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Infineon Technologies S29GL512T10FHI020
- Part No.:
- S29GL512T10FHI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T10FHI020.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:955
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Product details
Overview
S29GL512T10FHI020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sectors, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL512T10FHI020 datasheet, S29GL512T10FHI020 pinout, S29GL512T10FHI020 application, or S29GL512T10FHI020 equivalent, key selection criteria include verified 128-KB uniform sector erase granularity, 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI-compliant interface, and TSOP-56/LAA/LAE/VBU package compatibility.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 configurable data bus, supporting byte/word boundary addressing only. Its embedded algorithm controller (EAC) manages all program/erase operations, including suspend/resume, status monitoring via Status Register, Data Polling, and RY/BY# pin, and automatic ECC generation/correction during read.
The versatile I/O feature enables independent VIO supply (1.65 V to VCC), decoupling I/O voltage from core logic. Sector protection uses both volatile (via Status Register) and non-volatile (via SSR) methods, with factory-locked SSR0 and password-protected SSR3 for secure OTP configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full boot image + firmware partition in resource-constrained embedded systems |
| Access Time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without external cache in real-time control applications |
| Page Access Time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot or interrupt handling |
| Write Buffer Size | 512 bytes - reduces effective programming time by batching up to 256 words per operation |
| ECC Capability | Single-bit error correction via on-die hardware - eliminates need for external ECC logic in safety-critical storage |
| Sector Size | Uniform 128 KB - simplifies firmware update partitioning and wear-leveling implementation |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years in industrial deployments |
| Data Retention | 20 years at +85°C - ensures long-term reliability in unattended infrastructure equipment |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), JEDEC standard MO-142AC, 18.4 mm × 10.16 mm × 1.2 mm body height, lead pitch 0.5 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 512 Mb addressing (byte/word aligned); A0 selects byte within word |
| DQ0–DQ15 | Data I/O (×16 mode) | Bidirectional data bus; operates as DQ0–DQ7 in ×8 mode when BYTE# = LOW |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE = 100 ns max defines minimum chip select assertion window |
| OE# | Output Enable | Active-low control for data output gating; tOE = 25 ns max determines read data valid timing |
| WE# | Write Enable | Active-low signal initiating internal program/erase commands; latches command sequences on rising edge |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: HIGH = ready, LOW = active operation; used for polling instead of Data Polling |
| VCC | Core Supply | 2.7 V to 3.6 V single supply powering logic and memory array; no separate VPP required |
| VIO | I/O Supply | 1.65 V to VCC - allows interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC Engine | On-die single-bit error correction with automatic detection - removes software overhead and guarantees data integrity during read without host intervention |
| 512-Byte Programming Buffer | Enables burst programming of up to 256 words in one command - cuts typical firmware update time by >4× vs. single-word writes |
| Uniform 128-KB Sectors | Eliminates complex sector mapping logic - simplifies bootloader design and OTA update partitioning across all 512 sectors |
| Four Lockable OTP Regions (SSR0–SSR3) | SSR0 factory-locked for immutable security keys; SSR3 password-protected for user-defined configuration - enables layered secure provisioning |
| CFI-Compatible Interface | Standardized parameter table accessible via address/command sequence - ensures interoperability with generic flash drivers and BIOS/UEFI implementations |
| Versatile I/O Voltage (VIO) | Independent 1.65 V–VCC I/O rail - permits direct connection to mixed-voltage SoCs without external translators or voltage droppers |
Applications
| Industrial PLC Boot Memory | Automotive Instrument Cluster Firmware |
|---|---|
|
Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic <100 ns latency. Use Value: Uniform 128-KB sectors allow atomic firmware rollback; 20-year data retention ensures zero field failures due to bit rot over equipment lifetime. |
Use Scenario: Holding calibrated display firmware and safety-critical gauge logic in automotive digital instrument clusters meeting AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Secure code storage with SSR-based OTP locking of calibration constants and cryptographic keys. Use Value: Hardware ECC prevents silent corruption of speedometer/tachometer lookup tables; 100,000-cycle endurance supports dealer reprogramming throughout vehicle life. |
| Medical Imaging System Configuration | Telecom Base Station Boot Image |
|
Use Scenario: Retaining FPGA configuration bitstreams and regulatory-compliant calibration profiles in portable ultrasound devices. IC Role / Device Role / Timing Role: Non-volatile configuration store accessed during power-up initialization with guaranteed read stability across –40°C to +85°C. Use Value: Versatile I/O (VIO = 1.8 V) interfaces directly with low-power imaging SoC; CFI compliance enables auto-detection in FDA-certified firmware stacks. |
Use Scenario: Hosting boot images and FPGA configuration for 5G remote radio units operating in outdoor cabinets with wide thermal swings. IC Role / Device Role / Timing Role: High-reliability parallel flash serving as primary boot source for ARM-based baseband processors. Use Value: 125°C extended temperature option (not this variant) validated for harsh environments; this -40°C to +85°C grade meets NEBS Level 3 thermal requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI020 | Same density and pinout, but uses older 65-nm process; 110 ns tACC vs. 100 ns; no OTP array | Lacks SSR-based secure provisioning; unsuitable for designs requiring locked calibration or crypto keys | Select only if cost sensitivity outweighs need for hardware ECC and OTP security features |
| MX29GL512FPTI-90G | Macronix part with 90 ns tACC, 512-byte buffer, and CFI support; no built-in ECC; requires external error management | Higher raw performance but increases firmware complexity for error handling and reduces functional safety compliance margin | Prefer when maximum read speed is critical and ECC can be implemented in host software or external logic |
Compared with S29GL512S10TFI020 and MX29GL512FPTI-90G, the S29GL512T10FHI020 uniquely integrates hardware ECC and four-lockable OTP regions-enabling secure, standards-compliant boot storage without host-side error correction or external security ICs.
Availability
S29GL512T10FHI020 is available at Aetrix Electronics and suitable for industrial PLCs, automotive instrument clusters, and medical imaging systems requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.
Supply support for S29GL512T10FHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.
The GL-T family targets embedded systems needing fast XIP execution and robust firmware storage, combining high-density parallel NOR architecture with advanced data integrity and security features for industrial and automotive applications.
FAQ
Does S29GL512T10FHI020 support both ×8 and ×16 data bus configurations?
Yes, it supports both modes via the BYTE# pin: when BYTE# is HIGH, DQ0–DQ15 operate as a 16-bit data bus; when LOW, only DQ0–DQ7 are active in 8-bit mode. Addressing remains byte-aligned in both configurations, and all commands function identically regardless of bus width.
What is the purpose of the SSR (One-Time Programmable) array?
The 2048-byte SSR array contains four lockable regions (SSR0–SSR3) for storing immutable or protected data. SSR0 is factory-locked for permanent security keys; SSR3 supports password-based read protection. Once locked, regions cannot be modified, enabling secure calibration storage and cryptographic key binding.
How does the hardware ECC engine operate during normal read cycles?
The ECC engine runs transparently on every read: syndrome calculation and single-bit correction occur automatically in hardware before data reaches DQ pins. No host intervention or additional timing overhead is required, and corrected data appears identical to uncorrupted data-ensuring seamless integration with legacy flash drivers.
Is the S29GL512T10FHI020 compatible with legacy S29GL512P devices?
No, it is not pin-compatible or command-set compatible with the older P-series. The T-series introduces new command sequences for OTP programming, enhanced sector protection, and updated CFI parameter tables. Migration requires firmware driver updates and PCB layout verification for TSOP-56 footprint alignment.
S29GL512T10FHI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL512T10FHI020 FAQ
1.How can I place an order for S29GL512T10FHI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10FHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10FHI020 reliable?
The price and inventory of S29GL512T10FHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10FHI020 is usually 5 days.
3.What payment methods are accepted for S29GL512T10FHI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10FHI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10FHI020?
S29GL512T10FHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10FHI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10FHI020?
For technical support, including S29GL512T10FHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10FHI020 requirements.
6.How does Aetrix verify that S29GL512T10FHI020 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10FHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10FHI020 meets industry standards.
7.What is the process for return or replacement of S29GL512T10FHI020?
All S29GL512T10FHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10FHI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10FHI020 part is unused and in its original packaging.
Return procedure for S29GL512T10FHI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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