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Infineon Technologies S29GL512T10FAI023
- Part No.:
- S29GL512T10FAI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T10FAI023.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,722
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Product details
Overview
S29GL512T10FAI023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating at 2.7–3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal single-bit ECC, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C) in 56-pin TSOP package. It serves as non-volatile code storage in boot ROM for embedded microcontrollers.
For engineers reviewing the S29GL512T10FAI023 datasheet, S29GL512T10FAI023 pinout, S29GL512T10FAI023 application, or S29GL512T10FAI023 equivalent, key selection criteria include asynchronous parallel interface timing, sector protection granularity, OTP array configuration, and industrial-grade thermal reliability for firmware storage in automotive ECUs and industrial PLCs.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus support and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations without external CPU intervention.
The internal hardware ECC corrects single-bit errors on-the-fly during read operations, while the Common Flash Interface (CFI) table enables host software to auto-detect device geometry and command set. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods per 128-KB sector.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full firmware images including bootloader, OS kernel, and application binaries in resource-constrained embedded systems |
| Access Time (tACC) | 100 ns - enables direct XIP execution from flash without requiring full code copying to RAM |
| Page Access Time (tPACC) | 15 ns - accelerates sequential instruction fetch in page-read mode |
| Write Buffer Size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC Support | Internal single-bit correction - eliminates need for external error-handling logic in safety-critical boot paths |
| Operating Temp | –40°C to +85°C (Industrial grade) - validated for continuous operation in factory automation and transportation control units |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years of service life |
| Data Retention | 20 years - ensures long-term integrity of stored calibration data and configuration parameters |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard JEDEC MO-141AC footprint with gull-wing leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 512 Mb address space (byte/word aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; configurable as ×8 or ×16 via BYTE# signal |
| CE# | Chip Enable | Active-low enable controlling device selection in multi-chip memory subsystems |
| OE# | Output Enable | Active-low control for data bus output gating during read operations |
| WE# | Write Enable | Active-low strobe initiating program/erase commands and data latching |
| RY/BY# | Ready/Busy Output | Open-drain status indicator signaling completion of embedded operations |
| RESET# | Hardware Reset | Asynchronous active-low reset clearing internal state and aborting ongoing operations |
| VCC | Core Supply | 2.7–3.6 V single supply powering core logic, memory array, and EAC |
| VIO | I/O Supply | 1.65–VCC versatile I/O voltage enabling interface compatibility with 1.8 V or 3.3 V controllers |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Supports 1.65 V to VCC I/O voltage - eliminates level-shifting components when interfacing with mixed-voltage SoCs |
| 512-byte Programming Buffer | Enables burst programming of up to 256 words - cuts typical firmware update time by >60% vs. single-word writes |
| Uniform 128-KB Sectors | 64 identical sectors simplify partitioning of boot code, application, and parameter storage with deterministic erase boundaries |
| OTP Array (2048 B) | Four lockable SSR regions including factory-locked SSR0 - provides secure storage for cryptographic keys and calibration constants |
| ASP Sector Protection | Volatile and non-volatile locking per sector - allows runtime reconfiguration of protected zones during field updates |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Stores boot firmware, real-time control algorithms, and sensor calibration tables in engine management systems. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 100 ns read latency for deterministic interrupt response. Use Value: AEC-Q100 Grade 3 qualification and 20-year data retention ensure compliance with ISO 26262 ASIL-B functional safety requirements. | Use Scenario: Holds ladder logic programs, I/O mapping tables, and firmware updates in factory-floor automation controllers. IC Role / Device Role / Timing Role: High-reliability firmware storage with suspend/resume capability to prevent corruption during power interruption. Use Value: Uniform 128-KB sector erase enables atomic firmware patching without disrupting live control execution. |
| Medical Diagnostic Imaging System | Avionics Flight Management Computer |
Use Scenario: Stores FPGA configuration bitstreams, image processing firmware, and regulatory-compliant boot loaders. IC Role / Device Role / Timing Role: Code-execution flash with internal ECC ensuring bit-error-free instruction fetch under electromagnetic interference. Use Value: Single-bit ECC correction eliminates need for redundant memory or software checksum validation in Class II medical devices. | Use Scenario: Hosts certified flight software, navigation databases, and system configuration parameters in DO-178C Level A avionics. IC Role / Device Role / Timing Role: Secure, high-integrity firmware storage with OTP-protected cryptographic keys for secure boot verification. Use Value: Factory-locked SSR0 and password-protected SSR3 meet RTCA DO-326A secure element requirements for airborne systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI010 | Same density and architecture but 48-ball FBGA (9 mm × 7 mm); no TSOP option; slightly higher tACC (110 ns @ +105°C) | Targeted at space-constrained PCBs where TSOP footprint is prohibitive; lacks industrial-grade TSOP availability | Select when board layout requires BGA miniaturization and thermal profile supports +105°C operation |
| MX29GL512FHI-10G | Micron equivalent with identical 512 Mb density, 100 ns tACC, and CFI compliance; different OTP layout and ASP implementation | Validated in legacy industrial designs; requires requalification of sector protection and ECC behavior | Choose for second-source continuity where existing design uses Micron's GL series and pinout compatibility is confirmed |
Compared with S29GL512S10TFI010 and MX29GL512FHI-10G, the S29GL512T10FAI023 uniquely offers TSOP packaging with guaranteed 100 ns access at +85°C and factory-locked SSR0 - critical for cost-sensitive, thermally stable industrial deployments requiring long-term component availability.
Availability
S29GL512T10FAI023 is available at Aetrix Electronics and suitable for automotive ECU firmware storage, industrial PLC program retention, and medical imaging system boot code applications requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T10FAI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and safety-critical applications.
The GL-T family targets high-reliability embedded systems needing XIP-capable flash with robust data integrity, sector-level protection, and extended temperature operation - designed specifically for automotive, industrial, and medical firmware storage.
FAQ
Is S29GL512T10FAI023 compatible with legacy S29GL512P devices?
No. The S29GL512T uses updated 45-nm MIRRORBIT™ process and revised command set versus the older 90-nm S29GL512P. Key differences include enhanced OTP structure, new suspend/resume opcodes, and modified CFI query responses. Migration requires firmware driver updates and full functional validation.
Does this device support synchronous read mode?
No. S29GL512T10FAI023 operates exclusively in asynchronous mode with CE#, OE#, and WE# control signals. It does not implement clocked read interfaces like QSPI or DDR NOR. Page-mode reads are still asynchronous but reduce address setup overhead for sequential accesses.
What is the function of the SSR0 region in the OTP array?
SSR0 is a 512-byte factory-locked section of the 2048-byte OTP array. Once programmed at wafer test, its contents cannot be altered or erased. It is typically used to store immutable device identifiers, cryptographic root keys, or calibration coefficients that must survive all future field updates and resets.
Can RY/BY# be used as a general-purpose I/O pin?
No. RY/BY# is a dedicated open-drain status output tied directly to the embedded algorithm controller. It asserts low during program/erase operations and goes high only after completion or error detection. Using it as a GPIO would violate timing and electrical specifications and risk data corruption.
S29GL512T10FAI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL512T10FAI023 FAQ
1.How can I place an order for S29GL512T10FAI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10FAI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10FAI023 reliable?
The price and inventory of S29GL512T10FAI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10FAI023 is usually 5 days.
3.What payment methods are accepted for S29GL512T10FAI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10FAI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10FAI023?
S29GL512T10FAI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10FAI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10FAI023?
For technical support, including S29GL512T10FAI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10FAI023 requirements.
6.How does Aetrix verify that S29GL512T10FAI023 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10FAI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10FAI023 meets industry standards.
7.What is the process for return or replacement of S29GL512T10FAI023?
All S29GL512T10FAI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10FAI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10FAI023 part is unused and in its original packaging.
Return procedure for S29GL512T10FAI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T10FAI023 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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Microchip Technology
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Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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