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Infineon Technologies S29GL512T10DHI023
- Part No.:
- S29GL512T10DHI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T10DHI023.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,463
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Product details
Overview
S29GL512T10DHI023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring deterministic XIP execution.
For engineers reviewing the S29GL512T10DHI023 datasheet, S29GL512T10DHI023 pinout, S29GL512T10DHI023 application, or S29GL512T10DHI023 equivalent, key selection criteria include parallel ×16 bus interface, 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI-compliant identification, and support for suspend/resume during erase.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages all program and erase operations, including automatic ECC generation and verification during write/erase cycles.
The flash array is organized into uniform 128-KB sectors, each independently erasable, and includes dedicated status register, data polling, and RY/BY# signaling for real-time operation monitoring. Sector protection is implemented via volatile and non-volatile methods, including factory-locked SSR0 and password-protected SSR3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - provides sufficient space for firmware images and configuration data in resource-constrained embedded systems. |
| Interface Type | Asynchronous parallel ×16 - enables direct CPU bus connection without protocol translation or external logic. |
| Random Access Time | 100 ns at –40°C to +85°C - ensures deterministic timing for XIP execution in real-time control applications. |
| Write Buffer Size | 512 bytes - reduces effective programming time by batching up to 256 words per command, improving firmware update throughput. |
| ECC Support | Internal hardware single-bit error correction - maintains data integrity without software overhead or external ECC controller. |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over extended product lifecycles in industrial deployments. |
| Data Retention | 20 years - guarantees long-term reliability of stored boot code and calibration parameters without refresh. |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), standard JEDEC MO-141AC footprint, suitable for surface-mount reflow assembly and legacy PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 512 Mb address space with byte/word alignment. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×16 mode with DQ15/A-1 used as LSB address bit in ×8 mode. |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE = 100 ns max defines minimum chip select assertion window. |
| OE# | Output Enable | Active-low control for data output gating; tOE = 25 ns max ensures fast read turnaround. |
| WE# | Write Enable | Active-low signal initiating write/program commands; synchronized with address and data setup/hold timing. |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low during embedded operations (program/erase), high when ready for next command. |
| VCC | Core Supply | 2.7 V–3.6 V single supply powering logic and memory array; no separate VPP required. |
| VIO | I/O Supply | 1.65 V–VCC versatile I/O voltage - allows interfacing with mixed-voltage microcontrollers without level shifters. |
Key Features
| Feature | Design Value |
|---|---|
| 45-nm MIRRORBIT™ process | Enables higher density and lower power vs. older floating-gate NOR, with improved cell reliability and scalability. |
| 512-byte programming buffer | Reduces average programming time by >60% compared to single-word writes, critical for OTA firmware updates. |
| Hardware ECC engine | Corrects single-bit errors on-the-fly during reads, eliminating need for software ECC routines or external error-handling logic. |
| Four-lockable OTP regions (SSR0–SSR3) | Supports secure boot partitioning: SSR0 factory-locked for immutable root keys; SSR3 password-protected for customer-specific secrets. |
| CFI parameter table | Enables runtime detection of device geometry, timing, and command set - simplifies bootloader portability across flash families. |
Applications
| Industrial PLC Boot Memory | Automotive Instrument Cluster Firmware |
|---|---|
Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <100 ns latency. Use Value: Deterministic startup timing and 20-year data retention ensure uninterrupted operation across 15+ year equipment lifespans. | Use Scenario: Holding calibrated display firmware and safety-critical UI assets in automotive digital instrument clusters meeting AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: High-reliability firmware storage with ECC and sector protection to prevent corruption during vehicle battery transients. Use Value: Internal ECC and 100,000-cycle endurance support repeated firmware updates over vehicle lifetime without field failure risk. |
| Medical Imaging System Configuration | Avionics Data Recorder Boot Image |
Use Scenario: Storing calibration tables, sensor profiles, and regulatory-compliant boot images in FDA-cleared diagnostic imaging equipment. IC Role / Device Role / Timing Role: Secure, tamper-resistant configuration store with OTP-locked SSR0 holding cryptographic keys for firmware signature validation. Use Value: Factory-locked SSR0 prevents unauthorized key extraction; password-protected SSR3 enables field-updatable calibration data. | Use Scenario: Hosting certified DO-178C boot image and flight data logging firmware in airborne data acquisition units operating at –40°C to +125°C. IC Role / Device Role / Timing Role: Extended temperature-grade parallel NOR flash delivering guaranteed 120 ns access time at +125°C for deterministic boot sequencing. Use Value: Validated operation up to +125°C and 20-year retention meet RTCA DO-160 environmental and DO-254 hardware lifecycle requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI020 | Same density and architecture but uses 64-ball LAE BGA (9 mm × 9 mm); lacks OTP array and SSR protection. | Targeted at space-constrained consumer electronics where security features are not required. | Select when board area is critical and OTP-based secure boot is unnecessary. |
| MX29GL512FHT2I-90G | Micron part with identical 512 Mb density, 90 ns access, but no hardware ECC or CFI support; requires external error handling. | Suitable for cost-sensitive industrial gateways where firmware integrity is managed in software. | Choose only if ECC and CFI are handled externally and timing margin allows 90 ns vs. 100 ns requirement. |
Compared with S29GL512S10TFI020 and MX29GL512FHT2I-90G, the S29GL512T10DHI023 uniquely combines OTP-based security, hardware ECC, and CFI compliance in a TSOP package-making it optimal for safety- or security-critical boot memory where layout flexibility and firmware integrity are non-negotiable.
Availability
S29GL512T10DHI023 is available at Aetrix Electronics and suitable for industrial PLCs, automotive instrument clusters, and medical imaging systems requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for S29GL512T10DHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.
The GL-T family was designed specifically for embedded boot code storage in safety-critical systems, balancing XIP performance, firmware security, and extended temperature resilience across industrial and automotive applications.
FAQ
What is the maximum operating temperature grade supported by S29GL512T10DHI023?
This part is rated for the Industrial temperature range of –40°C to +85°C, as confirmed by its ordering code suffix 'I' and datasheet Section 14.1. It does not support the +105°C or +125°C grades - those require different suffixes (e.g., 'J' or 'K') and distinct part numbers.
Does S29GL512T10DHI023 require an external VPP voltage for programming?
No. The device uses a single 2.7 V–3.6 V VCC supply for all operations - read, program, and erase - eliminating the need for high-voltage charge pumps or external VPP circuitry. This simplifies power design and improves system reliability.
Can S29GL512T10DHI023 be used in ×8 data bus mode?
Yes. The device supports both ×8 and ×16 configurations. In ×8 mode, DQ15 functions as A–1 (LSB address bit), and DQ8–DQ15 are unused. Address and timing behavior remains consistent, with no performance penalty or functional limitation.
How is the OTP array protected against accidental overwrite?
The 2048-byte OTP array contains four lockable sectors (SSR0–SSR3). SSR0 is permanently locked at factory; SSR1 and SSR2 can be locked via command; SSR3 supports password-based read protection. Once locked, sectors cannot be unlocked or rewritten - ensuring permanent, tamper-resistant storage of keys or calibration data.
S29GL512T10DHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T10DHI023 FAQ
1.How can I place an order for S29GL512T10DHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10DHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10DHI023 reliable?
The price and inventory of S29GL512T10DHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10DHI023 is usually 5 days.
3.What payment methods are accepted for S29GL512T10DHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10DHI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10DHI023?
S29GL512T10DHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10DHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10DHI023?
For technical support, including S29GL512T10DHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10DHI023 requirements.
6.How does Aetrix verify that S29GL512T10DHI023 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10DHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10DHI023 meets industry standards.
7.What is the process for return or replacement of S29GL512T10DHI023?
All S29GL512T10DHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10DHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10DHI023 part is unused and in its original packaging.
Return procedure for S29GL512T10DHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T10DHI023 Tags
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