Infineon Technologies S29GL512T10FHI010
- Part No.:
- S29GL512T10FHI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T10FHI010.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,744
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Product details
Overview
S29GL512T10FHI010 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sectors, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL512T10FHI010 datasheet, S29GL512T10FHI010 pinout, S29GL512T10FHI010 application, or S29GL512T10FHI010 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, CFI-compliant interface, OTP array with four lockable SSR regions, and support for suspend/resume during erase/program operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 configurable data bus and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages all program and erase operations autonomously, including automatic ECC generation and correction on read.
The architecture includes dedicated address space overlays (ASOs) for Device ID/CFI, Status Register, Data Polling, SSR (OTP), sector protection control, and ECC status - enabling standardized software abstraction and robust firmware update handling in embedded boot loaders.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full boot firmware + configuration storage in industrial gateways |
| Random access time | 100 ns at –40°C to +85°C - enables direct XIP execution without cache penalty |
| Page access time | 15 ns - accelerates sequential instruction fetch within cached pages |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Internal hardware single-bit error correction - ensures data integrity without CPU overhead |
| Sector size | Uniform 128 KB - simplifies firmware partitioning and OTA update management |
| Data retention | 20 years - meets long-lifecycle requirements for infrastructure and automotive ECUs |
| Endurance | 100,000 program/erase cycles - supports frequent field firmware updates in edge devices |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AB footprint. Compatible with automated PCB assembly and reflow profiles for industrial-grade boards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb linear addressing (byte/word mode) |
| DQ0–DQ15 | Data I/O | Configurable ×8 (DQ0–DQ7) or ×16 (DQ0–DQ15) bidirectional data bus |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low control for data bus drivers during read operations |
| WE# | Write enable | Active-low signal initiating program/erase commands and data writes |
| RY/BY# | Ready/Busy output | Open-drain status indicator; low = operation in progress, high = ready |
| VCC | Core supply | 2.7 V–3.6 V single supply for read/program/erase - eliminates auxiliary voltage rails |
| VIO | I/O supply | 1.65 V–VCC versatile I/O voltage - interfaces directly with 1.8 V/2.5 V/3.3 V logic |
| RESET# | Hardware reset | Active-low asynchronous reset that halts ongoing operations and clears status registers |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Independent 1.65 V–VCC I/O supply allows seamless interfacing with mixed-voltage SoCs without level shifters |
| 512-byte write buffer | Enables burst programming of up to 256 words in one command, cutting typical firmware write time by >60% vs. single-word mode |
| Hardware ECC | On-the-fly single-bit error correction with no software intervention - critical for unattended remote deployments |
| Four-lock OTP array | SSR0–SSR3 provide secure, field-programmable storage for keys, calibration data, and device identity with factory-lock and password-read protection |
| CFI compliance | Standardized parameter table enables auto-detection and driver portability across bootloader frameworks (e.g., U-Boot, Coreboot) |
Applications
| Industrial PLC Boot Memory | Automotive ADAS ECU Firmware Storage |
|---|---|
Use Scenario: Storing boot loader, real-time OS kernel, and safety-critical application code in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns latency. Use Value: Uniform 128-KB sectors and suspend/resume allow safe firmware updates mid-operation without system halt. | Use Scenario: Holding calibrated sensor fusion algorithms and ASIL-B compliant firmware in radar processing units operating at –40°C to +105°C. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified flash storing immutable boot code and runtime configuration with ECC-protected reads. Use Value: 20-year data retention and 100,000-cycle endurance ensure functional safety compliance over vehicle lifetime. |
| Medical Imaging System Configuration | Telecom Base Station Control Plane |
Use Scenario: Storing FPGA bitstreams, calibration tables, and regulatory-certified diagnostic routines in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Secure configuration store with OTP-locked SSR3 region protecting proprietary image processing parameters. Use Value: Password-read protection on SSR3 prevents unauthorized extraction of clinical calibration data. | Use Scenario: Hosting boot firmware and field-upgradable control plane software in 5G macro base station radios requiring zero-downtime updates. IC Role / Device Role / Timing Role: Dual-bank capable flash supporting A/B firmware partitioning with atomic sector erase and status register monitoring. Use Value: CFI interface and data polling enable robust update verification in carrier-grade Linux-based BSPs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI010 | Same density and timing, but uses 64-ball LAE BGA (9 mm × 9 mm); lacks OTP array and SSR lock features | Preferred where board space is constrained and secure OTP storage is not required | Select when footprint reduction outweighs need for field-programmable security regions |
| MX29GL512FHTI-90G | Macronix part with identical 512 Mb density, 90 ns random access, but no hardware ECC or CFI support | Requires external ECC logic and custom driver development for boot integrity | Choose only if cost sensitivity overrides built-in reliability features and software compatibility |
Compared with S29GL512S10TFI010 and MX29GL512FHTI-90G, the S29GL512T10FHI010 uniquely delivers integrated ECC, CFI compliance, and four-lock OTP - making it optimal for safety-aware, field-upgradable, and driver-portable designs.
Availability
S29GL512T10FHI010 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging systems, and telecom base station control planes requiring stable component supply across extended lifecycles.
Supply support for S29GL512T10FHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and mission-critical applications.
The GL-T family targets embedded systems needing fast XIP execution, robust firmware storage, and long-term data integrity - especially where AEC-Q100 qualification, ECC, and secure OTP are mandatory.
FAQ
Does S29GL512T10FHI010 support both ×8 and ×16 data bus configurations?
Yes. The device automatically detects bus width via the BYTE# pin: tied high for ×16 mode (DQ0–DQ15 active), low for ×8 mode (DQ0–DQ7 active). This enables flexible integration with 8-bit microcontrollers or 16-bit SoCs without hardware redesign.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four independent 2048-byte one-time-programmable regions. SSR0 is factory-locked and reserved for manufacturer use; SSR3 supports password-read protection. SSR1 and SSR2 are user-programmable for keys, calibration data, or device identity with permanent write-once semantics.
How does the Ready/Busy# (RY/BY#) pin behave during suspend/resume operations?
During suspend, RY/BY# transitions high immediately, signaling readiness for host interaction while preserving internal state. Upon resume, it goes low again and remains low until the suspended operation completes - enabling precise timing control for multi-tasking firmware without polling overhead.
Is the 512-byte write buffer usable across sector boundaries?
No. The write buffer operates strictly within a single 128-KB sector. Attempting to program across sector boundaries triggers a command error and requires separate buffer loads per sector - ensuring erase-before-write compliance and preventing unintended sector corruption.
S29GL512T10FHI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL512T10FHI010 FAQ
1.How can I place an order for S29GL512T10FHI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10FHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10FHI010 reliable?
The price and inventory of S29GL512T10FHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10FHI010 is usually 5 days.
3.What payment methods are accepted for S29GL512T10FHI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10FHI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10FHI010?
S29GL512T10FHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10FHI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10FHI010?
For technical support, including S29GL512T10FHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10FHI010 requirements.
6.How does Aetrix verify that S29GL512T10FHI010 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10FHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10FHI010 meets industry standards.
7.What is the process for return or replacement of S29GL512T10FHI010?
All S29GL512T10FHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10FHI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10FHI010 part is unused and in its original packaging.
Return procedure for S29GL512T10FHI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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