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Infineon Technologies S29GL512T10GHI010
- Part No.:
- S29GL512T10GHI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-VFBGA
- Datasheet:
-
S29GL512T10GHI010.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,297
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Product details
Overview
S29GL512T10GHI010 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring deterministic XIP execution.
For engineers reviewing the S29GL512T10GHI010 datasheet, S29GL512T10GHI010 pinout, S29GL512T10GHI010 application, or S29GL512T10GHI010 equivalent, key selection criteria include asynchronous parallel interface timing, OTP array configuration, sector protection granularity, and AEC-Q100 grade compatibility for automotive control modules.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes program/erase operations autonomously without host CPU intervention. Its CFI-compliant interface enables plug-and-play detection in BIOS and bootloader environments, while the versatile I/O feature allows independent VIO supply (1.65 V to VCC) for mixed-voltage system interfacing.
The 512-byte programming buffer enables burst writes at up to 1.14 MBps across all supported temperature grades, and hardware ECC operates transparently during read cycles with no software overhead. Sector erase is uniform across 128-KB blocks, and suspend/resume capability permits interruptible background operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB), organized as 4,194,304 × 16-bit or 8,388,608 × 8-bit |
| Read access time (tACC) | 100 ns at –40°C to +85°C, enabling real-time XIP execution in microcontroller boot ROM |
| Page access time (tPACC) | 15 ns, supporting high-throughput sequential instruction fetch |
| Write buffer size | 512 bytes, allowing single-command programming of up to 256 words for reduced firmware update latency |
| ECC capability | Internal hardware single-bit error correction, eliminating need for external ECC logic in safety-critical systems |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention at +85°C, meeting industrial lifecycle requirements |
| Operating voltage | VCC = 2.7 V to 3.6 V; VIO = 1.65 V to VCC, enabling direct connection to 1.8 V/3.3 V SoC buses |
| Temperature grade | Industrial (–40°C to +85°C), qualified per JEDEC JESD22-A108, not AEC-Q100 |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb addressing in word mode (A0 ignored in byte mode) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; DQ0–DQ7 used in byte mode when BYTE# = LOW |
| CE# | Chip enable | Active-low chip select; device enters standby mode when CE# HIGH |
| OE# | Output enable | Active-low control for data output; enables read data on DQ pins during valid address window |
| WE# | Write enable | Active-low signal initiating write/program/erase commands; latches command sequences |
| RY/BY# | Ready/Busy indicator | Open-drain output; LOW during embedded operations, HIGH when ready for next command |
| BYTE# | Bus width select | LOW selects x8 mode (DQ0–DQ7 active); HIGH selects x16 mode (DQ0–DQ15 active) |
| RESET# | Hardware reset | Active-low input forcing device into reading state; clears status register and aborts ongoing operations |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous parallel interface | Eliminates clock routing complexity and timing skew concerns in MCU-based boot systems |
| 512-byte write buffer | Reduces firmware update time by 70% vs. single-word programming in typical 64 KB sector rewrites |
| Hardware ECC | Guarantees data integrity without CPU cycle consumption or external error-handling firmware |
| Uniform 128-KB sectors | Enables precise partitioning of boot loader, application, and configuration data with independent protection |
| OTP array (2048 B) | Provides secure storage for calibration data, MAC addresses, or cryptographic keys with four lockable regions |
Applications
| Industrial PLC Firmware Storage | Medical Imaging Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and real-time control algorithms in programmable logic controllers with deterministic startup timing. IC Role / Device Role / Timing Role: Primary non-volatile boot ROM accessed via parallel bus during cold start; supports XIP execution with ≤100 ns latency. Use Value: Eliminates external SRAM copy step and reduces boot time by enabling direct instruction fetch from flash. | Use Scenario: Holding diagnostic firmware and FPGA configuration bitstreams in portable ultrasound systems requiring field-upgradable code. IC Role / Device Role / Timing Role: Dual-role memory: stores boot image and retains critical calibration parameters in OTP region. Use Value: OTP lockability (SSR0 factory-locked, SSR3 password-protected) prevents unauthorized modification of medical device calibration data. |
| Automotive Body Control Module | Network Router Boot Flash |
Use Scenario: Hosting application firmware and vehicle-specific configuration tables in BCMs operating at ambient temperatures up to +85°C. IC Role / Device Role / Timing Role: Non-volatile storage for CAN-based firmware updates; uses suspend/resume to allow interruptible flash reprogramming during vehicle operation. Use Value: Sector-level erase and 100,000-cycle endurance support over-the-air (OTA) update cycles throughout 15-year vehicle lifespan. | Use Scenario: Storing U-Boot bootloader and Linux kernel images in carrier-grade edge routers requiring high reliability and fast reboot. IC Role / Device Role / Timing Role: Parallel NOR flash mapped directly into ARM Cortex-A processor address space for zero-latency boot vector fetch. Use Value: 15 ns page access time accelerates kernel decompression and initialization sequence compared to SPI NOR alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI010 | Same density and architecture but uses 64-ball LAE BGA (9 mm × 9 mm); lacks OTP array | Preferred for space-constrained designs where OTP functionality is unnecessary | Select when board area is critical and calibration data is stored elsewhere |
| MX29GL512FHT2I-90G | Macronix part with identical 512 Mb density, 90 ns tACC, but no hardware ECC or OTP array | Used in cost-sensitive networking equipment where external ECC is acceptable | Select only if system-level ECC implementation is already in place and OTP is unused |
Compared with S29GL512S10TFI010 and MX29GL512FHT2I-90G, the S29GL512T10GHI010 uniquely combines TSOP packaging, integrated ECC, and factory-lockable OTP-making it optimal for industrial boot applications demanding security, reliability, and legacy PCB compatibility.
Availability
S29GL512T10GHI010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical imaging boot memory, and automotive body control module designs requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T10GHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-T family targets embedded systems requiring high-reliability, parallel-interface NOR flash for boot code and firmware storage-optimized for XIP performance, long-term data retention, and industrial temperature operation.
FAQ
Does S29GL512T10GHI010 support both x8 and x16 data bus widths?
Yes. The BYTE# pin selects bus width: LOW enables x8 mode (DQ0–DQ7 active), HIGH enables x16 mode (DQ0–DQ15 active). Address lines A0–A21 remain fully functional in both modes, with A0 ignored in x8 mode per JEDEC standard.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is factory-locked and permanently read-only; SSR3 supports password-based read protection; SSR1 and SSR2 are user-lockable via command sequence. All are one-time programmable.
Can S29GL512T10GHI010 be used in automotive applications requiring AEC-Q100 qualification?
No. S29GL512T10GHI010 carries an industrial temperature grade (–40°C to +85°C) and is not AEC-Q100 qualified. For automotive use, Infineon offers the S29GL512T10GHI020 variant, which is AEC-Q100 Grade 3 qualified and shares identical electrical specs.
How does the hardware ECC operate during normal read cycles?
Hardware ECC runs transparently during every read access: single-bit errors are automatically corrected in real time, and the status register reports correction events via the ECCERR bit. No software intervention or additional read cycles are required-correction occurs within the same tACC timing window.
S29GL512T10GHI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-FBGA (9x7)
S29GL512T10GHI010 FAQ
1.How can I place an order for S29GL512T10GHI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10GHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10GHI010 reliable?
The price and inventory of S29GL512T10GHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10GHI010 is usually 5 days.
3.What payment methods are accepted for S29GL512T10GHI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10GHI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10GHI010?
S29GL512T10GHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10GHI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10GHI010?
For technical support, including S29GL512T10GHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10GHI010 requirements.
6.How does Aetrix verify that S29GL512T10GHI010 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10GHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10GHI010 meets industry standards.
7.What is the process for return or replacement of S29GL512T10GHI010?
All S29GL512T10GHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10GHI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10GHI010 part is unused and in its original packaging.
Return procedure for S29GL512T10GHI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T10GHI010 Tags
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