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Infineon Technologies S29GL512T10FHI030
- Part No.:
- S29GL512T10FHI030
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T10FHI030.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:360
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Product details
Overview
S29GL512T10FHI030 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL512T10FHI030 datasheet, S29GL512T10FHI030 pinout, S29GL512T10FHI030 application, or S29GL512T10FHI030 equivalent, key selection criteria include verified 512-byte buffer programming throughput (1.14 MBps), sector-level protection granularity, CFI-compliant software interface, and TSOP-56/LAA/LAE/VBU package compatibility for legacy and space-constrained designs.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 configurable data bus, supporting byte/word boundary addressing only. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations autonomously without host intervention.
The internal hardware ECC engine operates transparently during read cycles, correcting single-bit errors in real time and reporting uncorrectable multi-bit errors via status register bits. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods, with four OTP lockable regions-SSR0 factory-locked, SSR3 password-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full firmware images and configuration tables in industrial HMI and gateway applications |
| Random access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without external cache penalty |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot or firmware update |
| Write buffer size | 512 bytes - reduces average programming time by batching up to 256 words per command |
| ECC capability | Single-bit error correction with detection of multi-bit errors - ensures data integrity over 20-year retention |
| Endurance | 100,000 program/erase cycles per sector - supports field firmware updates in long-lifecycle equipment |
| Operating voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - allows interoperability with 1.8 V, 2.5 V, or 3.3 V I/O domains |
| Temperature grade | Industrial (–40°C to +85°C) - qualified for deployment in factory automation and outdoor telecom infrastructure |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard JEDEC MO-141AC footprint with 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit address bus supporting full 512 Mb address space (byte/word aligned) |
| DQ0–DQ15 | Data I/O | Configurable ×8 (DQ0–DQ7) or ×16 (DQ0–DQ15) bidirectional data bus |
| CE# | Chip enable | Active-low chip select; controls device power state and enables read/write access |
| OE# | Output enable | Active-low control for data bus output drivers during read operations |
| WE# | Write enable | Active-low strobe for latching address/data during program/erase commands |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low = busy) |
| RESET# | Hardware reset | Asynchronous active-low input forcing device into known reset state and clearing status registers |
| VCC | Core supply | 2.7–3.6 V main power for logic and memory array; decoupling required per datasheet layout guidelines |
| VIO | I/O supply | 1.65–VCC independent I/O rail enabling mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage | VIO supports 1.65 V to VCC - eliminates level shifters when interfacing with 1.8 V microcontrollers or FPGAs |
| 512-byte write buffer | Enables 1.14 MBps effective programming rate - cuts firmware update time by >70% vs. single-word programming |
| Hardware ECC | On-the-fly single-bit correction with status flag - removes need for software-based error handling in safety-critical boot loaders |
| Uniform 128-KB sectors | 64 identical sectors simplify partitioning for bootloader, OS, and application image storage |
| OTP array with SSRs | 2048-byte one-time-programmable region with four lockable sections - secures cryptographic keys and calibration data |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and runtime configuration for programmable logic controllers deployed in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with <100 ns latency and sector-level update isolation. Use Value: Eliminates external SRAM dependency for boot code execution while maintaining 100,000-cycle endurance for field firmware patches. | Use Scenario: Holding certified boot loader and sensor fusion firmware in automotive camera modules compliant with AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Safety-critical boot memory with hardware ECC and OTP-secured calibration data storage. Use Value: Meets ISO 26262 ASIL-B requirements via built-in error correction and immutable key storage in SSR3. |
| Telecom Base Station Configuration | Medical Imaging System Image Cache |
Use Scenario: Retaining configuration profiles, encryption keys, and FPGA bitstreams in outdoor 5G remote radio units. IC Role / Device Role / Timing Role: Secure, high-reliability configuration store with ASP-enabled sector locking and CFI-based auto-detection. Use Value: Prevents unauthorized reprogramming via non-volatile sector locks and supports hot-swap firmware updates without full device reset. | Use Scenario: Caching DICOM image metadata and calibration lookup tables in portable ultrasound devices with strict thermal constraints. IC Role / Device Role / Timing Role: Low-power, high-retention data store operating at 3.3 V with standby current ≤100 μA at +85°C. Use Value: Extends battery life while guaranteeing 20-year data retention for regulatory-compliant medical records storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI020 | Same density and core voltage, but 64-ball LAA BGA (13 mm × 11 mm); no TSOP option; 110 ns tACC at +105°C | Targeted for space-constrained, thermally robust designs where board area is prioritized over socket replacement | Select when migrating from TSOP to BGA for improved thermal performance and higher vibration resistance |
| MX29GL512FHT2I-90G | Micron part with 90 ns tACC, same 512 Mb density and TSOP-56 package; lacks hardware ECC and OTP array | Suitable for cost-sensitive applications where software-managed error correction suffices and key storage is handled externally | Choose only if ECC and OTP security features are not required and faster access time justifies vendor change |
Compared with S29GL512S10TFI020, this TSOP-56 variant offers easier prototyping and legacy PCB compatibility; versus MX29GL512FHT2I-90G, it delivers integrated reliability features essential for safety-certified systems despite slightly slower access timing.
Availability
S29GL512T10FHI030 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and telecom base station configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T10FHI030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with leadership in flash memory for mission-critical embedded systems.
The GL-T family targets high-reliability embedded applications demanding XIP performance, long-term data retention, and hardware-assisted security - especially in industrial automation, automotive, and infrastructure equipment.
FAQ
Does S29GL512T10FHI030 support both ×8 and ×16 data bus configurations?
Yes. The device supports configurable ×8 (using DQ0–DQ7) or ×16 (using DQ0–DQ15) operation via hardware pin strapping and command set selection. Bus width is determined at power-up by the state of BYTE# pin and confirmed through CFI query, enabling flexible integration with 8-bit or 16-bit microcontroller buses without redesign.
What is the function of the SSR (One-Time Programmable) array?
The 2048-byte SSR array provides four lockable regions (SSR0–SSR3) for permanent storage of security-critical data. SSR0 is factory-locked and contains device-specific identifiers; SSR3 supports password-protected read access. Once programmed and locked, contents cannot be erased or rewritten - ideal for storing cryptographic keys, calibration coefficients, or licensing tokens.
How does automatic ECC operate during read cycles?
Hardware ECC runs transparently on every read access: single-bit errors are corrected in real time before data reaches the bus, and multi-bit errors trigger the ERR bit in the status register. No software overhead is required, and correction occurs within the normal read access timing window - preserving deterministic XIP performance while ensuring data integrity over 20 years.
Can S29GL512T10FHI030 be used in automotive applications?
Yes - this specific variant (suffix 'I030') is rated for Industrial temperature (–40°C to +85°C), which meets AEC-Q100 Grade 3 requirements. For Grade 2 (–40°C to +105°C), Infineon offers automotive-qualified variants like S29GL512T10FHIV20 with identical functionality and enhanced thermal qualification, including additional reliability testing per automotive standards.
S29GL512T10FHI030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL512T10FHI030 FAQ
1.How can I place an order for S29GL512T10FHI030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10FHI030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10FHI030 reliable?
The price and inventory of S29GL512T10FHI030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10FHI030 is usually 5 days.
3.What payment methods are accepted for S29GL512T10FHI030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10FHI030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10FHI030?
S29GL512T10FHI030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10FHI030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10FHI030?
For technical support, including S29GL512T10FHI030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10FHI030 requirements.
6.How does Aetrix verify that S29GL512T10FHI030 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10FHI030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10FHI030 meets industry standards.
7.What is the process for return or replacement of S29GL512T10FHI030?
All S29GL512T10FHI030 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10FHI030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10FHI030 part is unused and in its original packaging.
Return procedure for S29GL512T10FHI030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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