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Infineon Technologies S29GL512T10FHI013
- Part No.:
- S29GL512T10FHI013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T10FHI013.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,200
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Product details
Overview
S29GL512T10FHI013 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating at 2.7–3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal single-bit ECC, uniform 128-KB sectors, and supports industrial temperature range (–40°C to +85°C) in 56-pin TSOP package. Used in boot code storage for industrial HMIs and firmware update storage in network edge routers.
For engineers reviewing the S29GL512T10FHI013 datasheet, S29GL512T10FHI013 pinout, S29GL512T10FHI013 application, or S29GL512T10FHI013 equivalent, key selection criteria include verified 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI-compliant interface, and support for suspend/resume during erase operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration, supporting byte- and word-aligned addressing only. Its embedded algorithm controller (EAC) handles all program and erase operations autonomously, including automatic ECC generation and correction on read.
The status monitoring architecture provides three concurrent methods: Status Register polling, Data Polling (DQ7), and RY/BY# pin assertion. Sector protection uses both volatile (via command) and non-volatile (via ASP bits) mechanisms, with separate 2048-byte OTP array featuring factory-locked SSR0 and password-protected SSR3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - fixed capacity for boot image and firmware storage in resource-constrained embedded systems |
| Supply voltage (VCC) | 2.7 V to 3.6 V - single-supply operation eliminates need for auxiliary voltage rails in 3.3 V system designs |
| Random access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without external cache in real-time control applications |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot initialization and firmware patch loading |
| Write buffer size | 512 bytes - reduces effective programming time by up to 10× vs. single-word writes, critical for field firmware updates |
| Erase endurance | 100,000 cycles per sector - supports frequent over-the-air (OTA) firmware revision in industrial gateways |
| Data retention | 20 years at +85°C - ensures long-term reliability of stored calibration data and security keys in unattended equipment |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), standard JEDEC MO-141AC footprint, 18.4 mm × 10.16 mm × 1.2 mm height, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs | 21-bit address bus supporting full 512 Mb address space; A0 selects byte/word mode when x16 configured |
| DQ0–DQ15 | Data I/O bus | 16-bit bidirectional data path; operates in x8 or x16 mode per configuration; supports versatile I/O (1.65 V to VCC) |
| CE# | Chip enable | Active-low chip select; controls device power state and enables simultaneous multi-chip addressing in memory expansion |
| OE# | Output enable | Active-low read strobe; decouples output drivers to prevent bus contention during shared-data-bus operation |
| WE# | Write enable | Active-low write strobe; initiates command sequences and data latching for program/erase operations |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation; used for hardware flow control without CPU polling overhead |
| VCC | Core supply | 2.7–3.6 V main power; powers logic, memory array, and ECC engine; no separate VIO rail required in standard mode |
| VSS | Ground | Digital ground reference for all I/O and core circuits; requires low-inductance connection to minimize switching noise |
Key Features
| Feature | Design Value |
|---|---|
| 45-nm MIRRORBIT™ process | Enables higher density and lower leakage vs. older 65-nm NOR, reducing standby current to 100 µA at +85°C |
| Internal hardware ECC | Single-bit error correction without software intervention, preserving deterministic read latency in safety-critical boot paths |
| 512-byte programming buffer | Allows burst programming of up to 512 bytes per command, achieving 1.14 MBps effective write rate across temperature grades |
| Uniform 128-KB sectors | Eliminates complex sector-mapping logic in bootloader; supports atomic firmware partition updates without partial-sector erasure risk |
| Four-lockable OTP regions (SSR0–SSR3) | Provides hierarchical security: SSR0 factory-locked for immutable root keys; SSR3 password-protected for customer-specific credentials |
Applications
| Industrial HMI Boot Storage | Network Edge Router Firmware |
|---|---|
|
Use Scenario: Stores boot loader and kernel image for ARM-based human-machine interface controllers deployed in factory automation panels. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency to meet deterministic startup timing. Use Value: Eliminates need for external SRAM cache; 20-year data retention ensures firmware integrity over equipment lifetime without recalibration. |
Use Scenario: Holds field-upgradable firmware images and configuration tables in carrier-grade Ethernet edge routers operating continuously at +70°C ambient. IC Role / Device Role / Timing Role: Dual-role storage: boot code (XIP) and runtime firmware patch repository accessed via parallel bus under Linux MTD subsystem. Use Value: 100,000 erase cycles support weekly OTA updates over 5+ years; suspend/resume allows safe interruption during power-loss events. |
| Automotive ADAS Camera Module | Medical Diagnostic Imaging Controller |
|
Use Scenario: Stores camera sensor calibration data and firmware for ISO 26262 ASIL-B compliant automotive surround-view systems. IC Role / Device Role / Timing Role: Secure non-volatile storage with OTP-locked calibration parameters; operates in AEC-Q100 Grade 2 (–40°C to +105°C) environment. Use Value: Factory-locked SSR0 prevents tampering with safety-critical coefficients; ECC ensures bit-error-free reads during high-EMI driving conditions. |
Use Scenario: Retains DICOM protocol stack and device-specific calibration profiles in portable ultrasound imaging units requiring FDA Class II compliance. IC Role / Device Role / Timing Role: High-reliability firmware archive with guaranteed 20-year retention; accessed during cold start before DRAM initialization. Use Value: Uniform 128-KB sectors simplify FDA audit traceability; CFI table enables automated BOM verification during production test. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI010 | Same density and pinout, but 64-ball LAE BGA (9 mm × 9 mm); lacks OTP array and SSR lock capability | Preferred for space-constrained PCBs where board area > security granularity; unsuitable for secure key storage | Select when footprint reduction outweighs need for hardware-based credential protection |
| MX29GL512FHTI-90G | Macronix part with identical 512 Mb density, 100 ns tACC, and TSOP-56 package; no internal ECC or OTP array | Lower-cost option for non-safety-critical firmware storage where external ECC or software key management is acceptable | Choose when bill-of-materials cost sensitivity exceeds requirements for autonomous error correction and secure OTP |
Compared with S29GL512S10TFI010 and MX29GL512FHTI-90G, the S29GL512T10FHI013 uniquely combines TSOP-56 compatibility, integrated ECC, and four-region OTP security-making it the only option among the three qualified for ASIL-B boot storage and FDA-auditable firmware archives.
Availability
S29GL512T10FHI013 is available at Aetrix Electronics and suitable for industrial HMI boot storage, network edge router firmware, and automotive ADAS camera module applications requiring stable component supply, long-lifecycle availability, and AEC-Q100-compliant sourcing.
Supply support for S29GL512T10FHI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-T family targets high-reliability embedded systems requiring deterministic boot performance, secure firmware storage, and extended temperature operation-designed specifically for industrial control, automotive ADAS, and medical diagnostics platforms.
FAQ
Does S29GL512T10FHI013 support x8 and x16 data bus configurations?
Yes, it supports both modes via A0 pin state at power-on: A0 low enables x8 mode (DQ0–DQ7 active); A0 high enables x16 mode (DQ0–DQ15 active). The device does not auto-detect bus width and requires consistent configuration throughout operation. Configuration is latched during reset and cannot be changed dynamically.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four independently lockable 512-byte subregions within the 2048-byte OTP array. SSR0 is permanently locked at factory and stores immutable root keys; SSR1–SSR2 are user-lockable for calibration data; SSR3 supports password-based read protection for sensitive credentials. Locking is irreversible and performed via dedicated unlock/lock command sequences.
How does the Ready/Busy# (RY/BY#) pin behave during suspend/resume operations?
During active program or erase, RY/BY# is driven low. When a suspend command is issued, the pin transitions high within 100 ns, indicating the operation is paused and the device accepts read commands. After resume, it returns low. The pin remains high during suspended state, enabling hardware flow control without CPU polling.
Is the 512-byte write buffer usable across sector boundaries?
No, the 512-byte buffer must be programmed within a single 128-KB sector. Attempting to cross sector boundaries triggers a write protection violation and aborts the buffer program. Buffer programming is valid only for addresses within one sector, ensuring atomicity and preventing partial-sector corruption during power loss.
S29GL512T10FHI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL512T10FHI013 FAQ
1.How can I place an order for S29GL512T10FHI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10FHI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10FHI013 reliable?
The price and inventory of S29GL512T10FHI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10FHI013 is usually 5 days.
3.What payment methods are accepted for S29GL512T10FHI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10FHI013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10FHI013?
S29GL512T10FHI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10FHI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10FHI013?
For technical support, including S29GL512T10FHI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10FHI013 requirements.
6.How does Aetrix verify that S29GL512T10FHI013 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10FHI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10FHI013 meets industry standards.
7.What is the process for return or replacement of S29GL512T10FHI013?
All S29GL512T10FHI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10FHI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10FHI013 part is unused and in its original packaging.
Return procedure for S29GL512T10FHI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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