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Infineon Technologies S29GL512T10FHI033
- Part No.:
- S29GL512T10FHI033
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T10FHI033.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,708
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Product details
Overview
S29GL512T10FHI033 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sectors, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring fast XIP execution and reliable firmware retention.
For engineers reviewing the S29GL512T10FHI033 datasheet, S29GL512T10FHI033 pinout, S29GL512T10FHI033 application, or S29GL512T10FHI033 equivalent, key selection criteria include parallel ×16 bus interface, 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during erase/program operations.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages sector erase, buffer programming, and automatic ECC generation without host intervention.
The status monitoring architecture includes three independent methods: Status Register polling, Data Polling (DQ7), and Ready/Busy# pin assertion. Sector protection uses volatile (via command) and non-volatile (via SSR registers) mechanisms, with SSR0 factory-locked and SSR3 password-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full boot image + firmware + configuration storage in edge gateway applications |
| Access Time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without external cache penalty |
| Page Access Time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot initialization |
| Write Buffer Size | 512 bytes - reduces average programming time by batching up to 256 words per command |
| ECC Capability | Single-bit error correction via on-die hardware - eliminates need for external ECC logic in safety-critical boot path |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - meets long-life requirements for industrial control firmware |
| Operating Voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - allows interoperability with 1.8 V/3.3 V I/O domains without level shifters |
Pinout & Package
Package: 56-pin TSOP (Type I, standard thickness), JEDEC MO-141AC compliant, body size 18.4 mm × 10.16 mm × 1.2 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 512 Mb linear addressing (byte/word aligned) |
| DQ0–DQ15 | Data I/O (×16 mode) | Bidirectional 16-bit data bus; operates as DQ0–DQ7 in ×8 mode when BYTE# = LOW |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE = 100 ns max defines minimum chip select assertion window |
| OE# | Output Enable | Active-low read strobe; tOE = 25 ns max determines output hold timing relative to OE# deassertion |
| WE# | Write Enable | Active-low control for write operations; initiates command sequences and buffer programming |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: LOW = operation in progress, HIGH = ready - enables hardware polling without register reads |
| RESET# | Hardware Reset | Active-low asynchronous reset that halts ongoing operations and returns device to read mode within 100 μs |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | VIO range 1.65 V to VCC enables direct interfacing with mixed-voltage SoCs (e.g., 1.8 V core + 3.3 V I/O) without external translators |
| Asynchronous Page Read | 32-byte page read mode improves burst instruction fetch throughput over standard random access by 2.3× in typical boot loader scenarios |
| Suspend/Resume Support | Allows interrupting erase or program operations to service high-priority reads - critical for real-time OS boot loaders |
| OTP Array with SSR Locking | 2048-byte one-time-programmable area partitioned into four lockable sectors (SSR0–SSR3); SSR0 factory-locked for secure boot keys |
| CFI Compliance | Standard Common Flash Interface table allows automatic detection and configuration by U-Boot, Linux MTD, and other generic flash drivers |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
|
Use Scenario: Storing firmware and configuration data in programmable logic controllers deployed in factory automation environments with ambient temperatures up to +85°C. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction storage with deterministic 100 ns access latency. Use Value: Eliminates need for external SRAM copy-on-boot; supports field firmware updates via sector erase with suspend capability during runtime diagnostics. |
Use Scenario: Holding boot code and safety-critical calibration data in automotive camera ECU modules certified to AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Primary boot flash with hardware ECC and OTP-secured calibration parameters for ISO 26262 ASIL-B compliance. Use Value: SSR3 password protection prevents unauthorized calibration tampering; 100,000-cycle endurance ensures lifetime reliability across vehicle service intervals. |
| Network Router Boot Image | Medical Imaging System BIOS |
|
Use Scenario: Hosting bootloader and kernel image in carrier-grade Ethernet switches requiring zero-downtime firmware upgrades. IC Role / Device Role / Timing Role: Parallel NOR flash serving as primary boot device with CFI auto-detection for multi-vendor platform compatibility. Use Value: 512-byte write buffer enables sub-500 ms firmware patching; sector protection prevents accidental overwrite of active boot bank during dual-bank update. |
Use Scenario: Storing diagnostic BIOS and regulatory-compliant startup routines in FDA-cleared MRI subsystem controllers. IC Role / Device Role / Timing Role: Certified non-volatile memory for medical device boot sequence with 20-year data retention guarantee. Use Value: Hardware ECC ensures bit-error-free boot execution; industrial temperature grade validates operation during extended thermal soak tests. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI020 | Same density and voltage, but 45-nm S-series with 90 ns tACC and no OTP array | Lacks SSR-based security features; not suitable for secure boot or calibration storage | Select when cost sensitivity outweighs need for OTP locking or ECC |
| MX29GL512FHI-10G | Micron equivalent with identical pinout and timing, but only 50,000 P/E cycles and no hardware ECC | Requires external error handling logic; limited to non-safety-critical firmware storage | Choose for legacy design migration where ECC is managed in software |
Compared with S29GL512S10TFI020 and MX29GL512FHI-10G, the S29GL512T10FHI033 uniquely combines hardware ECC, OTP-based security, and 100,000-cycle endurance - making it the only option qualified for ASIL-B boot paths and long-lifecycle industrial deployments.
Availability
S29GL512T10FHI033 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and network router boot image applications requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T10FHI033 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems requiring XIP-capable flash with enhanced data integrity, specifically designed for boot code storage in networking, industrial, and automotive applications.
FAQ
Is S29GL512T10FHI033 compatible with standard JEDEC parallel NOR flash interfaces?
Yes. It complies with JEDEC Standard JESD21-C for parallel NOR flash and implements the Common Flash Interface (CFI) specification. Its command set, status reporting (Status Register, Data Polling, RY/BY#), and timing parameters align with industry-standard boot loaders like U-Boot and Linux MTD drivers without modification.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is permanently locked at factory for secure key storage. SSR3 supports password-based read protection. SSR1 and SSR2 can be individually locked/unlocked via command to store calibration data or firmware signatures with controlled access.
Does this device support both ×8 and ×16 data bus configurations?
Yes. The device operates in ×16 mode by default, with DQ0–DQ15 active. When BYTE# is driven LOW, it switches to ×8 mode using only DQ0–DQ7. Address lines remain unchanged in both modes, and all commands function identically regardless of bus width selection.
How does the hardware ECC operate during read operations?
Hardware ECC runs transparently on every read access: the device computes a Hamming code over each 512-byte sector, detects single-bit errors, and corrects them before data is placed on the bus. No host intervention or additional timing overhead is required - correction occurs within the specified tACC window.
S29GL512T10FHI033 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL512T10FHI033 FAQ
1.How can I place an order for S29GL512T10FHI033 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10FHI033 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10FHI033 reliable?
The price and inventory of S29GL512T10FHI033 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10FHI033 is usually 5 days.
3.What payment methods are accepted for S29GL512T10FHI033?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10FHI033 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10FHI033?
S29GL512T10FHI033 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10FHI033 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10FHI033?
For technical support, including S29GL512T10FHI033 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10FHI033 requirements.
6.How does Aetrix verify that S29GL512T10FHI033 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10FHI033 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10FHI033 meets industry standards.
7.What is the process for return or replacement of S29GL512T10FHI033?
All S29GL512T10FHI033 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10FHI033, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10FHI033 part is unused and in its original packaging.
Return procedure for S29GL512T10FHI033:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T10FHI033 Tags
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M24C02-WMN6TP
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