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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512T10FAI010

Name: S29GL512T10FAI010
Brand: Infineon Technologies
SKU: S29GL512T10FAI010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512T10FAI010

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512T10FAI010.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Inventory:1,348

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Product details

Overview

S29GL512T10FAI010 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit correction, 128-KB uniform sectors, and a 512-byte write buffer-enabling fast embedded code execution and firmware storage in industrial control and automotive infotainment systems.

For engineers reviewing the S29GL512T10FAI010 datasheet, S29GL512T10FAI010 pinout, S29GL512T10FAI010 application, or S29GL512T10FAI010 equivalent, key selection criteria include verified 128-KB sector erase granularity, industrial-grade temperature range (–40°C to +85°C), TSOP-56 package compatibility, and CFI-compliant software interface for bootloader and firmware update implementations.

Technical Context

This device implements an asynchronous parallel interface with ×8/×16 data bus support and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC operations without host CPU intervention.

The versatile I/O feature supports VIO from 1.65 V to VCC, enabling interoperability with mixed-voltage SoCs. Sector protection includes volatile/non-volatile ASP and four lockable 2048-byte OTP regions-SSR0 factory-locked, SSR3 password-protected-ensuring secure boot code storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	512 Mb (64 MB) - sufficient for full firmware images and dual-bank OTA updates in resource-constrained embedded systems
Random access time	100 ns at –40°C to +85°C - enables direct XIP execution of real-time control code without external cache
Page access time	15 ns - accelerates sequential instruction fetch during boot or interrupt handling
Write buffer size	512 bytes - reduces effective programming time by up to 10× vs. single-word writes in field firmware updates
ECC capability	Internal hardware single-bit error correction - maintains data integrity over 20-year retention without host-side ECC overhead
Endurance	100,000 program/erase cycles - supports frequent firmware patching in industrial gateways and telematics units
Operating temperature	–40°C to +85°C (Industrial grade) - qualified for under-hood and factory-floor deployment without derating

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard JEDEC MO-141AC footprint with gull-wing leads.

Pin/Terminal	Circuit Role	Design Meaning
A0–A21	Address inputs	22-bit address bus supporting full 512 Mb linear addressing with byte/word alignment
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; configurable as ×8 or ×16 via BYTE# pin state
CE#	Chip enable	Active-low chip select; controls device power state and timing window for read/write access
OE#	Output enable	Active-low control for data bus output drivers; enables concurrent reads across multiple devices
WE#	Write enable	Active-low signal initiating internal program/erase command execution on rising edge
RY/BY#	Ready/Busy	Open-drain status indicator; low during embedded operations, high when ready for next command
RESET#	Hardware reset	Active-low asynchronous reset that halts all operations and returns device to read mode
VCC	Core supply	3.0 V ±10% main power for logic and memory array; supports single-supply system design
VIO	I/O supply	1.65 V to VCC - decouples I/O voltage from core, enabling interfacing with 1.8 V or 3.3 V controllers

Key Features

Feature	Design Value
Hardware ECC engine	On-die single-bit error correction with no host CPU overhead or latency penalty during read operations
512-byte write buffer	Enables burst programming of up to 512 bytes per command, reducing firmware update time by >80% vs. byte-by-byte writes
Uniform 128-KB sectors	Eliminates complex sector mapping logic in bootloader; simplifies secure firmware partitioning and rollback schemes
CFI parameter table	Standardized JEDEC-compliant descriptor enabling auto-configuration of drivers and flash translation layers
OTP SSR array	2048-byte one-time-programmable space with four lockable regions-supports secure boot keys and calibration data binding

Applications

Industrial PLC Firmware Storage

Automotive Instrument Cluster Boot Memory

Use Scenario: Storing firmware and configuration data for programmable logic controllers operating in factory environments with wide temperature swings and EMI exposure.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable code execution and field-upgradable application logic.

Use Value: 100 ns random access ensures deterministic scan cycle timing; 100,000-cycle endurance supports lifetime firmware patches without replacement.

Use Scenario: Hosting boot code and GUI assets for digital instrument clusters requiring AEC-Q100 compliance and fail-safe startup behavior.

IC Role / Device Role / Timing Role: Primary boot flash with hardware ECC and sector protection to prevent corruption during vehicle power cycling.

Use Value: Industrial-grade –40°C to +85°C operation meets automotive cabin requirements; OTP SSR secures calibration parameters against tampering.

Medical Imaging System Configuration

Network Router Bootloader Storage

Use Scenario: Retaining calibration tables, safety-critical configuration profiles, and diagnostic logs in portable ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: Secure, long-retention non-volatile storage for regulatory-mandated operational records and firmware signatures.

Use Value: 20-year data retention and hardware ECC ensure audit-trail integrity; 128-KB sectors simplify versioned configuration backup/restore.

Use Scenario: Storing U-Boot or OpenWrt bootloader and kernel image in enterprise-grade routers requiring rapid boot and remote firmware upgrades.

IC Role / Device Role / Timing Role: Parallel NOR flash serving as primary boot device with CFI auto-detection and suspend/resume for zero-downtime updates.

Use Value: 512-byte write buffer cuts OTA update time by 70%; RY/BY# pin enables precise timing control during multi-device programming.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFI010	Same density and pinout, but uses older 65-nm process; 110 ns random access, no OTP SSR array	Lacks OTP-based secure boot support; unsuitable for applications requiring cryptographic key binding	Select only if cost sensitivity outweighs security and performance requirements
MX29GL512FHI-10G	Micron-compatible pinout and command set; 100 ns access, but no hardware ECC or versatile I/O (VIO fixed at 3.3 V)	Requires external ECC logic; incompatible with 1.8 V I/O microcontrollers without level shifters	Choose when migrating from legacy Micron designs with minimal hardware changes

Compared with S29GL512S10TFI010 and MX29GL512FHI-10G, the S29GL512T10FAI010 delivers superior reliability through integrated ECC and broader voltage flexibility, while its OTP SSR enables secure boot architectures unattainable with alternatives.

Availability

S29GL512T10FAI010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical imaging system configuration requiring stable component supply across extended product lifecycles.

Supply support for S29GL512T10FAI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.

The GL-T family targets high-reliability embedded systems requiring deterministic XIP performance, long-term data retention, and robust security features-designed specifically for automotive, industrial, and medical applications where firmware integrity is mission-critical.

FAQ

Is S29GL512T10FAI010 compatible with legacy S29GL512P devices?

No. The S29GL512T10FAI010 uses a revised command set and timing model optimized for 45-nm MIRRORBIT™ architecture. While pin-compatible with some P-series variants in TSOP-56, it requires updated driver firmware due to differences in status register layout and OTP programming sequences.

Does this device support synchronous read mode?

No. The S29GL512T10FAI010 operates exclusively in asynchronous mode with CE#, OE#, and WE# control signals. It does not implement clocked read interfaces like QSPI or DDR; all timing is governed by tACC, tCE, and tOE specifications per the datasheet.

Can the OTP SSR regions be reprogrammed after locking?

No. Once an SSR region (SSR1–SSR3) is locked via the appropriate command sequence, it becomes permanently read-only. SSR0 is factory-locked and cannot be modified. Unlocking is not supported-even with valid passwords-for any SSR region after lock activation.

What is the minimum VIO voltage required for reliable operation?

The minimum VIO voltage is 1.65 V, as specified in the Versatile I/O feature. Operation below this threshold risks data corruption during write/erase cycles and invalidates the 100,000-cycle endurance rating. VIO must remain within 1.65 V to VCC at all times during active operation.

S29GL512T10FAI010 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-T

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 64M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL512T10FAI010 FAQ

1.How can I place an order for S29GL512T10FAI010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512T10FAI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512T10FAI010 reliable?

The price and inventory of S29GL512T10FAI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10FAI010 is usually 5 days.

3.What payment methods are accepted for S29GL512T10FAI010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10FAI010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512T10FAI010?

S29GL512T10FAI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512T10FAI010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512T10FAI010?

For technical support, including S29GL512T10FAI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10FAI010 requirements.

6.How does Aetrix verify that S29GL512T10FAI010 is sourced from the original manufacturer or authorized distributors?

All S29GL512T10FAI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10FAI010 meets industry standards.

7.What is the process for return or replacement of S29GL512T10FAI010?

All S29GL512T10FAI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10FAI010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512T10FAI010 part is unused and in its original packaging.

Return procedure for S29GL512T10FAI010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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