word/Byte configuration" and validated in AC timing tables for both modes.
How is the OTP array protected against unauthorized access?
SSR0 is factory-locked and permanently read-only. SSR3 supports password-based read protection implemented in hardware; access requires correct 16-bit password written to specific address before read. SSR1 and SSR2 are user-lockable via dedicated commands per Section 3.3.
Can S29GL512T10DHI020 be used in place of S29GL512P10TFI020?
No. The S29GL512P variant uses a different 64-ball LAE BGA package (9 mm × 9 mm) and lacks hardware ECC and OTP SSR functionality. Pinout, timing, and feature set are not compatible - substitution requires full hardware and firmware validation.
S29GL512T10DHI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T10DHI020 FAQ
1.How can I place an order for S29GL512T10DHI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10DHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10DHI020 reliable?
The price and inventory of S29GL512T10DHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10DHI020 is usually 5 days.
3.What payment methods are accepted for S29GL512T10DHI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10DHI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10DHI020?
S29GL512T10DHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10DHI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10DHI020?
For technical support, including S29GL512T10DHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10DHI020 requirements.
6.How does Aetrix verify that S29GL512T10DHI020 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10DHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10DHI020 meets industry standards.
7.What is the process for return or replacement of S29GL512T10DHI020?
All S29GL512T10DHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10DHI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10DHI020 part is unused and in its original packaging.
Return procedure for S29GL512T10DHI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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